Circuit Board Repair Guide > Soldering > 7.4.2 Continuous Flow Soldering of Surface Mount J Lead Components

Continuous Flow Soldering of Surface Mount J Lead Components

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This procedure covers the general guidelines for continuous flow soldering of surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

IPC Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies

Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
CTC 7.1.1 Quality Soldering Basics
CTC 7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering and
Component Removal
CTC 7.1.3 Solder Joint Acceptability Criteria for Various Component Types
IPC7711 5.6.4 Multi-Lead Method

Tools and Materials
Cleaner
Flux
Microscope      
Solder
Soldering Station
Wipes
 
Surface mount J lead component soldered onto board
Surface Mount J Lead Component

7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method

Printed Board Type: R/F/C  |  Skill Level: Intermediate  |  Conformance Level: High  |  Rev.: D  |  Rev. Date: Jul 7, 2000

Place component and check alignment

Figure 1: Place component and
check alignment.


1.   Add liquid flux to the corner pads.
 
2.
Place the component in position and hold it steady. The leads must be aligned with the pads. On large components this is best done by aligning the leads on opposite corners. (See Figure 1).
   
3.
Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed.
   
4.
Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.
Apply solder to continuous flow solder tip

Figure 2: Apply solder to the
continuous flow solder tip to create
a convex bead of molten solder.


5.  
Apply solder to the continuous flow solder tip to create a convex bead of molten solder on the tip. (See Figure 2).

Form solder fillets at each joint

Figure 3: Slowly move the tip over the
row of leads to form proper solder
fillets at each joint.


6.  
Position the solder tip so that the solder bead contacts the vertical portion of the J leads. Slowly move the tip over the row of leads to form proper solder fillets at each joint. (See Figure 3).
   
7.   Repeat steps 5 and 6 for the remaining sides.
   
8. Clean, if required and inspect.

A - Dot indicates pin 1.

Figure 4:
A - Dot indicates pin 1
B - Indicates pin 5
C - Indicates direction of pin count.




Links to Related Products


Prototyping Boards for Through Hole and SMT Components  
Prototyping Boards for Through Hole and SMT Components
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