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Rev B to C Changes for IPC-A-610 and J-STD-001

This course presents what changes were made in changing revisions of these documents. Only content within the modules that has been changed is presented. The course is written so that it's more understandable for the typical production worker. We use our own images, animation and digital photos that bring better understanding to the spec. The material is broken down into more logical chapters and we test the student on every objective that is presented. How to purchase. You can start this web-based course today!

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Key Objectives Taught in the Course

Module 1: Standards and ESD

Introduction.
Describe the purpose of the workmanship standards IPC-A-610 and J-STD-001.
State the three classes of products in the workmanship standards.
Define the key words "must", "shall" and should".
Identify the documents that apply to electronic assembly.
Define the soldering defect terms blowholes, pinholes, dewetting and oxidation.
Define minimum electrical spacing.
State typical ESD prevention methods: deionizers, smocks, grounding, temperature and humidity control.

Module 2: Connectors, Terminals and Wires

Introduction.
Recognize unacceptable cracked board connectors or extractors.
State the mounting requirements for connectors.
Identify acceptable pads after press-fit connector pin installations.
Recognize missing plating or contamination or excess solder on the surface or a connector pin.
State the minimum amount of solder required for the secondary side (solder side) solder connection for a connector pin.
Recognize a properly mounted turret terminal.
Recognize unacceptable turret terminals due to excessive barrel or flange damage.
State when rolled flanges are used instead of flared flanges.
Identify acceptable flange angles and flange overlap.
State the criteria for securing a wire to a terminal.
State the criteria to attach wires to a pierced or perforated terminal.
State the maximum allowable insulation gaps on a wire to a terminal.
Recognize excessive bulging of wires in a wire bundle.
State why loops and correct bends of wires are necessary for future field repair.
Recognize the proper positioning of additional solder wires attached to a terminal.
Recognize the appearance of acceptable solder connections to a terminal.
State the number of damaged or missing strands allowed in a multistrand wire.
Recognize that pre-tinning shall be required for wires before soldering.

Module 3:PTH Mounting and Assembly

Introduction.
Define the terms lead prepping and lead preparation.
Describe how and where a lead can be bent.
Recognize unacceptable lead damage.
Recognize unacceptable cracks in a component package.
Describe the recommended clinching techniques for a wire or PTH lead.
State the relationship of the weight or wattage of a horizontal axial lead component to its mounting height.
State the four types of lead bending to provide stress relief for horizontal-mount axial lead components.
Recognize a properly mounted vertical axial lead component.
State the range of radial lead component mounting heights.
State when an insulator is required for a metal-cased component.
State why spacers may be used for mounting radial lead components.
Recognize when a meniscus coating embedded in the solder joint is unacceptable.
Recognize when the tilt for vertical-mount radial components is unacceptable.

Module 4: SMT, PTH Soldering and Handling

Introduction.
State the three different methods of soldering (hand, wave, and paste).
Describe proper board handling.
State why excessive pressure or stress is not to be applied to component leads during soldering.
Describe why fluxes used on an assembly must be compatible and excessive use of flux is to be avoided.
State additional requirements for solder acceptability.
Recognize that solder is not allowed on gold contact areas.
Define concave and convex solder joints.
State the solder connections for an interconnect-only hole.
Recognize that when leads are soldered into holes, the leads should be visible on the opposite side.
State the criteria for soldering to non-plated holes.
Describe the solder inspection criteria for a clinched lead.
Describe the handling methods used to ensure that the requirements for presolder cleanliness are met.

Module 5: SMT Component Workmanship

Introduction.
State the inspection criteria for SMT assemblies.
State the amount of adhesive that can interfere with an end joint.
State the allowable side overhang for gullwing leads.
State the length that a gull wing lead must be soldered onto a land.
State the acceptable heel fillet and soldered lead heights for gull wing leads.
State the allowable side overhang for flattened leads.
State the length that a round or flattened lead must be soldered onto a land.
State the acceptable heel fillet and soldered lead heights for a round or flattened leads.
State the allowable side overhang for chip components.
State the allowable fillet heights and solder bulging on chip components.
State the allowable solder joint thickness.
State the rejection criteria for body damage to a chip component.
State the allowable side overhang and termination overlap for a MELF component.
State the allowable fillet width and height for a MELF component.
Identify bottom-only termination parts (BGA devices).
State the allowable side and end overhang for bottom-only termination parts.
State the allowable mounting height for bottom-only termination parts.
State the allowable side and end overhang for butt-joint lead.

