7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method
| Printed Board Type: R/F/C | Skill Level: Intermediate | Conformance Level: High | Rev.: D | Rev. Date: Jul 7, 2000 |
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Outline
This procedure covers the general guidelines for soldering
surface mount J lead components. There is basically
only one style of J lead component. Whether leads are
on two sides or four sides, or whether the component
is large or small, the soldering principles are the
same.
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Acceptability
References |
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IPC-A-610 |
12.0 |
Surface Mount Assemblies |
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Surface Mount J Lead Component |
Procedure
Figure 1: Add a small bead of solder paste along the row of pads.
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| 1.
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Add a small bead of solder paste
along the row of pads. (See Figure 1). |
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| 2. |
Place the component in position. |
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| 3. |
Adjust the pressure and temperature
output of the hot air tool. |
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| 4. |
Direct the hot air over the component with the
hot air tool tip approximately 2.50 cm (1.00")
from the solder joint. This initial heating
will pre-dry the solder paste.
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Note
Solder paste has a dull flat appearance when dried.
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Figure 2: Move the tool back and forth
to heat all the solder joints until complete solder melt is observed.
Figure: 3
A - Dot indicates pin 1
B - Indicates pin 5
C - Indicates direction of pin count. |
| 5.
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When the solder paste has dried, move the hot
air tool tip to approximately 0.50 cm (0.20")
above the component. Move the tool back and
forth to heat all the solder joints until complete
solder melt is observed. (See Figure 2).
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| 6. |
Remove the tool. Wait a moment
for the solder to solidify. |
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| 7. |
Clean, if required and inspect. | | |
