Circuit Board Repair Guide > Soldering > 7.4.1 Point to Point Soldering of Surface Mount J Lead Components

Point to Point Soldering of Surface Mount J Lead Components

Repair Circuit Boards | Repair SMT Pads | Repair BGA Pads | Repair Lands | Repair Edge Contacts
Repair a Conductor | Plated Hole Repair | Base Board Repair | Replace Solder Mask or Coatings

This procedure covers the general guidelines for point to point soldering of surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

IPC Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies

Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
CTC 7.1.1 Quality Soldering Basics
CTC 7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering and
Component Removal
CTC 7.1.3 Solder Joint Acceptability Criteria for Various Component Types
IPC7711 5.6.2 Point-To-Point Method

Tools and Materials
Cleaner
Flux
Microscope
Solder
Soldering Station
Wipes
 
Surface mount J lead component soldered onto circuit board
Surface Mount J Lead Component

7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method

Printed Board Type: R/F/C  |  Skill Level: Intermediate  |  Conformance Level: High  |  Rev.: D  |  Rev. Date: Jul 7, 2000

Place component.

Figure 1: Place component and
check alignment.


1.   Add liquid flux to the corner pads.
 
2.
Place the component in position and hold it steady. The leads must be aligned with the pads. On large components this is best done by aligning the leads on opposite corners. (See Figure 1).
Place soldering iron tip

Figure 2: Place the soldering iron tip
at the junction between the pad and component lead.


A - Dot indicates pin 1

Figure 3:
A - Dot indicates pin 1.
B - Indicates pin 5.
C - Indicates direction of pin count.
3.  
Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed. (See Figure 2).
   
4.
Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.
   
5. After the opposite corner is soldered, solder the remaining leads.
   
6. Clean, if required and inspect.




Links to Related Products


Prototyping Boards for Through Hole and SMT Components  
Prototyping Boards for Through Hole and SMT Components
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