Circuit Board Repair Guide > Rework Procedures

Chapter 8 - Rework Procedures

This chapter of the circuit board repair guide includes procedures for removing a variety of component types including chip components, J lead components, and gull wing components.


		CTC 8.1.1 Component Removal, Through Hole Components, Vacuum Method This procedure covers the general guidelines for through hole component removal using a powered vacuum desoldering tool.


		CTC 8.1.2 Component Removal, Through Hole Components, Solder Fountain Method This procedure covers the general guidelines for through hole component removal using a solder fountain system.


		CTC 8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method This procedure covers the forked tip method for chip component removal.


		CTC 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method This procedure covers the hot tweezer method for chip component removal.


		CTC 8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method This procedure covers the contact method of J lead component removal.


		CTC 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas / Air Method This procedure covers the convection method of J lead component removal.


		CTC 8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method This procedure covers the contact method of gull wing component removal.


		CTC 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas / Air Method This procedure covers the convection method of gull wing component removal.