| Circuit Board Repair and Rework Guide > 7.0 Soldering Procedures |
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7.0 Soldering Procedures
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| 7.1.1 Soldering Basics Covers the basic concepts for quality soldering. | |
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| 7.1.2 Preparation For Soldering And Component Removal Covers preparing steps before soldering and rework. | |
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| 7.1.3 Solder Joint Acceptance Criteria Document includes figures and tables for solder joint acceptability criteria based on IPC standards. | |
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| 7.2.1 Soldering Through Hole Components, Point To Point Method Covers point to point through hole soldering. | |
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| 7.2.2 Soldering Through Hole Components, Solder Fountain Covers through hole fountain soldering. | |
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| 7.3.1 Soldering Surface Mount Chip Components, Point To Point Method Covers point to point soldering of chip components. | |
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| 7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Covers hot gas soldering of chip components. | |
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| 7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method This procedure covers the general guidelines for soldering surface mount J lead components. | |
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| 7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method This procedure covers the general guidelines for soldering surface mount J lead components. | |
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| 7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method This procedure covers the general guidelines for soldering surface mount J lead components. | |
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| 7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method This procedure covers the general guidelines for soldering surface mount gull wing components. | |
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| 7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method This procedure covers the general guidelines for soldering surface mount gull wing components. | |
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| 7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method This procedure covers the general guidelines for soldering surface mount gull wing components. | |
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| Related Items Circuit Board Repair and Rework Products |
7.0 Soldering Procedures |
