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Your Transition to Lead Free Course (RoHS, WEEE)

Your Transition to Lead Free Course (RoHS, WEEE)

Anyone involved in the transition to lead free should take this highly informative course. If you are involved in any area of board or assembly manufacturing, components, design, quality, test or sales this will help you immensely in your understanding of the issues and possible solutions of moving to lead free. You can start this web-based course today!

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New! Online Course 12 sections, 390 screens, approximately 8 hours long.        Course Outline. Preview of the Book Index.

TE0250-BC includes both the course book and online training course with unlimited access for one student for 365 days. You save $265 over buying the online course and course book separately. This course has 12 modules and course price includes all 12 modules. There is no online access if you purchase the course book only.


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Our industry is making one of its most challenging and evolutionary steps in going from SnPb to Pb free products. The issues are many and they must be well understood to avoid costly mistakes or misspoken statements. In this online course you will learn the most critical pieces about the transition to lead free. It is the most extensive and broadest coverage of this topic available anywhere.

The transition to lead free first starts with understanding the directives and global trends. Then learn about the possible alloy replacements, their pros and cons along with the environmental considerations and reliability; each backed up with testing and data. The PWB finishes are dealt with in detail covering a wide range of optional finishes. That is followed by what the effects are of intermixing different board finishes, PWB plating types and solder alloys: addressing both forward and backward compatibility. Next, another important topic, tin whiskers are explained in a detail not seen anywhere else. Now you are only half way through!

The next section gets into failure modes such as CAF, causes and solving tombstoning and voids, lead free printing issues, lead free reflow profiles (old compared to new recommendations) and how they relate to a variety of defects during reflow that can be solved by making slight changes. Learn what Motorola gained from extensive testing such as drop tests. Finally one more very important topic is covered, wave soldering. It covers topics such as tin pest, tin corrosion, fluxing, setup and the optional pin in paste process.

Authors

Dr. Ronald C. Lasky, PhD, PE   (Indium Corporation, Dartmouth College)
Katherine Hickey, MEM, EIT   (Neovention, Dartmouth College)
Amish Peevasharn MS, EIT   (Neovention, Dartmouth College) 

