2.6.1 Legend/Marking, Stamping Method

This method can be used to add, change or replace legend and markings on printed boards or printed board assemblies. This method uses epoxy ink and an ink stamp to place the legends on the printed board surface in much the same manner as taking a "finger print".

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 8.0 Marking
 
Procedure References
CTC 1.0 Foreword
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 Cleaning, Local
CTC 2.2.2 Cleaning, Aqueous Batch Process
CTC 2.5 Baking and Preheating
CTC 2.7 Epoxy Mixing and Handling
IPC7721 2.6.1 Legend/Marking, Stamping Method see procedure below

Tools and Materials
Cleaner
Color Agent/Epoxy Ink
Ink Plate
Ink Roller
Microscope
Oven
Peg Stamps
Knife
Wipes  

Procedure 2.6.1 Legend/Marking, Stamping Method

Damaged Legend

Damaged Legend


Apply legend using a peg stamp.

Figure 1: Apply legend using a peg stamp.


1.
Clean the area.
 
2.
Scrape off any remaining character or legend with a knife and clean the area.
 
Caution
Abrasion operations can generate electrostatic charges.
 
   
3. . Select the appropriate characters from the peg stamp set or have a special stamp made up.
 
4. Mix the epoxy ink. White is the most common color. Spread a thin even coating of the epoxy ink on the ink plate or on a smooth surface.
 
5. Gently press the peg stamp into the epoxy coating to coat the character surface.
 
6. Gently press the peg stamp onto the desired location on the circuit board surface. (See Figure 1).
 
7. Cure the epoxy ink per the manufacturer's instructions.
Completed legend repair.

Figure 2: Completed legend repair.
Evaluation
   
1. Visual examination for proper characters, positioning and legibility.



Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | 2.1 Handling Electronic Assemblies | 2.2.1 Cleaning, Local | 2.2.2 Cleaning, Aqueous Batch Process | 2.3.1 Coating Removal, Identification of Coating | 2.3.2 Coating Removal, Solvent Method | 2.3.3 Coating Removal, Peeling Method | 2.3.4 Coating Removal, Thermal Method | 2.3.5 Coating Removal, Grinding / Scraping Method | 2.3.6 Coating Removal, Micro Blasting Method | 2.4.1 Coating Replacement, Solder Mask | 2.4.2 Coating Replacement, Conformal Coating, Encapsulant | 2.4.3 Coating Replacement, Solder Mask, BGA Locations | 2.5 Baking and Preheating | 2.6.1 Legend/Marking, Stamping Method | 2.6.2 Legend Marking, Hand Lettering Method | 2.6.3 Legend Marking, Stencil Method | 2.7 Epoxy Mixing and Handling


2.6.1 Legend/Marking, Stamping Method