2.6.3 Legend Marking, Stencil Method

This method can be used to add, change or replace legend and markings on printed boards or printed board assemblies. This method uses epoxy ink and a brush or roller technique. A stencil is used to outline the characters.

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 8.0 Marking
 
Procedure References
CTC 1.0 Foreword 
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 Cleaning, Local
CTC 2.2.2 Cleaning, Aqueous Batch Process
CTC 2.5 Baking and Preheating
CTC 2.7 Epoxy Mixing and Handling
IPC7721 2.6.3 Legend/Marking, Stencil Method see procedure below

Tools and Materials
Cleaner
Color Agent/Epoxy Ink
Ink Roller
Ink Plate
Microscope
Oven
Knife
Stencil
Wipes  

Procedure 2.6.3 Legend/Marking, Stencil Method

Damaged Legend

Damaged Legend


Replace legend using a stencil.

Figure 1: Replace legend using a stencil.


1.
Clean the area.
 
2.
Scrape off any remaining character or legend with a knife and clean the area.
 
Caution
Abrasion operations can generate electrostatic charges.
 






3. . Select the appropriate stencil or have a stencil made up (See Figure 1).
 
4. Mix the epoxy ink. White is the most common color. Spread a thin even coating of the epoxy ink on the ink plate or on a smooth surface.
 
5. Position the stencil on the circuit board surface and hold in place firmly
 
6. . Roll or brush the ink onto the stencil. Do not smudge characters or apply excess ink.
 
7. Cure the epoxy ink per the manufacturer's instructions.
 
Completed legend repair.

Figure 2: Completed legend repair.
Evaluation
   
1. Visual examination for proper characters, positioning and legibility.



Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | 2.1 Handling Electronic Assemblies | 2.2.1 Cleaning, Local | 2.2.2 Cleaning, Aqueous Batch Process | 2.3.1 Coating Removal, Identification of Coating | 2.3.2 Coating Removal, Solvent Method | 2.3.3 Coating Removal, Peeling Method | 2.3.4 Coating Removal, Thermal Method | 2.3.5 Coating Removal, Grinding / Scraping Method | 2.3.6 Coating Removal, Micro Blasting Method | 2.4.1 Coating Replacement, Solder Mask | 2.4.2 Coating Replacement, Conformal Coating, Encapsulant | 2.4.3 Coating Replacement, Solder Mask, BGA Locations | 2.5 Baking and Preheating | 2.6.1 Legend/Marking, Stamping Method | 2.6.2 Legend Marking, Hand Lettering Method | 2.6.3 Legend Marking, Stencil Method | 2.7 Epoxy Mixing and Handling


2.6.3 Legend Marking, Stencil Method