2.6.2 Legend Marking, Hand Lettering Method

This method can be used to add, change or replace legend and markings on printed boards or printed board assemblies. This method uses epoxy ink and a pen to hand letter the legends on the printed board surface.

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 8.0 Marking
 
Procedure References
CTC 1.0 Foreword
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 Cleaning, Local
CTC 2.2.2 Cleaning, Aqueous Batch Process
CTC 2.5 Baking and Preheating
CTC 2.7 Epoxy Mixing and Handling
IPC7721 2.6.2 Legend/Marking, Hand Lettering Method see procedure below

Tools and Materials
Cleaner
Color Agent/Epoxy Ink
Ink Pen
Microscope
Oven
Knife
Wipes
Wood Sticks  

Procedure 2.6.2 Legend Marking, Hand Lettering Method

Damaged Legend

Damaged Legend


Apply legend using a wood stick dipped in epoxy ink.

Figure 1: Apply legend using a wood stick dipped in epoxy ink.


1.
Clean the area.
 
2.
Scrape off any remaining character or legend with a knife and clean the area.

Caution
Abrasion operations can generate electrostatic charges.






3. . Mix the epoxy ink. White is the most common color.
 
4. Sharpen a wood stick and dip the pointed end into the epoxy ink. Hand letter the legend or markings as needed.
 
5. Cure the epoxy ink per the manufacturer's instructions.
 
Completed legend repair.

Figure 2: Completed legend repair.
Evaluation
   
1. Visual examination for proper characters, positioning and legibility.



Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | 2.1 Handling Electronic Assemblies | 2.2.1 Cleaning, Local | 2.2.2 Cleaning, Aqueous Batch Process | 2.3.1 Coating Removal, Identification of Coating | 2.3.2 Coating Removal, Solvent Method | 2.3.3 Coating Removal, Peeling Method | 2.3.4 Coating Removal, Thermal Method | 2.3.5 Coating Removal, Grinding / Scraping Method | 2.3.6 Coating Removal, Micro Blasting Method | 2.4.1 Coating Replacement, Solder Mask | 2.4.2 Coating Replacement, Conformal Coating, Encapsulant | 2.4.3 Coating Replacement, Solder Mask, BGA Locations | 2.5 Baking and Preheating | 2.6.1 Legend/Marking, Stamping Method | 2.6.2 Legend Marking, Hand Lettering Method | 2.6.3 Legend Marking, Stencil Method | 2.7 Epoxy Mixing and Handling


2.6.2 Legend Marking, Hand Lettering Method