Land Patterns Made Simple
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Foreword: Often time to write a book requires inspiration. That inspiration comes to me from my customers who for many years have subscribed and followed the rules I created for making highly manufacturable land patterns used in many thousands of board designs. I am presenting to you in this publication my knowledge about design as well as manufacturing to bring to you insight about all the aspects I can think of regarding pattern development. It is my intent for you to find this to be the single most comprehensive source of information that will establish a foundation for you and your company to create land patterns with confidence that will serve you very well. For designers theres not an adequate IPC standard for land patterns and design rules. The constant and steady evolution of SMT is faster than organizations like the IPC can keep up with. That void is where SMT Plus has tried its best to be a reliable source of information. Table of Contents. |
Table of Contents
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Chapter 1 Early Land Pattern Development ... 5
Chapter 2 Requirements of Land Patterns ... 13
Chapter 3 Component Standards ... 21
Chapter 4 Lead Free Solder Paste Impact on Patterns ... 27
Chapter 5 Stencil Apertures ... 29
Chapter 6 Solder Mask Opening Requirements ... 31
Chapter 7 Silk Screen ... 35
Chapter 8 Via in Land Use ... 37
Chapter 9 IPC-A-782 Standard ... 39
Chapter 10 Workmanship Standard IPC-A-610 ... 41
Chapter 11 Chip Component Land Patterns ... 59
Chapter 12 SO, SON, QFP, L/TQFP Gull Wing Lead Component Land Patterns ... 71
Chapter 13 SOT Component Land Patterns ... 83
Chapter 14 DPAK/DDPAK Transistors ... 91
Chapter 15 Leadless Ceramic Component Land Patterns ... 95
Chapter 16 LPN, LPP & MLF Land Patterns ... 99
Chapter 17 BGA Component Land Patterns ... 103
Chapter 18 Wafer Bump, Flip Chip & CSP Land Patterns ... 113
Chapter 19 Electrolytic Component Land Patterns ... 119
Chapter 20 Tantalum Component Land Patterns ... 123
Chapter 21 MELF Component Land Patterns ... 131
Chapter 22 J-lead Component Land Patterns ... 131
Chapter 23 RF Active Component Land Patterns ... 135
Chapter 24 RF Filter Component Land Patterns ... 139
Chapter 25 Resistor Network Component Land Patterns ... 141
Chapter 26 Trimmer Component Land Patterns ... 145
Chapter 27 Connector Component Land Patterns ... 147
Chapter 28 Crystal & Oscillator Component Land Patterns ... 149
Chapter 29 Use of Adhesives ... 151
Chapter 30 Wave Solder Land Patterns ... 153
Chapter 31 UltraLibrarian ... 159
Price: $149.95
Author: James C. Blankenhorn
Edition: August 2003
Pages: 180
ISBN: 1-882812-40-9 |
Author: James C. Blankenhorn
James C. Blankenhorn is President and founder (1985) of SMT Plus Inc., located in Scotts Valley, California. His experience in SMT began as Vice President of Design and Prototyping for AWI, the first SMT subcontract design and assembly firm for SMT from 1983-1985. His work established many of the design guidelines and processes used in the SMT industry today. Mr. Blankenhorn sold the design and assembly operations to and was General Manager and Vice President of Design for Jabil Circuit from 1988-1991, setting up multiple design centers and managing prototype assembly. Mr. Blankenhorn returned to SMT Plus to direct its activities. Having identified the growing needs of industry for education, SMT Plus has emerged since 1996 as a leader in the production of advanced multimedia technical training products and development tools for the SMT and telecommunications industries. Prior to his involvement with SMT, Mr. Blankenhorn was a MOS designer for Motorola and TI and product line manager for memory and microprocessors for Honeywell for 8 years. For 3 years thereafter he was involved in startups in IC packaging, test and burn-in as General Manager for Test International and Vice President of Sales for IC Link.
Mr. Blankenhorn is an active member of the SMTA, a co-founder of the SMTA in 1984, recipient of the 1996 Founders Award for Distinguished Service, and served twice as technical chairman for the Silicon Valley SMTA chapter. He is a speaker at conferences worldwide and has authored over twenty books on SMT design, packaging, and processing. He holds a BSEE degree from Arizona State University and is listed in Who's Who in America.
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