4.1.2 Lifted Conductor Repair, Film Adhesive Method

This method is used to repair damaged and lifted conductors. Dry film epoxy is used to rebond the lifted conductor.

Caution
This method should not be used to rebond a conductor that has been stretched or damaged.

Acceptability References
IPC-A-610	2.0	Externally Observable Characteristics
IPC-A-600	10.0	Laminate Conditions

Lifted Conductor

Procedure References
CTC	1.0	Foreword
CTC	2.1	Handling Electronic Assemblies
CTC	2.2.1	Cleaning, Local
CTC	2.2.2	Cleaning, Aqueous Batch Process
CTC	2.5	Baking and Preheating
IPC7721	4.1.2	Lifted Conductor Repair, Film Adhesive Method see procedure below

Tools and Materials
Bonding Film
Bonding Iron
Bonding System
Bonding Tips
Cleaner
Epoxy
Knife
Microscope
Scraper
Tape, Kapton
Tweezers
Wipes

Procedure 4.1.2 Lifted Conductor Repair, Film Adhesive Method

Figure 1: Cut out a piece of dry film epoxy and place it under the lifted conductor.

1.	Clean the area.

2.	Remove any obstructions that prevent the lifted conductor from making contact with the base board surface.

	Caution Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.

3.	Clean the area

4.	Cut out a piece of dry film epoxy that closely matches the size of the lifted conductor. Be careful not to contaminate the dry film epoxy with materials that could reduce the bond strength. (See Figure 1).

	Note Dry film epoxy thickness should be selected to meet the requirements of the circuit board.

5.	Place the dry film epoxy under the lifted conductor. (See Figure 1).

6.	Select a bonding tip with a shape to match the shape of the lifted conductor

	Note The bonding tip should be as small as possible but should completely cover the entire surface of the conductor.

Figure 2: Place Kapton tape over the lifted conductor.

7.	Place a piece of Kapton tape over the lifted conductor. (See Figure 2).

Figure 3: Bond the lifted conductor
using a Bonding System.

8.	Position the circuit board so that it is flat and stable. Gently place the hot bonding tip onto the Kapton tape covering the new conductor. Apply pressure as recommended in the manual of the repair system or repair kit for 5 seconds to tack the conductor in place. Carefully peel off the tape.

9.	Gently place the bonding tip directly onto the new conductor. Apply pressure as recommended in the manual of the repair system or repair kit for an additional 30 seconds to fully bond the conductor. The conductor is fully cured. Carefully clean the area and inspect the new conductor.

10.	Replace surface coating to match prior coating as required.

Figure 4: Completed repair.

Evaluation

1.	Visual examination and tape test per IPC-TM-650 (ANCI/IPC-FC-250A) test method 2.4.1.

2.	Electrical tests as applicable.

Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | 4.1.1 Lifted Conductor Repair, Epoxy Seal Method | 4.1.2 Lifted Conductor Repair, Film Adhesive Method | 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method | 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method | 4.2.3 Conductor Repair, Welding Method | 4.2.4 Conductor Repair, Surface Wire Method | 4.2.5 Conductor Repair, Through Board Wire Method | 4.2.6 Conductor Repair, Inner Layer Method | 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method | 4.3.1 Circuit Cut, Surface Circuits | 4.3.2 Circuit Cut, Inner Layer Circuits | 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method | 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method | 4.4.1 Lifted Land Repair, Epoxy Seal Method | 4.4.2 Lifted Land Repair, Film Adhesive Method | 4.5.1 Land Repair, Epoxy Method | 4.5.2 Land Repair, Film Adhesive Method | 4.6.1 Edge Contact Repair, Epoxy Method | 4.6.2 Edge Contact Repair, Film Adhesive Method | 4.6.3 Edge Contact Repair / Rework, Plating Method | 4.7.1 Surface Mount Pad Repair, Epoxy Method | 4.7.2 Surface Mount Pad Repair, Film Adhesive Method | 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method | 4.7.4 Surface Mount, BGA Pad with Integral Via Repair | 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method