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0.1" Spacing 40-Single Row Headers 0.1" Spacing 80-Dual Row Headers 0603/0805/1206/SOD-123/sot-23/SOT-223 12" Jumpers 2.1 Handling Electronic Assemblies 2.2.1 Cleaning, Local 2.2.2 Cleaning, Aqueous Batch Process 2.3.1 Coating Removal, Identification of Coating 2.3.2 Coating Removal, Solvent Method 2.3.3 Coating Removal, Peeling Method 2.3.4 Coating Removal, Thermal Method 2.3.5 Coating Removal, Grinding / Scraping Method 2.3.6 Coating Removal, Micro Blasting Method 2.4.1 Coating Replacement, Solder Mask 2.4.2 Coating Replacement, Conformal Coating, Encapsulant 2.4.3 Coating Replacement, Solder Mask, BGA Locations 2.5 Baking and Preheating 2.6.1 Legend/Marking, Stamping Method 2.6.2 Legend Marking, Hand Lettering Method 2.6.3 Legend Marking, Stencil Method 2.7 Epoxy Mixing and Handling 3" Jumpers 3.3.2 Hole Repair, Transplant Method 3.5.1 Base Material Repair, Epoxy Method 3.5.3 Base Material Repair, Edge Transplant Method 3G Future Trends 3G Network Access Technology 4.1.1 Lifted Conductor Repair, Epoxy Seal Method 4.1.2 Lifted Conductor Repair, Film Adhesive Method 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method 4.2.3 Conductor Repair, Welding Method 4.2.4 Conductor Repair, Surface Wire Method 4.2.5 Conductor Repair, Through Board Wire Method 4.2.6 Conductor Repair, Inner Layer Method 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method 4.3.1 Circuit Cut, Surface Circuits 4.3.2 Circuit Cut, Inner Layer Circuits 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method 4.4.1 Lifted Land Repair, Epoxy Seal Method 4.4.2 Lifted Land Repair, Film Adhesive Method 4.5.1 Land Repair, Epoxy Method 4.5.2 Land Repair, Film Adhesive Method 4.6.1 Edge Contact Repair, Epoxy Method 4.6.2 Edge Contact Repair, Film Adhesive Method 4.6.3 Edge Contact Repair / Rework, Plating Method 4.7.1 Surface Mount Pad Repair, Epoxy Method 4.7.2 Surface Mount Pad Repair, Film Adhesive Method 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method 4.7.4 Surface Mount, BGA Pad with Integral Via Repair 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method 426DLX Xytronic Fume Extractor 5" Jumpers 5.1 Plated Hole Repair, No Inner Layer Connection 5.2 Plated Hole Repair, Double Wall Method 5.3 Plated Hole Repair, Inner Layer Connection 6.1 Jumper Wires 6.2.1 Jumper Wires, BGA Components, Circuit Track Method 6.2.2 Jumper Wires, BGA Components, Through Board Method 6.3 Component Modifications and Additions 6.4 Component Lead Cutting and Lifting 7" Jumpers 7.1.1 Soldering Basics 7.1.2 Preparation For Soldering And Component Removal 7.1.3 Solder Joint Acceptance Criteria 7.2.1 Soldering Through Hole Components, Point To Point Method 7.2.2 Soldering Through Hole Components, Solder Fountain 7.3.1 Soldering Surface Mount Chip Components, Point To Point Method 7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method 7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method 7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method 7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method 7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method 7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method 7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method 8.1.1 Component Removal, Through Hole Components, Vacuum Method 8.1.2 Component Removal, Through Hole Components, Solder Fountain Method 8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method 