Circuit Board Repair Guide > Soldering > 7.3.1 Point to Point Soldering of Surface Mount Chip Components

Point to Point Soldering of Surface Mount Chip Components

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This procedure covers the general guidelines for point to point soldering of surface mount chip components. The following surface mount chip components are covered by this procedure. While all of these components are different, the techniques for soldering are relatively similar.

Chip Resistors
The component body of chip resistors is made out of alumna; an extremely hard, white colored material. The resistive material is normally located on the top. Chip resistors are usually mounted with the resistive element facing upwards to help dissipate heat.

Ceramic Capacitors
These components are constructed from several layers of ceramic with internal metallized layers. Because metal heats up much faster than ceramic, ceramic capacitors need to be heated slowly to avoid internal separations between the ceramic and the metal layers. Internal damage will not generally be visible, since any cracks will be inside the ceramic body of the component.

Note
Avoid rapid heating of ceramic chip capacitors during soldering operations.
 
Surface mount chip component soldered onto circuit board
Surface Mount Chip Component

Chip Capacitors generally have solid color bodies
Chip Capacitors generally
have solid color bodies.

Plastic Body
Another style of chip component has a molded plastic body that protects the internal circuitry. There are a number of different types of components that share this type of exterior package. The termination styles for plastic chip component packages vary considerably.

MELF
MELF - Metal Electrode Face cylindrical components. These may be capacitors, resistors, and diodes. It can be hard to tell them apart - since there is no universal coloring or component designators printed on the component bodies.

IPC Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies
 
Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
CTC 7.1.1 Quality Soldering Basics
CTC 7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering and Component Removal
CTC 7.1.3 Solder Joint Acceptability Criteria for Various Component Types
IPC7711 5.3.1 Solder Paste Method

Tools and Materials
Cleaner
Flux
Microscope
Solder
Soldering Station
Wipes

7.3.1 Soldering Surface Mount Chip Components, Point To Point Method

Printed Board Type: R/F/W/C  |  Skill Level: Intermediate  |  Conformance Level: High  |  Rev.: D  |  Rev. Date: Jul 7, 2000

Pre-fill one pad with solder

Figure 1: Pre-fill one pad with solder.


1.   Add liquid flux to one pad.
 
2. Pre-fill one pad with solder. (See Figure 1).
   
3. Clean the area.
   
4. Add liquid flux to both pads.
Soldering iron tip between pre-filled pad and component

Figure 2: Place the soldering iron tip
at the junction between the pre-filled
pad and component lead.


5.  
Place the component in position and hold it steady with a wooden stick or tweezers so that the soldering iron won't push the component out of alignment.
   
6.
Place the soldering iron tip at the junction between the pre-filled pad and component lead. Flow the solder until the component drops down and is soldered in position. Apply additional solder as needed. (See Figure 2).

Solder opposite side of component

Figure 3: Solder the other opposite
side of the component.
7.  
Remove the tip. Wait a moment for the solder to solidify before soldering the other side of the component. (See Figure 3).
   
8. Clean, if required and inspect.




Links to Related Products


Prototyping Boards for Through Hole and SMT Components  
Prototyping Boards for Through Hole and SMT Components
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