Circuit Board Repair and Rework Guide > 4.0 Conductor Procedures > 4.1.1 Lifted Conductor Repair, Epoxy Seal Method

4.1.1 Lifted Conductor Repair, Epoxy Seal Method

This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.

Caution
This method should not be used to rebond a circuit that has been stretched or damaged.
   Lifted Conductor Repair, Epoxy Seal Method
Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Laminate Conditions
 
Procedure References
CTC 1.0 Foreword
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 Cleaning, Local
CTC 2.2.2 Cleaning, Aqueous Batch Process
CTC 2.5 Baking and Preheating
CTC 2.7 Epoxy Mixing and Handling
IPC7721 4.1.1 Lifted Conductor Repair, Epoxy Seal see procedure below

Tools and Materials
Cleaner
Epoxy
Knife
Oven
Pick
Wipes  


Procedure 4.1.1 Lifted Conductor Repair, Epoxy Seal

Apply a small amount of epoxy under the entire length of the lifted circuit.

Figure 1: Apply a small amount of
epoxy under the entire length of the
lifted circuit.
1.
Clean the area.
 
2.
Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.
 
  Caution
Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.
 
3. Clean the area
 
4. Mix the epoxy.
 
5. Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1).
 
6. Press the lifted circuit down into the epoxy and into the contact with the base board material.
 
7. Apply additional epoxy to the surface of the lifted circuit and to all sides as needed.

Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
 
  Caution
Some components may be sensitive to high temperature.
 
8. Apply surface coating to match prior coating as required.
   
Completed repair.

Figure 2: Completed repair.
Evaluation
   
1. Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.
   
2. Electrical tests as applicable.


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4.1.1 Lifted Conductor Repair, Epoxy Seal Method