8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method 8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method Assembly Inspection and Defects Base Board Repair Kit 201-3110 Base Board Repair Products Basics of SMT: Training Manufacturing Personnel BGA Design BGA Rework Repair Bonding Tips Cable Design Service Capacitors CDMA 1 and CDMA 2000 CDMA System Harmonization CDMA Transmission Cellular Transmission Circuit Board Repair and Rework Circuit Board Repair and Rework Guide | 1.0 Foreword Circuit Board Repair Training and Practice Kits Circuit Bonding Evaluation Kit 201-1130 Circuit Bonding System Circuit Frames Circuit Repair Training Kit 201-2110 Circuit Track Kit 201-3130 Color Agents Component Manufacturers Conductor and Contact Repair Products Configurations for UWC-136 Conformal Coating and Solder Mask Connectors Connectors, Terminals and Wires Copyright Notice Crystals Designing Using BGA and Flip Chip Technology Discrete Wires and Jumpers Down Load Channels and Modes Dual Arm Boom Stands for HEI Microscopes E-Arms, 76mm E-Arms, 39mm E-Arms, Bausch and Lomb E-Arms EIA Capacitance Code Electronics Industry Organizations Elements of the RF System Engineering Charts Engineering Kits for Design Engineers Engineering Publications Engineering References Engineering Research Epoxy Kit 115-1322 Extremely Dense Designs and DFM Eyelet Press 110-5202 Eyelets Eyepieces and Accessories for HEI SZII Stereo Zoom Microscopes Eyepieces, Auxiliary Lens, Covers and Reticles Factors Affecting RF System Design Fans Fiber Optic Channel Operation Fiber Optics Future Fiber Optics Training Flextac BGA Rework Stencil Kit 201-3120 Flextac Tape Dots Flux, Solder and Cleaning Fundamentals of SMT Product Design Gold Contact Plating Kit 201-6100 Gold Contact Repair Kit 201-1120 Goot Spare Parts HAP60 Xytronic Optional Hot-Air Pencil for SMD Rework HAP80 Xytronic Optional Lead Free Hot Air Pencil Hardware Engineering Headers and Jumpers Headers and Jumpers HEI CCD Color Camera and Accessories HEI Fiber Optic Illuminators and Accessories HEI Fluorescent Ring Light and Accessories HEI Microscope Articulating Arm Stand, and Hydraulic Boom Stands HEI Microscope Standard Boom Stand, Big Base, Clamp, and U-Base Boom Stands HEI Scope Stereo Zoom Microscopes HEI USB v2.0 MegaPixel Color CMOS Camera HEI-FG-FP Frame Grabber for Video Inspection Station HEI-MP10-USB Stereo Zoom Microscope Package with USB Camera HEI-MP2-DP Stereo Zoom Microscope Package HEI-MP4-FR Stereo Zoom Microscope Package HEI-MP5-AR Stereo Zoom Microscope Package HEI-MP5-DP Stereo Zoom Microscope Package HEI-MZ-USB Micro Zoom Video Inspection System HEI-MZ-VS2 Micro Zoom Video Inspection System HEI-MZ-VS3 Micro Zoom Video Inspection System HEI-MZ-VSF Micro Zoom Video Inspection System with Frame Grabber HeiScope LCD Zoom Inspection System Inductors Intel Online SMT Training Classes Intro to 3G Technology Intro to Fiber Optic Networks Intro to SMT Intro to SMT Assembly: Training Manufacturing Personnel Intro to WCDMA Introduction to BGA Packages Introduction to Fiber Optics and Optical Networks Curriculum Introduction to SMT Assembly Curriculum Introduction to SMT Assembly of Electronic Products Introduction to SMT Design Introduction to SMT Manufacturing Land Patterns Made Simple Land Repair Kit 201-1110 LCDs Lead Free Solder Pot Goot POT-22C Lead Free Soldering / Desoldering Station Xytronic LF-8000 Lead Free Soldering Pot Goot POT-51C Lead Free Soldering Pot Goot POT-76C Lead Free Soldering Station Goot RX-802AS Lead Free