Detailed Course Outline
Module 1: Lead Free Initiatives and Global Trends
The electronics industry has been mandated to convert to lead free products per two directives: WEEE and RoHS. How these changes are coming about and how the segments of the world are dealing with this are presented along with graphs showing the status.
  • What is the industry size?
  • What is the industry breadth?
  • What you do is important.
  • Where is the market?
  • How about electronics and the environment?
  • A major change?
  • What is the WEEE Directive?
  • List the categories of electronics included.
  • What is the RoHS Directive?
  • List the categories of electronics included.
  • What are the RoHS Exemptions?
  • So what does this mean?
  • What are some of the logistical concerns?
  • What are the steps you can take?
  • What about China RoHS?
  • What about USA RoHS?
  • What are Japanese "Green" products?
  • Why is PB-free only a piece of RoHS compliance?
Module 2: Lead Free Alloy Selection
The selection of a replacement for SnPb is at the heart of the issues confronting many in transitioning to lead free. The alloy options being considered by most, their cost implications, SAC alloys choices and what the industry are mainly favoring are presented.
  • Solder as it is today.
  • List the desirable lead free characteristics.
  • List the lead free paste options.
  • What is the impact on paste costs?
  • What are drop-in solutions?
  • List some of the lead free paste options.
  • What is the problem with 91Sn9Zn?
  • What is the problem with 96.5Sn3.5Ag?
  • How about SAC alloys?
  • How about SnAgCuSb?
  • How about 58Sn42Bi?
  • How about SnAgBi?
  • What are the SnAgBi concerns?
  • What looks like the industry choice?
  • What are the SAC concerns?
  • What are the things to remember?
Module 3: Is Lead Free a Good Thing?
Changing to lead free has environmental considerations, so why are we targeting eliminating Pb anyhow? So of the lead free alloy choices what makes the most sense is covered.
  • What are the environmental implications?
  • List the sources of environmental lead.
  • Why target Pb in WEEE?
  • What about lead free solder alloys?
  • What is the decision?
  • Is lead free a good thing?
Module 4: Lead Free Alloy Reliability
The change to another alloy from SnPb means we have to address the reliability of any possible choice. Thermal testing has been performed on many such choices and is presented as well as mechanical testing and out of plane bending.
  • Why worry about reliability?
  • What about thermal cycling performance?
  • What about thermal fatigue for BGAs?
  • What about creep?
  • What does isothermal mechanical cycling include?
  • When is out of plane bending a problem?
  • Describe mechanical shock?
  • Summarization of the technical considerations.
Module 5: Lead Free Components
Using lead free components with SnPb and vice versa is of concern and can cause problems, so understanding forward and backward compatibility are necessary pieces to the lead free transition puzzle. Learn how tin whiskers are created and on what surfaces along with what it takes to prevent them. It is vital for components the labels need to tell us which are SnPb and which are Pb-free.
  • What do you need to know about lead free components?
  • What are the component finish options?
  • What about Sn whiskers: growth?
  • What about Sn whiskers: intermetallic formation?
  • What is copper diffusion: increasing whisker growth?
  • What is the whisker index?
  • Explain about Sn whiskers: CTE mismatch.
  • What about Sn whiskers: other causes?
  • What about Sn whiskers: mitigation?
  • What about reliability of various component finishes?
  • How to make the switch.
  • How about forward/backward compatibility?
  • What about component suppliers?
  • What are the labeling issues?
  • What are other component concerns?
  • List other component concerns.
  • What is the cost impact?
Module 6: Lead Free Surface Finish
There are many choices when it comes to PWB finishes. Some choices are much better than others. In this section this is presented showing the pros and cons of each along with a summary table comparing them all.
  • Why the surface finish requirements?
  • What is the industry choice for surface finish?
  • What about Pb-free HASL? (Hot Air Solder Level)
  • What about ENIG? (Electroless Nickel Immersion Gold)
  • What about using OSP? (Organic Solder Preservatives)
  • What about using IAg? (Immersion Silver)
  • What about using ISn? (Immersion Tin)
  • Surface finish comparison.
  • Summary of different finishes.
Module 7: Failure Modes
The alloy changes in going to Pb-free cause old problems to reappear but for new reasons. Tombstoning and voids are the recurrent defects that can be controlled once you understand the causes, which is detailed in this section.
  • What is conductive anode filament growth (CAF)?
  • What causes tombstoning?
  • What are the tombstoning rates?
  • What can be done to minimize tombstoning?
  • What about mixed alloys?
  • What is voiding?
  • How do the alloys compare for voiding?
  • How can you prevent voiding in reflow?
  • What causes voids in vias?
  • What are the inspection issues?
Module 8: Implementation
Implementing Pb-free and how the industry stands is an issue. ELFNET did a survey to show where companies stand and it is eye opening to see how much work has yet to be completed by many. To assist those in need an assessment tool is included to rate where your company is in the changeover process.
  • What is the European lead free survey?
  • What about the ELFNET survey?
  • What is the current status of EU Pb-free?
  • Where is a Pb-free readiness assessment tool?
  • What is the Pb-free RAT?
  • WEEE/RoHS experts are valuable.
  • What to think about for your BOM?
  • How do you work with your suppliers?
  • How to go about choosing a new paste?
  • What percent are RoHS compliant suppliers?
  • What are homogenous materials?
  • How do you do planning for review?
Course Prerequisites
Module 9: Lead Free Printing and Placement
Printing lead free paste creates new challenges. The quality of the print, paste selection, response to pause, viscosity considerations, tackiness, stencil life, shear thinning, solder balling and stencil design are each covered in this section. The changes are subtle but the effects are major.
  • What is the approximate distribution of process related defects?
  • How many factors affect your print quality?
  • What is Motorola's process criteria?
  • How do you do a paste evaluation and selection strategy?
  • What items are related to your paste selection?
  • What are paste responses?
  • What is the paste evaluation?
  • What's the 12 board paste evaluator?
  • What are the effects of viscosity?
  • What are the effects of viscosity and temperature?
  • What is the Motorola flux tackiness measurement?
  • What is the effect on solder paste stencil life?
  • What are the effects of short stencil life?
  • What was the objective of the Motorola stencil printing evaluation?
  • What was the result of response to pause test?
  • What are the effects of poor response to pause?
  • How do you go about measuring shear thinning effect?
  • What is the solder paste resistance to shear thinning?
  • Why worry about solder balls in passive assembly?
  • What are poor gasketing results?
  • Why the importance of wall/pad ratio?
  • What changes for stencil design?
Module 10: Lead Free Reflow
Changes are required in the reflow profiles to achieve optimum results when changing to different alloys replacing SnPb. The affects of the profile on 8 different common defects is presented so you may learn the cause and solution for each. Also included is a recap of the results Motorola found during their extensive analysis.
  • What is the approximate distribution of process related defects?
  • What is crucial for lead free reflow?
  • What are the (old) RDRP profiles?
  • What changes for the (new) convection ovens?
  • What is unique about the (old) IR oven profile design?
  • What is different about the (new) convection oven profile design?
  • What are the unique profiles and defect mechanisms?
  • Explain defect mechanism analysis 1.
  • Explain defect mechanism analysis 2.
  • Explain defect mechanism analysis 3.
  • Explain defect mechanism analysis 4.
  • Explain defect mechanism analysis 5.
  • Explain defect mechanism analysis 6.
  • Explain defect mechanism analysis 7.
  • Explain defect mechanism analysis 8.
  • Reflow profile summary.
  • Recap of the Motorola reflow profile evaluation.
  • What was the coalescence?
  • Compare reflow profile and coalescence.
  • How about the wetting?
  • State Motorola's conclusion.
Module 11: Lead Free Reliability Issues
There are important reliability considerations when evaluating different alloys to replace SnPb. Data is presented from Motorola which did extensive testing for reliability using a test vehicle to evaluate mechanical and thermal shock.
  • Understand the reliability of Pb-free.
  • What was the Motorola reliability evaluation?
  • What was the Motorola test vehicle?
  • What was the Motorola drop evaluation?
  • What was the Motorola thermal shock evaluation?
Module 12: Lead Free Wave Soldering & Alternative Soldering Methods
The effects of changing alloys on the wave soldering process are significant. It affects both the equipment and the process. The results are the effects of tin pesting and corrosion. So what is the industry switching to? That plus fluxing, setup and dwell time is explained to complete the transition.
  • Which components get wave soldering?
  • List some lead free wave challenges.
  • What is tin pest?
  • When does tin corrosion occur?
  • What are the industry lead free wave recommendations?
  • What is crucial about fluxing?
  • List the lead free wave setup rules of thumb.
  • How do you calculate dwell time?
  • What is the Pin-in-Paste (PIP) process?
  • What are the PIP concerns?
  • How do you do the PIP stencil design?
  • What are PIP stencil design steps 1 & 2?
  • What is PIP stencil design step 3?
  • What is PIP stencil design step 4?
  • Show some common PIP stencil designs.
  • Show a poor PIP stencil design.
  • What are solder preforms?
  • What are some PIP considerations?
  • What to consider in PIP solder paste selection.
  • What is an opton for PIP stencil printing?
  • What about PIP component selection?
  • State the lead free wave and alternative soldering methods summary. 
Book Index

