SMT High Density Design and DFM

SMT is becoming the dominant technology for the designing of modern day electronic products. With smaller packages, automated assembly, lower parasitics and improvement in electrical performance, many of today's products could not be produced without the use of SMT. Introducing SMT can be accomplished easily by learning where the pitfalls and issues are before you begin designing. Thereby avoiding the costly redesigns and escalated production costs to fix avoidable defects.

This one-day course is invaluable to SMT design and manufacturing. It will save countless hours by providing an understanding of what is critical and what the proper steps are to designing for assembly of successful products.

This onsite SMT training course can be held at your facility. Minimum class size is 5 to 10 students. Please email us or call 519-260-0596 to request a quotation.

Who Would Benefit

The course has proven to be of immense value to design, manufacturing and process engineers, project engineers, purchasing, quality and test engineers.

Course Materials  * Please note you are not required to enroll in the onsite course to purchase this book.

SMT High Density Design and DFM  in stock  US $299.95     ^{View cart}

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Course Outline

Introduction

There are new steps and standards required when designing using SMT. All the new requirements and steps must be understood to emphasize how easy it is to design and have manufacturing problems. Items discussed include:

• Terms
• Goals
• Purpose
• Dimensions
• Documents
• Design Flow Steps

Design Project Objectives

Key to successful designing is fully understanding all the needs and requirements of each design and discussing it with manufacturing. Information will include:

• Type I, II, III Assembly Processes
• Project Information Required
• Documentation
• Specifications
• Test Needs
• Fabrication
• Design Goals

Rules for Designing

The successful design is a design that goes through manufacturing with the least amount of problems and defects. In this module information helps to learn what is required to accomplish this.

• Mechanical Specs
• Tooling Holes
• Fiducials
• Panelizing
• Depanelizing
• Stencils
• Assembly Equipment
• Tape and Reels

CAE Requirements

When using SMT there are numerous options in how to design a product. But when designing a keen understanding of the impact on manufacturing is required. A lot of it starts right during the development of the schematic. Topics include:

• Essential Design Requirements for Library Standardization
• Test Requirements
• Unique SMT Packages
• Down-Loading CAE to CAD and Common Problems in Data Files

Land Pattern Rules

At the heart of the design are the land patterns used. Information explains:

• How to create land patterns and how they will act during the manufacturing assembly and reflow processes.
• Some pattern modifications will be discussed such as for wave soldering and no-clean fluxes.
• Pattern creation will be presented for gullwing, J lead, cylindrical, chip components, BGA and butt leads.

CAD System

The proper setup of a CAD system in the beginning to accommodate the needs of the design density and manufacturing are vital. Topics include:

• Part Centroids
• Orientation
• Silk Screens
• Stringers
• Apertures
• Gerber Outputting

Design For Testability

There are many test requirements for modern complex assemblies such as:

• Schematics and Bare Board Test
• In-circuit Test
• Bar Codes
• Edge Connectors
• Bench Level Testing
• Using Headers

Component Placement and Orientation

The density and yields are directly affected by patterns, placement and orientation. Topics covered:

• Guidelines Orientation
• Standard Density Placement Guidelines
• High Density Guidelines
• Ultra High Density Placement Guidelines
• Guidelines for design and placing Parts on the Wave Solder Side of Assemblies
• Fine Pitch Parts
• Using Sockets

Design Routing Rules and Guidelines

Trace routing density is going up sharply particularly with higher density packages and double-side mounted boards. Items discussed:

• The typical problems of routing are presented for outer and inner layers
• Proper connection to lands, using solder paste to fill holes
• Using holes in lands
• Fine Pitch package routing
• Copper thieving

PC Fabrication

There are many items critical in a design that affect the cost and ability to fabricate a design. Information presented is:

• Solder Mask Types and Clearances
• OSP coating
• Warpage Causes
• Plating Types
• Vias and Pad Sizes
• Layer Stacking Fiducial Specs
• Fabrication Panels and Materials

Documentation

Giving clear instruction for fabrication and assembly can avoid many costly mistakes. Information includes:

• Manufacturing
• Test
• Fabrication Notes and Drawings
• Sub-panels
• Films and UL Requirements

Instructor: James C. Blankenhorn

Onsite Training Costs

The cost for performing an onsite course is separated into three items, all prices are approximate and in US funds:

• Instruction Fee is $1500 to $3000 per day depending upon the topic and your location.
  
  Student materials are quoted:
  
  
• Book materials range from $75 to $300 depending upon the course.
• CD-ROM materials range from $485 to $995 depending on the course.

Onsite Quotes Provided

Contact us and receive a quotation and details for any course you would like to have. There is no obligation.

You may also contact us by phone 519-260-0596 or fax 519-260-0597.