1.0 Foreword 110-4102 Micro Drill System 110-5202 Eyelet Press 115-1322 Epoxy Kit 115-1402 Tech-Pro Tool Kit 115-3118 Circuit Bonding System 2.0 Basic Procedures 2.1 Handling Electronic Assemblies 2.2.1 Cleaning, Local 2.2.2 Cleaning, Aqueous Batch Process 2.3.1 Coating Removal, Identification of Coating 2.3.2 Coating Removal, Solvent Method 2.3.3 Coating Removal, Peeling Method 2.3.4 Coating Removal, Thermal Method 2.3.5 Coating Removal, Grinding / Scraping Method 2.3.6 Coating Removal, Micro Blasting Method 2.4.1 Coating Replacement, Solder Mask 2.4.2 Coating Replacement, Conformal Coating, Encapsulant 2.4.3 Coating Replacement, Solder Mask, BGA Locations 2.5 Baking and Preheating 2.6.1 Legend Marking, Stamping Method 2.6.2 Legend Marking, Hand Lettering Method 2.6.3 Legend Marking, Stencil Method 2.7 Epoxy Mixing and Handling 201-1100 Micro Pad Repair Kit 201-1110 Land Repair Kit 201-1120 Gold Contact Repair Kit 201-1130 Circuit Bonding Evaluation Kit 201-2100 Professional Repair Kit 201-2110 Circuit Repair Training Kit 201-3110 Base Board Repair Kit 201-3120 Flextac BGA Rework Stencil Kit 201-3130 Circuit Track Kit 201-3140 Plated Hole Repair Kit 201-4150 Soldering Skills Practice Kit 201-4250 Rework Skills Practice Kit 201-4350 Repair Skills Practice Kit 201-6100 Gold Contact Plating Kit 3.0 Base Board Procedures 3.1 Delamination / Blister Repair, Injection Method 3.2 Bow and Twist Repair 3.3.1 Hole Repair, Epoxy Method 3.3.2 Hole Repair, Transplant Method 3.4.1 Key and Slot Repair, Epoxy Method 3.4.2 Key and Slot Repair, Transplant Method 3.5.1 Base Material Repair, Epoxy Method 3.5.2 Base Material Repair, Area Transplant Method 3.5.3 Base Material Repair, Edge Transplant Method 4.0 Conductor Procedures 4.1.1 Lifted Conductor Repair, Epoxy Seal Method 4.1.2 Lifted Conductor Repair, Film Adhesive Method 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method 4.2.3 Conductor Repair, Welding Method 4.2.4 Conductor Repair, Surface Wire Method 4.2.5 Conductor Repair, Through Board Wire Method 4.2.6 Conductor Repair, Inner Layer Method 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method 4.3.1 Circuit Cut, Surface Circuits 4.3.2 Circuit Cut, Inner Layer Circuits 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method 4.4.1 Lifted Land Repair, Epoxy Seal Method 4.4.2 Lifted Land Repair, Film Adhesive Method 4.5.1 Land Repair, Epoxy Method 4.5.2 Land Repair, Film Adhesive Method 4.6.1 Edge Contact Repair, Epoxy Method 4.6.2 Edge Contact Repair, Film Adhesive Method 4.6.3 Edge Contact Repair / Rework, Plating Method 4.7.1 Surface Mount Pad Repair, Epoxy Method 4.7.2 Surface Mount Pad Repair, Film Adhesive Method 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method 4.7.4 Surface Mount, BGA Pad with Integral Via Repair 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method 426DLX Xytronic Fume Extractors 5.0 Plated Hole Procedures 5.1 Plated Hole Repair, No Inner Layer Connection 5.2 Plated Hole Repair, Double Wall Method 5.3 Plated Hole Repair, Inner Layer Connection 6.0 Jumper Wires and Component Modification Procedures 6.1 Jumper Wires 6.2.1 Jumper Wires, BGA Components, Circuit Track Method 6.2.2 Jumper Wires, BGA Components, Through Board Method 6.3 Component Modifications and Additions 6.4 Component Lead Cutting and Lifting 7.0 Soldering Procedures 7.1.1 Soldering Basics 7.1.2 Preparation For Soldering And Component Removal 7.1.3 Solder Joint Acceptance Criteria 7.2.1 Soldering