8.0 Rework Procedures

This section includes procedures for removing a variety of component types including chip components, J lead components, and gull wing components.


		8.1.1 Component Removal, Through Hole Components, Vacuum Method Covers through hole powered vacuum desoldering.


		8.1.2 Component Removal, Through Hole Components, Solder Fountain Method Covers through hole removal using solder fountain.


		8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method Forked tip method for chip component removal.


		8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method Hot tweezer method for chip component removal.


		8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method Contact method of J lead component removal.


		8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method Convection method of J lead component removal.


		8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method Contact method of gull wing component removal.


		8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method Convection method of gull wing component removal.

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