Circuit Board Repair Guide > Soldering > 7.2.1 Soldering Through Hole Components Using a Point to Point Soldering Method

Soldering Through Hole Components Using a Point to Point Soldering Method

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This procedure covers the general guidelines for soldering through hole components using a point to point soldering method. There is basically only one style of through hole component. Whether there are a few leads or many or whether the component is large or small the soldering principles are the same.

Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
CTC 7.1.1 Quality Soldering Basics
CTC 7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering and
Component Removal
CTC 7.1.3 Solder Joint Acceptability Criteria for Various Component Types
IPC7721 7.2.1 Soldering Through Hole Components, Point To Point Method

Tools and Materials
Cleaner
Flux
Microscope      
Soldering Station
Solder
Wipes
 
Through hole component
Through Hole Component

7.2.1 Soldering Through Hole Components, Point To Point Method

Printed Board Type: R/F/W/C  |  Skill Level: Intermediate  |  Conformance Level: Medium  |  Rev.: D  |  Date: Jul 7, 2000

Make a solder bridge

Figure 1: Apply solder at the junction
of soldering iron tip and lead to make
a solder bridge.
1. 
If needed, form the component and clean the area.
 
2. 
Insert the component into the plated hole. If needed, secure in place by bending leads or other mechanical means.
   
3.  If needed, apply liquid flux to the plated holes and pads.
   
4. 
Place the soldering iron tip at the junction between the pad and component lead. Apply a small amount of solder at the junction of soldering iron tip and lead to make a solder bridge. (See Figure 1).
   
 
Note
The size of the solder is important when soldering small components. If the solder is too large, it is easy to melt too much solder into the joint. If the solder is too small, it can take too long to melt the optimum amount into the joint.
   
  Caution
A
void exerting any pressure on the pad.
   
Feed solder into joint until proper fillet achieved

Figure 2: Feed solder into the joint
from the side opposite from the iron
tip until the proper fillet is achieved.
5. 
Immediately feed solder into the joint from the side opposite from the soldering iron tip until the proper fillet is achieved. Remove the solder then remove the iron. The iron may be swept over the end of the component lead to cover it with solder. (See Figure 2).
   
 
Note
Apply the solder to the side opposite from the soldering iron tip so that the work surfaces and not the iron will melt the solder.
   
6. 
On multiple lead components solder the opposite corners first to stabilize the component. Follow by soldering the remaining leads in a random pattern to reduce excessive heat buildup in one area.
   
7.  Clean the flux residue, if required and inspect.
 




Links to Related Products


Prototyping Boards for Through Hole and SMT Components  
Prototyping Boards for Through Hole and SMT Components
These Schmartboard prototyping boards support through hole and surface mount components. This is the fastest and easiest electronic circuit prototyping system ever conceived.

The SchmartBoard|ez products are for people who may not have advanced soldering skills, first-timers, or just anyone who wants to have a fast, easy, and hassle-free experience.



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