Through Hole Components, Point To Point Method 7.2.2 Soldering Through Hole Components, Solder Fountain 7.3.1 Soldering Surface Mount Chip Components, Point To Point Method 7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method 7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method 7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method 7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method 7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method 7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method 7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method 8.0 Rework Procedures 8.1.1 Component Removal, Through Hole Components, Vacuum Method 8.1.2 Component Removal, Through Hole Components, Solder Fountain Method 8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method 8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method 8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method 9.0 BGA Component Rework Procedures 9.1.1 BGA Component Rework Process Flow 9.1.2 BGA Component Rework Inspection 9.2.1 BGA Component Rework Profile Development, Standard Method 9.2.2 BGA Component Rework Profile Development, Smart Track Method 9.3.1 BGA Component Rework, Eutectic Solder Ball 9.4.1 BGA Component Reballing, Fixture Method Base Board Repair Products BGA Prototyping Circuit Boards from Schmartboard Bonding Tips Boom Stands for HEI Microscopes: Standard Boom Stands, Big Base, Clamp & U-Base Boom Stands Capacitor Kits - Surface Mount Capacitor Kits Capacitor Manufacturers Chip Scale (QFN) Prototyping Circuit Boards from Schmartboard Circuit Board Repair and Rework Guide Circuit Board Repair and Rework Products Circuit Board Repair Training and Practice Kits Circuit Boards - Prototyping Boards from Schmartboard Circuit Frames Color Agents Conductor and Contact Repair Products Connector Manufacturers Copyright Notice and Disclaimer Desoldering Gun | TP100AS Goot Portable Desoldering Gun with Case Development Boards from Schmartboard Discrete Surface Mount Component Prototyping Circuit Boards from Schmartboard Dual Arm Boom Stands for HEI Microscopes E-Arms, 76mm E-Arms, 39mm E-Arms, Bausch and Lomb E-Arms EIA Capacitance Code Electronics Industry Organizations Engineering Kits for Design Engineers Engineering Publications Engineering References Eyelets Eyepieces and Accessories for HEI SZII Stereo Zoom Microscopes Eyepieces, Auxiliary Lens, Covers and Reticles for HEI Scope Stereo Zoom Microscopes Flextac Wire Dots HAP60 Optional Hot Air Pencil for SMD Rework from Xytronic HAP80 Xytronic Optional Lead Free Hot Air Pencil HEI CCD Color Camera HEI Fiber Optic Illuminators and Accessories HEI Fluorescent Ring Light and Accessories HEI Microscope Articulating Arm Stand and Hydraulic Boom Stands HEI USB v2.0 MegaPixel Color CMOS Camera HEI-FG-FB Frame Grabber Card for Video Inspection Station for Windows, XP and Vista HEI-MP10-USB Stereo Zoom Microscope Package with USB Camera HEI-MP2-DP Stereo Zoom Microscope Package HEI-MP4-FR Stereo Zoom Microscope Package HEI-MP5-AR Stereo Zoom Microscope Package HEI-MP5-DP Stereo Zoom Microscope Package HEI-MZ-USB Micro Zoom Video Inspection System HEI-MZ-VS2 Micro Zoom Video Inspection System HEI-MZ-VS3 Micro Zoom Video Inspection System HEI-MZ-VSF Micro Zoom Video Inspection System with Frame Grabber IR610 Xytronic Infra Red PC Board Pre-Heater (Digital PID Operation) Jumpers, Cables and Headers for Circuit Prototyping from