Surface Mount Technology Design and Manufacturing Books > Performing Rework and Repair on SMT, Fine Pitch, and BGAs

Performing Rework and Repair on SMT, Fine Pitch, and BGAs

Performing repair/rework on today's assemblies requires a combination of good tools, good vision, good dexterity, and a new level of knowledge about techniques. For soldering tools there are a level of knowledge about techniques. For soldering tools there is a number of solutions available on the market to do almost any task. Learning how to use the new tools, learning new techniques, and working smarter are constant challenges. It is our intent in this book to bring to you the knowledge about types of tools and the most advanced techniques known today.

The information compiled to put into this book comes from a variety of sources. A lot of information comes from users, such as yourselves, sharing new advanced ways of doing things, from personal experience, and from doing research in this area. Tools and techniques must be practical for us to want to use them. In some cases we will show you methods and explain alternatives.

Going from leaded or through-hole parts to SMT is quite a change. There are changes in the soldering irons, tips shapes, temperature settings, methods, time allowed to do tasks, how to use each tip shape, and how to plan your rework/repair.

First, before you start doing SMT soldering, it is highly recommended that you have a set of workmanship standards for SMT and have read through them. You must know whether a solder joint or component's positioning on the board is acceptable or not before soldering.

The fifth edition includes new information on the soldering process, soldering temperature, different flux types and interactions, cleanliness, standards, tools, soldering irons, soldering tips, budget planning, techniques, temperature settings, hot air settings, sockets, connectors and repairing lifted lands.

This book is a must for anyone new or experienced in repairing SMT assemblies, to learn how to become more efficient by doing what others have known, but wouldn't show you before now. Table of Contents.

Table of Contents

1 - Introduction to SMT and Soldering

What Do We Know About PC Board's?
Industry Specifications and Standards
What Do We Know About Soldering?
Temperature Conversions
What is Thermal Energy?
Soldering Action
Intermetallic Bonds and Copper
What Effects Do Power and Ground Planes Have?

2 - SMT Components

Chip Components
SMT Ceramic Chip Resistor Components
SMT MELF Components
SMT SOT Components
SMT SO, SOIC and TSOP Components
SOJ Packages
PLCC Components
Quad Flat Packages (QFP)
SMT Sockets
BGA Packages
Handling and Preparation

3 - SMT Assembly

Solder Types
Soldering Terminology
Fluxes
Cleanliness Testing
Non-Conductive Epoxy and Wave Soldering
Assembly Classifications
SMT Assembly Steps

4 - Workmanship Standards and Inspection

SMT Workmanship Standards
Inspection Methods and Tools

5 - Hand Tools and Supplies

Hand Tools
Supplies and Chemicals
Cleaning Solutions

6 - Soldering Systems

Adjustable Temperature Soldering Irons
Programmable Soldering Irons
Fixed Temperature Soldering Irons

7 - Soldering Tips and Techniques

Soldering Temperatures
Soldering Technique Requirements
Soldering Tip Shapes and Uses
Conical Tips
Hoof Tip
Blade and Chisel Tips
Slot Tips
Tunnel Tips
Quad Tips
Flat Blade Tips
Multiple Tip Irons
Tip Preference List for Soldering
Tip Preference List for Desoldering

8 - BGA and Hot Air Tools

Types of BGA Packages and Leads
Types of Tools for BGA's
Soldering BGA's
BGA Removal Process
Recycling Used BGA's
Hot Air Systems for Removal

9 - PCB Board Repair

Repairing Minor Broken Traces
Repairing Major Trace Breaks
Opening or Breaking Trace Connections
Altering Connections to Components
Adding Components
Engineering Prototype Repairs and Rework
Lifted Land or Pad Repair

10 - Preparing for Building Prototypes

Component Preparation
Component Handling
Prototype Assembly Options

Price: $99.95
Author: J.C. Blankenhorn
Printed: August 1996
ISBN: 1-882812-17-4
Pages: 176 pages 8.5" x 11"

Author: James C. Blankenhorn

James C. Blankenhorn is President and founder (1985) of SMT Plus Inc., located in Scotts Valley, California. His experience in SMT began as Vice President of Design and Prototyping for AWI, the first SMT subcontract design and assembly firm for SMT from 1983-1985. His work established many of the design guidelines and processes used in the SMT industry today. Mr. Blankenhorn sold the design and assembly operations to and was General Manager and Vice President of Design for Jabil Circuit from 1988-1991, setting up multiple design centers and managing prototype assembly. Mr. Blankenhorn returned to SMT Plus to direct its activities. Having identified the growing needs of industry for education, SMT Plus has emerged since 1996 as a leader in the production of advanced multimedia technical training products and development tools for the SMT and telecommunications industries. Prior to his involvement with SMT, Mr. Blankenhorn was a MOS designer for Motorola and TI and product line manager for memory and microprocessors for Honeywell for 8 years. For 3 years thereafter he was involved in startups in IC packaging, test and burn-in as General Manager for Test International and Vice President of Sales for IC Link.

Mr. Blankenhorn is an active member of the SMTA, a co-founder of the SMTA in 1984, recipient of the 1996 Founders Award for Distinguished Service, and served twice as technical chairman for the Silicon Valley SMTA chapter. He is a speaker at conferences worldwide and has authored over twenty books on SMT design, packaging, and processing. He holds a BSEE degree from Arizona State University and is listed in Who's Who in America.