A-B   L-M   Shear force, 120
Activator decomposition, 69   Lee profile, 109   Shear thinning, 102
Annex 1 B, 12   Liquidus, 67   Shear thinning effect, 101
Backward compatibility, 68   Mass fraction, 65   Silver, 21, 29
Ball shear, 35   Mechanical shock, 37   Slump, 111
Bismuth, 22   Mixed alloys, 67   SnBi solder, 23
BOM, 79, 84   Motorola thermal shock evaluation, 119   Software, 81
Bridging, 111   Motorola's conclusion, 116   Solder balling, 110
    Motorola's process criteria, 94   Solder balls, 102
C-D   MSD levels, 49   Solder beading, 111
Charring, 112       Solder paste stencil life, 99
Choosing a new paste, 85   N-O   Solder preforms, 130
Coalescence, 74, 113   Ni/Pd/Au, 40   Solder spread, 59
Component finish options, 40   Organic solder preservatives, 56   Stencil aspect ratio, 103
Component finishes, 46   Out of plane bending, 36   Stencil design, 103
Compressive stress, 45   Outgassing, 111   Stencil life, 99
Conductive anodic filament formation, 62   Outgassing rate, 71   Stencil printing evaluation, 100
Copper diffusion, 44   Oxidation, 111   Surface finish comparison, 58
Cost issues, 79       Surface finishes, 54, 65
Creep, 34   P   Surface insulation resistance, 63
CTE mismatch, 45   Paste evaluation, 96    
    Paste evaluation and selection strategy, 95   T
D-F   Paste evaluator, 97   Technical Adaptation Committee (TAC), 14
Delamination, 51   Paste responses, 96   Ternary alloy, 22
Drop test, 119   Paste selection, 96   Thermal cycling, 32
Dwell time, 126   Pb contamination, 86   Thermal fatigue, 33
Electroless nickel immersion gold, 55   Pb poisoning, 29   Thermal stress, 45
Electronic waste, 28   Pb-free components, 40   Tin corrosion, 124
ELFNET survey, 78   Pb-free HASL, 55   Tin pest, 123
EU Pb-free, 80   Pb-free paste alternatives, 18   Tin silver copper, 21
EURAM, 26   Pb-free processing, 113   Tin whiskers, 41, 46
Fillet lift, 24   Pb-free RAT, 81   Tombstoning, 63, 75, 110
Flux entrapment, 73   Pb-free reflow, 106   Tombstoning rates, 64
Flux tackiness measurment, 99   Pb-free replacements, 20   Training, 80
Fluxing, 125   Pb-free wave, 123    
Forward / backward compatibility, 47   PIP, 126   V
    Planning for review, 90   Vias, 73
G-H   Powder oxidation, 115   Viscosity, 97, 111
Gaskets, 103   Print quality, 94   Viscosity and Temperature, 98
Gold embrittlement, 36   Process related defects, 94   Voiding, 69, 112
Higher reflow temperatures, 90        
Homogenous joint, 67   R   W
Homogenous material, 89   RDRP reflow profiles, 107   Wave soldering, 122
Hot soak, 66   Reflow profile, 66, 72, 107   WEEE, 11
    Reliability issues, 32, 118   WEEE directives, 12
I-J   Response to pause test, 100   WEEE / RoHS experts, 84
Immersion silver, 56   Rheological additive evaporation, 69   Wettability, 22
Immersion tin, 57   RoHS, 11   Wetting, 111
Indalloy #241, 107   RoHS compliant, 84   Wetting properties and solder type, 64
Industry choice, 24, 81   RoHS directive, 13, 28   Wetting, poor, 111
iNEMI, 24   RoHS labeling conventions, 85   Whisker growth, 46
Intermetallic formation, 41       Whisker index, 44
IPC-TM-650 test procedure, 99   S   Wicking, 75, 110
Isothermal mechanical cycling, 35   SAC alloys, 21, 70, 124    
JEDEC labels, 48   SAC solder compositions, 26   Z
JEIDA, 26   SAC solders, 81   Zinc, 20
    SAC305, 66, 124    