Schmartboard LCD Zoom Microscope - HeiScope LCD Zoom Inspection System Lead Free Soldering / Desoldering Station Xytronic LF-8000 LF-1600 Xytronic Lead Free Soldering Station LF-3000 Xytronic Lead Free Soldering Station LF-369D Xytronic Mini-type Lead Free Soldering Station LF-852D Xytronic Lead Free SMD Hot Air Station LF-853DTP Xytronic Lead Free Multi-Function SMD Rework Station LF-8800 and LF-8800TP Xytronic Lead Free Digital Soldering and Desoldering Stations LF8800 LF852DTP Complete Lead Free Thru-Hole and SMD Rework System from Xytronic Mechanical Bridge for Schmartboard Circuit Boards Multi Component SMT Parts Kit for Engineers Multi Component SMT Parts Kit for Students Multi Component SMT Parts Kits NPO Ceramic Chip Capacitor Kit for Engineers 0402 size NPO Ceramic Chip Capacitor Kit for Engineers 0603 size NPO Ceramic Chip Capacitor Kit for Engineers 0805 size NPO Ceramic Chip Capacitors - 0402 chip package NPO Ceramic Chip Capacitors - 0603 chip package NPO Ceramic Chip Capacitors - 0805 chip package Plated Hole Repair Products PLCC Prototyping Circuit Boards from Schmartboard Power Modules - SchmartModules from Schmartboard Prototyping Circuit Boards for SMT Connectors from Schmartboard QFP Prototyping Circuit Boards from Schmartboard Resistor Kits - Surface Mount Resistor Kits Resistor Manufacturers Rework Kits RX-802AS Goot Lead Free Soldering Stations Search Semiconductor Manufacturers Site Map SOIC Prototyping Circuit Boards from Schmartboard Solder Pot | POT-200C-S17 Goot Lead Free Large Soldering Pot 110V Solder Pot | POT-22C Goot Temperature Controlled Lead Free Soldering Pot 110V Solder Pot | POT-23C Goot Lead Free Soldering Pot with Ceramic Solder Bath 110V Solder Pot | POT-400C Goot Lead Free Large Soldering Pot 220V Standard Track Stands, Halogen / Fluorescent Track Stand, and LED Illuminated Track Stands Stereo Zoom Microscopes from HEI Scope Surface Mount Zener Diode Kits Surface Mount Component Storage Unit Surface Mount Electronic Component Engineering Kits Surface Mount Electronic Component Refills Surface Mount Equipment Manufacturers Surface Mount Resistor Kit for Engineers 0402 size 1% Surface Mount Resistor Kit for Engineers 0603 size 1% Surface Mount Resistor Kit for Engineers 0805 size 5% Surface Mount Resistors - 1% - 0402 chip package Surface Mount Resistors - 1% - 0603 chip package Surface Mount Resistors - 5% - 0805 chip package Surface Mount Zener Diodes - sot-23 package Surface Mount Zener Diodes Kit for Engineers Switch Manufacturers Tantalum Chip Capacitor Kit for Engineers Tantalum Chip Capacitors Tatung 14" Color Monitor (450 TV Lines) Composite and S-Video Ready Through Hole Prototyping Circuit Boards from Schmartboard TWZ100 SMD Tweezers from Xytronic TWZ60 Optional Tweezers for SMD Rework TWZ90 Optional Tweezers for SMD Rework from Xytronic X7R / X5R Ceramic Chip Capacitor Kit for Engineers 0402 size X7R Ceramic Chip Capacitor Kit for Engineers 0603 size X7R Ceramic Chip Capacitor Kit for Engineers 0805 size X7R Ceramic Chip Capacitors - 0603 chip package X7R Ceramic Chip Capacitors - 0805 chip package X7R/X5R Ceramic Chip Capacitors - 0402 chip package Xytronic 850D Digital Hot Air SMD Rework System Xytronic 988D Digital Soldering and Desoldering Station Xytronic HV-2 Duovac Fume Extractor (Floor Mount) Xytronic LF-2000 Lead Free Digital Soldering Stations Zener Diode Reference Chart: SOT-23 Mini/MELF Case

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