Circuit Board Repair and Rework Guide > 7.0 Soldering Procedures > 7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method

7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method

Printed Board Type: R/F/C
Skill Level: Intermediate
Conformance Level: High
Revision: D
Revision Date: Jul 7, 2000

Outline

This procedure covers the general guidelines for soldering surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies
  Surface Mount J Lead Component Figure
Surface Mount J Lead Component

Procedure References
CTC 1.0 Foreword
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 Cleaning, Local
CTC 2.2.2 Cleaning, Aqueous Batch Process
CTC 2.5 Baking and Preheating
CTC 7.1.1 Soldering Basics
CTC 7.1.2 Preparation For Soldering And Component Removal
CTC 7.1.3 Solder Joint Acceptability Criteria
IPC7711 5.6.4 Multi-Lead Method

Tools and Materials
Cleaner
Flux
Microscope
Solder
Soldering Iron with Tips
Wipes

Procedure

Place component and check alignment.

Figure 1: Place component and
check alignment.


1.       Add liquid flux to the corner pads.
 
2.
Place the component in position and hold it steady. The leads must be aligned with the pads. On large components this is best done by aligning the leads on opposite corners. (See Figure 1).
   
3.
Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed.
   
4.
Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.
Apply solder to continuous flow solder tip to create a convex bead of molten solder.

Figure 2: Apply solder to the
continuous flow solder tip to create
a convex bead of molten solder.


5.      
Apply solder to the continuous flow solder tip to create a convex bead of molten solder on the tip. (See Figure 2).

Slowly move tip over row of leads to form proper solder fillets at each joint.

Figure 3: Slowly move the tip over the
row of leads to form proper solder
fillets at each joint.


6.      
Position the solder tip so that the solder bead contacts the vertical portion of the J leads. Slowly move the tip over the row of leads to form proper solder fillets at each joint. (See Figure 3).

A - Dot indicates pin 1 B - Indicates pin 5 c - Indicates direction of pin count.

Figure 4:
A - Dot indicates pin 1
B - Indicates pin 5
C - Indicates direction of pin count.
7.       Repeat steps 5 and 6 for the remaining sides.
   
8. Clean, if required and inspect.



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7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method