Circuit Board Repair Guide > Soldering

Chapter 7 - Soldering Procedures

This chapter of the circuit board repair includes procedures for soldering a variety of component types including chip components, J lead components and gull wing components.


Quality soldering basicspad CTC 7.1.1 Quality Soldering Basics
This procedure covers the basic concepts for high quality soldering.

Preparing for soldering and component removalpad CTC 7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering and Component Removal
This procedure covers the basic concepts for preparing circuit boards and soldering tools for soldering and component removal.

Solder joint acceptance criteria for componentspad CTC 7.1.3 Solder Joint Acceptability Criteria for Various Component Types
This document includes figures and tables for solder joint acceptability criteria on a variety of component types.

Through hole component solderingpad CTC 7.2.1 Soldering Through Hole Components Using a Point to Point Soldering Method
This procedure covers the general guidelines for soldering through hole components using a point to point soldering method.

Soldering using solder fountain systempad CTC 7.2.2 Through Hole Component Soldering Using a Solder Fountain System
This procedure covers the general guidelines for through hole component soldering using a solder fountain system.

Soldering of surface mount chip componentspad CTC 7.3.1 Point to Point Soldering of Surface Mount Chip Components
This procedure covers the general guidelines for point to point soldering of surface mount chip components.

Hot gas soldering of surface mount chip componentspad CTC 7.3.2 Hot Gas Soldering of Surface Mount Chip Components
This procedure covers the general guidelines for hot gas soldering of surface mount chip components.

Soldering surface mount J lead componentspad CTC 7.4.1 Point to Point Soldering of Surface Mount J Lead Components
This procedure covers the general guidelines for point to point soldering of surface mount J lead components.

Continuous flow soldering of J lead componentspad CTC 7.4.2 Continuous Flow Soldering of Surface Mount J Lead Components
This procedure covers the general guidelines for continuous flow soldering of surface mount J lead components.

Hot gas soldering of J lead componentspad CTC 7.4.3 Soldering Surface Mount J lead Components Using Hot Gas
This procedure covers the general guidelines for soldering surface mount J lead components using hot gas.

Soldering gull wing componentspad CTC 7.5.1 Point to Point Soldering of Surface Mount Gull Wing Components
This procedure covers the general guidelines for point to point soldering of surface mount gull wing components.

Continuous flow soldering of gull wing componentspad CTC 7.5.2 Continuous Flow Soldering of Surface Mount Gull Wing Components
This procedure covers the general guidelines for continuous flow soldering of surface mount gull wing components.

Hot gas soldering of gull wing componentspad CTC 7.5.3 Soldering Surface Mount Gull Wing Components Using Hot Gas
This procedure covers the general guidelines for soldering surface mount gull wing components using hot gas.



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Soldering