Surface Mount Technology Design and Manufacturing Books > Putting Buried Resistors into Your Printed Circuit Board

Putting Buried Resistors into Your Printed Circuit Board

The ever increasing density and performance of today's electronic products are requiring new solutions. Amongst the solutions is to use resistors integrated into the printed circuit board. Using integrated resistors offers to the designer the choice of designing a resistor either on the surface or buried internally within the layers of a printed circuit board. The resultant resistor is very thin and flat, and what we call planar. This entire approach transforms a typical printed board from being strictly attachment and interconnect medium to containing integral resistors. Using buried resistors is not something new or has been just developed. The technology was first developed in 1972. The origin of these types of resistors can be traced back to the hybrid circuit industry. Since the time of the development of planar buried resistors they have been used to solve engineering problems on designs, particularly for high speed circuitry, such as ECL and GaAs, and now for high-density TTL/CMOS products such as the Pentium 4 by Intel where there are a high concentration of resistors and precious little real estate.

Who will benefit

This book will be of immense value to both circuit designers as well as CAD designers, and those involved in product testing, fabrication, troubleshooting and debug of high-speed products. Table of Contents.

Table of Contents

Chapter 1 - Introduction to Buried Resistors

Introduction
Advantages

Chapter 2 - Applications for Buried Resistors

Uses of Planar Resistor Technology
Examples of Uses

Chapter 3 - Material Process and Characteristics

Setup Considerations
Material Construction
Sheet Resistance
Resistor Conductor Material Electrical Specifications
Temperature Effects
Power Dissipation
Processing Sequence and Guidelines
Material and Purchase Specifications

Chapter 4 - Design Considerations

Incorporating Resistors into a Printed Circuit Board
Film Requirements
Resistor Correction Factors for Artwork
Connections to Planes
Element Transition and Overlap Area
Resistor Shapes and Construction
Resistor Parameters for Calulations
Via Restrictions for Resistors
Resistive Material Corner Effects
Trimming Options
Resistor Shapes
CAD Libraries

Chapter 5 - Reliability

Long Term Reliability
ECL Test Circuit Test Results

Chapter 6 - Vendors

Vendor List

Author: James C. Blankenhorn
Edition: July 2001
Pages: full color 82 pages 8.5" x 11"
ISBN: 1-882812-16-6
Price: $79.95

Author: James C. Blankenhorn

James C. Blankenhorn is President and founder (1985) of SMT Plus Inc., located in Scotts Valley, California. His experience in SMT began as Vice President of Design and Prototyping for AWI, the first SMT subcontract design and assembly firm for SMT from 1983-1985. His work established many of the design guidelines and processes used in the SMT industry today. Mr. Blankenhorn sold the design and assembly operations to and was General Manager and Vice President of Design for Jabil Circuit from 1988-1991, setting up multiple design centers and managing prototype assembly. Mr. Blankenhorn returned to SMT Plus to direct its activities. Having identified the growing needs of industry for education, SMT Plus has emerged since 1996 as a leader in the production of advanced multimedia technical training products and development tools for the SMT and telecommunications industries. Prior to his involvement with SMT, Mr. Blankenhorn was a MOS designer for Motorola and TI and product line manager for memory and microprocessors for Honeywell for 8 years. For 3 years thereafter he was involved in startups in IC packaging, test and burn-in as General Manager for Test International and Vice President of Sales for IC Link.

Mr. Blankenhorn is an active member of the SMTA, a co-founder of the SMTA in 1984, recipient of the 1996 Founders Award for Distinguished Service, and served twice as technical chairman for the Silicon Valley SMTA chapter. He is a speaker at conferences worldwide and has authored over twenty books on SMT design, packaging, and processing. He holds a BSEE degree from Arizona State University and is listed in Who's Who in America.