Soldering Stations Xytronic LF-1000 LEDs Manufacturing Services Master Appliance Ecoheat Heat Gun and Kit Master Appliance Heat Guns Master Appliance Heat Guns and Heat Gun Kits Master Appliance Master-Mite ESD Heat Gun Master Appliance Master-Mite Heat Gun Master Appliance Proheat Heat Gun and Kit Master Appliance Proheat Variair Heat Gun and Kit Master Appliance Proheat Variair Heat Shrink System Master Appliance Proheat Varitemp Heat Gun and Kit Master Appliance Proheat Varitemp Heat Shrink System Master Appliance Varitemp Heat Gun and Kit Mechanical Bridge Micro Drill System 110-4102 Micro Pad Repair Kit 201-1100 Multi Component SMT Parts Kit for Engineers Multi Component SMT Parts Kit for Students Multi Component SMT Parts Kits Next Generation Wireless: 3G Overview Curriculum NPO Ceramic Chip Capacitor Kit for Engineers 0402 size NPO Ceramic Chip Capacitor Kit for Engineers 0603 size NPO Ceramic Chip Capacitor Kit for Engineers 0805 size NPO Ceramic Chip Capacitors - 0402 chip package - RoHS compliant NPO Ceramic Chip Capacitors - 0603 chip package NPO Ceramic Chip Capacitors - 0805 chip package On Site Surface Mount Technology Training Courses Online SMT Component and Land Pattern Library: Annual Subscriber Access Optical Amplifiers PCB Design of High Speed Circuits PCB Design of High Speed Circuits Performing Rework and Repair on SMT, Fine Pitch, and BGAs Plated Hole Repair Kit 201-3140 Plated Hole Repair Products PLCC, 20 - 84 Pins 0.05" Pitch Populated RS-232 SchmartModule Power Supplies Principles of Fiber Optics Process Control and Health Procurement Services Professional Repair Kit 201-2100 Putting Buried Resistors into Your Printed Circuit Board QFP, 100 Pins 0.65mm Pitch QFP, 32 - 100 Pins 0.5mm Pitch QFP, 32 - 64 Pins 0.8mm Pitch Reballing BGAs Relays Repair Skills Practice Kit 201-4350 Resistors Rev B to C Changes for IPC-A-610 and J-STD-001 Rework Kits Rework Skills Practice Kit 201-4250 RF and Wireless Access Methods RF and Wireless Key Concepts RF and Wireless Made Simple Curriculum RF and Wireless Signal Processing RF and Wireless Signal Propagation SchmartBoard - The world's best circuit prototyping system Schmartboard 12 Part I / O Combo Pack Schmartboard 26 Part Combo Pack Schmartboard Chip Scale Design Kit "EZ" Schmartboard QFP/PLCC Design Kit "EZ" Schmartboard SO Design Kit "EZ" SchmartBoard|ez Chip Scale, 10 Pins and 32 pins, .5mm Pitch SchmartBoard|ez Chip Scale, 12 Pins to 24 Pins .5mm & .65mm SchmartBoard|ez Chip Scale, 56 Pins, 0.5mm Pitch SchmartBoard|ez Chip Scale, 64 Pins 0.5mm Pitch SchmartBoard|ez Chip Scale, 8 Pins and 48 Pins 0.5mm Pitch SchmartBoard|ez PLCC, 20-84 Pins 0.05" Pitch SchmartBoard|ez QFP 64-100 Pins, 0.4mm Pitch SchmartBoard|ez QFP, 32-100 Pins 0.5mm Pitch SchmartBoard|ez QFP, 32-80 Pins 0.8mm Pitch SchmartBoard|ez QFP, 36-100 Pins 0.65mm Pitch SchmartBoard|ez SO, 4 - 56 Pins SchmartBoard|ez SOP, 4 - 72 Pins 0.4mm Pitch SchmartBoard|ez SOP, 4 - 72 Pins 0.5mm Pitch SchmartBoard|ez SOP, 4 - 72 Pins 0.65mm Pitch SchmartBoard|ez SOP, 4 - 72 Pins 0.8mm Pitch SchmartBoard|ez SOP, 4-72 Pins 0.635mm Pitch Search Semiconductors Setting Up and Performing Printing SMT and Fine Lead Repair Rework Curriculum SMT and Through-Hole Workmanship Standards Curriculum SMT Component Desoldering SMT Component Soldering SMT Component Workmanship SMT High Density Design and DFM SMT High Density Design and DFM SMT Zener Diode Kits SMT, PTH Soldering and Handling Snap Circuits 300-in-1 SC-300 Snap Circuits Extreme 750 