Using Solder Paste for Leaded Parts in SMT Assemblies
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Using solder paste to build SMT assemblies that have leaded components is not something new. By using this technique you may find, as others have, that there are several advantages. Using solder paste for leaded components can simplify the design, improve component density, simplify the process, eliminate equipment, lower manufacturing costs and improve the quality and reliability of the finished product.
To implement using solder paste for leaded components, it begins with the design. It is possible for many older designs to be adapted to this process. But, having the information in this manual for use on new designs will make the transfer to manufacturing a lot easier than trying to retrofit the design to the process.
Using solder paste to its full advantage we can fill vias that are exposed. The vias may be test pads with open vias or plated holes that have leads of components protruding through them. |
For a complex, high density double-side mounted assembly, this process
can have a significant impact. By elimination of wave soldering, we have
many advantages. The component density can be much higher using solder
paste. The component limitations of the types of components that we put
on the wave solder side of the board are enhanced by using solder paste.
Included with this book is a floppy disk that operates using the latest
Excel programs to assist in calculations necessary to apply to your designs.
Price: $99.95
Author: James C. Blankenhorn
Printed: 1995
ISBN: 1-882812-01-8
Soft cover - 107 pages + floppy
(small booklet, single sheet print) |
Author: James C. Blankenhorn James C. Blankenhorn is President and founder (1985) of SMT Plus Inc., located in Scotts Valley, California. His experience in SMT began as Vice President of Design and Prototyping for AWI, the first SMT subcontract design and assembly firm for SMT from 1983-1985. His work established many of the design guidelines and processes used in the SMT industry today. Mr. Blankenhorn sold the design and assembly operations to and was General Manager and Vice President of Design for Jabil Circuit from 1988-1991, setting up multiple design centers and managing prototype assembly. Mr. Blankenhorn returned to SMT Plus to direct its activities. Having identified the growing needs of industry for education, SMT Plus has emerged since 1996 as a leader in the production of advanced multimedia technical training products and development tools for the SMT and telecommunications industries. Prior to his involvement with SMT, Mr. Blankenhorn was a MOS designer for Motorola and TI and product line manager for memory and microprocessors for Honeywell for 8 years. For 3 years thereafter he was involved in startups in IC packaging, test and burn-in as General Manager for Test International and Vice President of Sales for IC Link.
Mr. Blankenhorn is an active member of the SMTA, a co-founder of the SMTA in 1984, recipient of the 1996 Founders Award for Distinguished Service, and served twice as technical chairman for the Silicon Valley SMTA chapter. He is a speaker at conferences worldwide and has authored over twenty books on SMT design, packaging, and processing. He holds a BSEE degree from Arizona State University and is listed in Who's Who in America.
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