Module 6: Discrete Wires and Jumpers

Introduction.
State the requirements for insulation and end tails on a wire wrap lead.
Describe how to count the number of raised turns on a terminal.
Describe the plating requirements or damage on discrete wire.
Recognize that the routing of jumper wires may be predetermined.
Define staking jumper wires.
State where jumper wires cannot be staked.
Describe the function of jumper wires and how to attach them to through-hole leads.
Adding jumper wires to SMT components.

Module 7: Conformal Coating and Solder Mask

Introduction.
Define different terms used to describe lamination separation.
Define the terms land, pad, via and trace.
State when lifted lands are acceptable.
Describe solder mask defects.
State the criteria for silkscreen ort metal layer markings on a board.
State the purpose of a bar code label and what is acceptable.
State conformal coating application requirements.
State the applicable adherence criteria for conformal coatings.
State the rework requirements for conformal coatings.

Module 8: Process Control and Health

Introduction.
State what is required to control a process.
State how process controls create data and lead to corrective actions.
State when training is required for an SPC system.
State the power of magnification required for inspecting.
Identify BGA parts and describe how to inspect solder joints.

You may want to check out the multi-user course license solutions we offer to corporations and universities that need to train 100 or more people.

Target Audience

Both engineers, and entry-level production personnel will find this course very informative.

Purchasing
Production Line Supervisors
Process Engineers
QA Engineers
Manufacturing Personnel

Course Prerequisites

Must be well versed in Revision B of the documents, IPC certified or equivalent.

Average Curriculum Length

3.0 hours

Testing

Includes both pre-testing and post testing.

Online Content Index

Available

Begin Course

After your order is processed by the course administrator, you will receive an email which will contain your username, password and detailed information on how to begin your web-based course. You will be able to start the course(s) you have selected the same day you place your order.

Certificate of Completion

Certificate of Completion will be supplied upon request after you have completed the online course.

Author and Subject Matter Expert: James C. Blankenhorn, President and Chief Executive Officer

Mr. Blankenhorn is the founder and president of TechEdge Online. His experience includes 33 years in electronics, 10 years in semiconductor design and management for TI, Motorola and Honeywell. He has 20 years in managing start-ups including Test International, AWI and SMT Plus. He held the position of VP for Jabil Circuit during a period of rapid growth from $100M to $400M. Mr Blankenhorn holds a Bachelor of Science in Electrical Engineering degree from Arizona State University and is a founding member of the SMTA organization. He has authored over 20 books on SMT and related technologies. He is a featured speaker at many conferences and seminars.

System Requirements

High speed Internet Connection (DSL, cable, ISDN 128)
Browser: Explorer 4.01 Service Pack 2 (or greater), or Netscape 4.7 (or greater). Explorer 5 is recommended
Flash 4 or greater plug-in
16 bit colour, 800 x 600 resolution (minimum requirement)
Audio card (optional)
200 megahertz minimum, 300 megahertz recommended
32 RAM minimum, 64 RAM recommended
50 mb of available disk cache space

Refund Policy

If this material does not meet your expectations as outlined in the course description, you have 3 working days from the date of registration to obtain a 100% refund of the course fee. Please contact us if you have any further questions regarding this guarantee.

Multi-User Online Course License

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NT 4/2000 Server
500mhz p2/p3/amd athlon
256 RAM (512 recommended)
IIS, PWS or compatable web server software
SQL or Access 2000 ODBC compliant database driver
Coldfusion Aplication Server 4.0 or higher [ click here ] for more info on coldfusion

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More Information:

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