Curriculum Length

12 sections, 390 screens, approximately 8 hours long.

Begin Course

After your order is processed by the course administrator, you will receive an email which will contain your username, password and detailed information on how to begin your web-based course. You will be able to start the course(s) you have selected the same day you place your order.

System Requirements
  • High speed Internet Connection (DSL, cable, ISDN 128)
  • Browser: Explorer 4.01 Service Pack 2 (or greater), or Netscape 4.7 (or greater). Explorer 5 is recommended
  • Flash 4 or greater plug-in
  • 16 bit colour, 800 x 600 resolution (minimum requirement)
  • Audio card (optional)
  • 200 megahertz minimum, 300 megahertz recommended
  • 32 RAM minimum, 64 RAM recommended
  • 50 mb of available disk cache space
Refund Policy

If this material does not meet your expectations as outlined in the course description, you have 3 working days from the date of registration to obtain a 100% refund of the course fee. Please contact us if you have any further questions regarding this guarantee.  

Multi-User Online Course License    students

As a solution for large volume users of this course we offer several plans that may be of interest to you. These solutions are designed for corporations and universities. A minimum number of students is required to make these solutions cost effective.

Sub-Domain:

Making access and use of courses fast and easy is paramount. By having us setup a sub-domain it makes it very easy to get your training program underway. When a company needs to train 100 or more people for a curriculum we offer to setup a sub-domain on our server at no extra charge. The advantages to this offer are numerous. We do the work and will even setup the student files so the student simply logs onto the Internet, uses an assigned UserID and Password and has the content available for learning or reference use right at their fingertips. Students may log in and out whenever they want. Access is based on a term, with 1 year the norm. Each student file is kept confidential.

Another key advantage is with the sub-domain we make available to the client the ability to edit the courses they have licensed. They may opt to remove certain content or add new content themselves from their computer as html, pdf, or swf files. The edit course software is fast and easy to use with no programming skills required. By customizing the course the content can be made to fit your company's exact needs. If you need an extra hand we are available to assist.

Corporate Server:

The fastest access of content is over a corporate Intranet. It also could be you would like to add content that you feel is proprietary and want the highest level of security possible, then licensing courses and software to run on your corporate server makes a lot of sense. Each course may be licensed or purchased, as well we offer licenses for our edit course feature within our TechEdge Web-Based engine for corporate users to edit licensed courses and to develop new ones yourself using programs like Microsoft Word, PowerPoint, or Flash. It is simple, fast and easy.

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256 RAM (512 recommended)
IIS, PWS or compatable web server software
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Coldfusion Aplication Server 4.0 or higher  [ click here ]  for more info on coldfusion

Course Development:

There are many who would like to put content up on the Internet or on Corporate Intranets but either do not have the knowledge or the time to do it. To help we can offer onsite training, tools, and experience on how to do it in conjunction with licensing our software and courses. If you have a need for a course to be developed we also have that capability, demonstrated by the quality of the courses you see we offer, which are all made by our staff.

More Information:

If you are interested in any of the above multi-user solutions for this course, please contact us for more information and a quotation. You will be pleasantly surprised at how affordable these multi-user solutions really are!




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Your Transition to Lead Free Course (RoHS, WEEE)