|Circuit Board Repair Guide > Basic Circuit Board Repair Procedures > 2.5 Baking and Preheating of Printed Circuit Boards|
Baking and Preheating of Printed Circuit Boards
This section covers baking and preheating of printed circuit boards and printed circuit board assemblies to prepare the product for subsequent operations. Included are steps for baking, preheating, auxiliary heating, and thermal profiles.
Baking and preheating procedures must be carefully selected to ensure that temperature and time cycles used do not degrade the product. Environmental conditions must also be carefully considered to ensure that vapors, gases, etc., generated during the heating process do not contaminate the product's surfaces.
Some manufacturers of ceramic chip capacitors recommend that the Preheat Ramp Rate not exceed 2-4 °C/Sec.
To prevent fluxes or other contaminates from being baked onto the board surface, thoroughly clean the board or assembly prior to baking or preheating.
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2.5 Baking and Preheating of Printed Circuit Boards