4.1.1 Lifted Conductor Repair, Epoxy Seal Method

This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.

Caution
This method should not be used to rebond a circuit that has been stretched or damaged.

Acceptability References
IPC-A-600	2.0	Externally Observable Characteristics
IPC-A-610	10.0	Laminate Conditions

Procedure References
CTC	1.0	Foreword
CTC	2.1	Handling Electronic Assemblies
CTC	2.2.1	Cleaning, Local
CTC	2.2.2	Cleaning, Aqueous Batch Process
CTC	2.5	Baking and Preheating
CTC	2.7	Epoxy Mixing and Handling
IPC7721	4.1.1	Lifted Conductor Repair, Epoxy Seal see procedure below

Tools and Materials
Cleaner
Epoxy
Knife
Oven
Pick
Wipes

Procedure 4.1.1 Lifted Conductor Repair, Epoxy Seal

Figure 1: Apply a small amount of
epoxy under the entire length of the
lifted circuit.

1.	Clean the area.

2.	Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.

	Caution Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.

3.	Clean the area

4.	Mix the epoxy.

5.	Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1).

6.	Press the lifted circuit down into the epoxy and into the contact with the base board material.

7.	Apply additional epoxy to the surface of the lifted circuit and to all sides as needed. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.

	Caution Some components may be sensitive to high temperature.

8.	Apply surface coating to match prior coating as required.

Figure 2: Completed repair.

Evaluation

1.	Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.

2.	Electrical tests as applicable.

Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | 4.1.1 Lifted Conductor Repair, Epoxy Seal Method | 4.1.2 Lifted Conductor Repair, Film Adhesive Method | 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method | 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method | 4.2.3 Conductor Repair, Welding Method | 4.2.4 Conductor Repair, Surface Wire Method | 4.2.5 Conductor Repair, Through Board Wire Method | 4.2.6 Conductor Repair, Inner Layer Method | 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method | 4.3.1 Circuit Cut, Surface Circuits | 4.3.2 Circuit Cut, Inner Layer Circuits | 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method | 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method | 4.4.1 Lifted Land Repair, Epoxy Seal Method | 4.4.2 Lifted Land Repair, Film Adhesive Method | 4.5.1 Land Repair, Epoxy Method | 4.5.2 Land Repair, Film Adhesive Method | 4.6.1 Edge Contact Repair, Epoxy Method | 4.6.2 Edge Contact Repair, Film Adhesive Method | 4.6.3 Edge Contact Repair / Rework, Plating Method | 4.7.1 Surface Mount Pad Repair, Epoxy Method | 4.7.2 Surface Mount Pad Repair, Film Adhesive Method | 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method | 4.7.4 Surface Mount, BGA Pad with Integral Via Repair | 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method