Circuit Board Repair Guide > Conductor Repair Procedures > 4.1.2 How to Rebond a Lifted Conductor Using Film Adhesive

How to Rebond a Lifted Conductor Using Film Adhesive

Repair Circuit Boards | Repair SMT Pads | Repair BGA Pads | Repair Lands | Repair Edge Contacts
Repair a Conductor | Plated Hole Repair | Base Board Repair | Replace Solder Mask or Coatings

This procedure is used to repair damaged and lifted conductors with film adhesive. Dry film epoxy is used to rebond the lifted conductor.

Caution
This procedure should not be used to rebond a conductor that has been stretched or damaged.

IPC Acceptability References
IPC-A-610 2.0 Externally Observable Characteristics
IPC-A-600 10.0 Laminate Conditions
 
Lifted conductor needs to be rebonded
Lifted Conductor

Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
IPC7721 4.1.2 Lifted Conductor Repair, Film Adhesive Method

Tools and Materials
Bonding Film (#115-2706)      
Bonding Iron
Bonding Tips
Circuit Bonding System (optional)      
Cleaner
Knife
Tape, Kapton
Microscope      
Scraper
Tweezers
Wipes

4.1.2 Lifted Conductor Repair, Film Adhesive Method

Printed Board Type: R/F  |  Skill Level: Intermediate  |  Conformance Level: High  |  Rev.: E  |  Rev. Mar 28, 2001

Place dry film epoxy under lifted conductor

Fig. 1: Cut out a piece of dry film epoxy and place it under the lifted conductor.






1. 
Clean the area.
 
2. 
Remove any obstructions that prevent the lifted conductor from making contact with the base board surface.
 
  Caution
Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.
 
3.  Clean the area
 
4.  Cut out a piece of dry film epoxy that closely matches the size of the lifted conductor. Be careful not to contaminate the dry film epoxy with materials that could reduce the bond strength. (See Figure 1).
 
  Note
Dry film epoxy thickness should be selected to meet the requirements of the circuit board.
 
5.  Place the dry film epoxy under the lifted conductor. (See Figure 1).
 
6.  Select a bonding tip with a shape to match the shape of the lifted conductor
 
  Note
The bonding tip should be as small as possible but should completely cover the entire surface of the conductor.
   
Place Kapton tape over lifted conductor

Fig. 2: Place Kapton tape over the lifted conductor.

7.  Place a piece of Kapton tape over the lifted conductor. (See Figure 2).
   
Bond lifted conductor using a Bonding System

Fig. 3: Bond the lifted conductor
using a Bonding System or
Bonding Iron with appropriate
Bonding Tip.


8.  Position the circuit board so that it is flat and stable. Gently place the hot bonding tip onto the Kapton tape covering the new conductor. Apply pressure as recommended in the manual of the repair system or circuit board repair kit for 5 seconds to tack the conductor in place. Carefully peel off the tape.
   
9.  Gently place the bonding tip directly onto the new conductor. Apply pressure as recommended in the manual of the repair system or repair kit for an additional 30 seconds to fully bond the conductor. The conductor is fully cured. Carefully clean the area and inspect the new conductor.
   
10. Replace surface coating to match prior coating as required.
Lifted conductor repair completed

Fig. 4: Conductor repair completed.
Evaluation
   
1.  Visual examination and tape test per IPC-TM-650 (ANCI/IPC-FC-250A) test method 2.4.1.
   
2.  Electrical tests as applicable.




Links to Related Products


Circuit Bonding System bonds surface mount and BGA pads  
Circuit Bonding System 115-3118
The Circuit Bonding System is the best, calibrated system for bonding adhesive film backed circuits and is ideally suited for bonding small patterns including surface mount and BGA pads. This bonding press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. Includes a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. The digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle.

Bonding Tips
The Bonding Tips fit into the hand held Bonding Iron (part number 115-3102) and the Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond the adhesive backed replacement pads, edge contacts, and lands to the circuit board surface.



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