7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method
| Printed Board Type: R/F/C | Skill Level: Intermediate | Conformance Level: High | Rev.: D | Rev. Date: Jul 7, 2000 |
|
Outline
This procedure covers the general guidelines for soldering
surface mount J lead components. There is basically
only one style of J lead component. Whether leads are
on two sides or four sides, or whether the component
is large or small, the soldering principles are the
same.
|
Acceptability
References |
| IPC-A-610 |
12.0 |
Surface Mount Assemblies |
|
|
Surface Mount J Lead Component |
Procedure
Figure 1: Place component and
check alignment.
|
| 1.
|
Add liquid flux to the corner pads. |
| |
| 2. |
Place the component in position and hold it
steady. The leads must be aligned with the pads.
On large components this is best done by aligning
the leads on opposite corners. (See Figure 1).
|
|
Figure 2: Place the soldering iron tip
at the junction between the pad and component lead.
Figure 3:
A - Dot indicates pin 1.
B - Indicates pin 5.
C - Indicates direction of pin count. |
| 3.
|
Place the soldering iron tip at the junction
between the pad and component lead at one of
the corners. Apply additional solder as needed.
(See Figure 2).
|
| |
|
| 4. |
Remove the tip. Wait a moment for the solder
to solidify before soldering the opposite corner.
|
| |
|
| 5. |
After the opposite corner is soldered,
solder the remaining leads. |
| |
|
| 6. |
Clean, if required and inspect. |
| |
