Circuit Board Repair Guide > Soldering > 7.4.3 Soldering Surface Mount J lead Components Using Hot Gas

Soldering Surface Mount J lead Components Using Hot Gas

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Repair a Conductor | Plated Hole Repair | Base Board Repair | Replace Solder Mask or Coatings

This procedure covers the general guidelines for soldering surface mount J lead components using hot gas. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

IPC Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies

Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
CTC 7.1.1 Quality Soldering Basics
CTC 7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering and
Component Removal
CTC 7.1.3 Solder Joint Acceptability Criteria for Various Component Types
IPC7711 5.6.3 Solder Paste Method/Hot Air Pencil

Tools and Materials
Cleaner
Flux
Hot Air Tool with Tips      
Microscope
Solder Paste
Wipes
 
Surface mount J lead component soldered onto circuit board
Surface Mount J Lead Component

7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method

Printed Board Type: R/F/C  |  Skill Level: Intermediate  |  Conformance Level: High  |  Rev.: D  |  Rev. Date: Jul 7, 2000

Add solder paste along pads

Figure 1: Add a small bead of solder paste along the row of pads.


1.   Add a small bead of solder paste along the row of pads. (See Figure 1).
 
2. Place the component in position.
   
3. Adjust the pressure and temperature output of the hot air tool.
   
4.
Direct the hot air over the component with the hot air tool tip approximately 2.50 cm (1.00") from the solder joint. This initial heating will pre-dry the solder paste.
   
  Note
Solder paste has a dull flat appearance when dried.
Heat solder joints until solder melt observed

Figure 2: Move the tool back and forth
to heat all the solder joints until complete solder melt is observed.


A - Dot indicates pin 1

Figure: 3
A - Dot indicates pin 1
B - Indicates pin 5
C - Indicates direction of pin count.
5.  
When the solder paste has dried, move the hot air tool tip to approximately 0.50 cm (0.20") above the component. Move the tool back and forth to heat all the solder joints until complete solder melt is observed. (See Figure 2).
   
6. Remove the tool. Wait a moment for the solder to solidify.
   
7. Clean, if required and inspect.




Links to Related Products


Prototyping Boards for Through Hole and SMT Components  
Prototyping Boards for Through Hole and SMT Components
These Schmartboard prototyping boards support through hole and surface mount components. This is the fastest and easiest electronic circuit prototyping system ever conceived.

The SchmartBoard|ez products are for people who may not have advanced soldering skills, first-timers, or just anyone who wants to have a fast, easy, and hassle-free experience.



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