Snap Circuits Junior Model SC-100 Kit Snap Circuits Pro 500 Experiments SO, 4 - 56 Pins Solder Tip Care and ESD Protection Solder Tip Uses, Shapes and Temperatures Soldering Skills Practice Kit 201-4150 SOP, 4 - 72 Pins 0.4mm Pitch SOP, 4 - 72 Pins 0.5mm Pitch SOP, 4 - 72 Pins 0.65mm Pitch SOP, 4 - 72 Pins 0.8mm Pitch Standard Track Stands, Halogen/Fluorescent Track Stand, and LED Illuminated Track Stands Standards, Terminology and ESD Steinel HG2310LCD Hot Air Gun, Heat Gun Professional Series Steinel HL1810S Professional Series Hot Air Gun, Heat Gun Steinel HL1910E Hot Air Gun, Heat Gun Steinel HL2010E Hot Air Gun, Heat Gun Professional Series Steinel Hot Air Gun HG4000E Steinel Industry Specific Heat Gun Kits Surface Mount Capacitor Kits Surface Mount Component Storage Unit Surface Mount Electronic Component Engineering Kits Surface Mount Electronic Component Refills Surface Mount Equipment Manufacturers Surface Mount Resistor Kit for Engineers 0402 size 1% Surface Mount Resistor Kit for Engineers 0603 size 1% Surface Mount Resistor Kit for Engineers 0805 size 5% Surface Mount Resistor Kits Surface Mount Resistors - 1% - 0402 chip package Surface Mount Resistors - 1% - 0603 chip package Surface Mount Resistors - 5% - 0805 chip package Surface Mount Technology Design and Manufacturing Books Surface Mount Technology Training Surface Mount Zener Diodes - sot-23 package Surface Mount Zener Diodes Kit for Engineers Switches Tantalum Chip Capacitor Kit for Engineers Tantalum Chip Capacitors Tatung 14" Color Monitor (450 TV Lines) Composite and S-Video Ready Tech-Pro Tool Kit 115-1402 Test and Design Strategies for Successful Testing of SMT High-Density PCBs The Basics of Soldering The Basics of Solder Paste The Future of Wireless Through Hole 0.1" Spacing With 0.05" Offset Through Hole 0.1" Spacing With 0.05" Offset Through Hole 2mm Spacing With 1mm Offset Through Hole ATX Power Connector Through Hole Audio/RCA Jack Through Hole DB 25 Connector Through Hole JTAG 20 Pins 0.1" SP & IEEE1394 Connector Through Hole Power and Ground Strip Through Hole Power Connector and Power Jack Through Hole RGB 15 Pins Connector Through Hole RJ11/45 and USB Connector Through Hole Switches Through-Hole Mounting and Assembly TP100AS Goot Portable Desoldering Gun w/Case Track Your Order Troubleshooting SMT Processes and DFM Troubleshooting the SMT / FPT Process TWZ100 SMD Tweezers for Xytronic Lead Free Soldering Stations TWZ60 Optional Tweezers for SMD Rework Understanding and Setting Up Reflow Profiles Understanding and Using Stencils Understanding and Using Surface Mount and Fine Pitch Technology Uplink Channels and Modes Using Solder Paste for Leaded Parts in SMT Assemblies WCDMA Coding and Interleaving WCDMA Compatibility and Operation WCDMA Fundamentals Curriculum WCDMA Proposals WCDMA Receivers WCDMA System Controls Wireless Communication Systems Wireless Publications Wireless Related Organizations Wireless Technology Training Courses X7R / X5R Ceramic Chip Capacitor Kit for Engineers 0402 size X7R Ceramic Chip Capacitor Kit for Engineers 0603 size X7R Ceramic Chip Capacitor Kit for Engineers 0805 size X7R Ceramic Chip Capacitors - 0603 chip package X7R Ceramic Chip Capacitors - 0805 chip package X7R/X5R Ceramic Chip Capacitors - 0402 chip package Xytronic 850D Digital Hot Air SMD Rework System Xytronic 988 or 968 Desoldering Pump & Hand Piece Repair Kit Xytronic 988D Digital Soldering and Desoldering Station Xytronic Five Diopter Magnifying Fluorescent Work Light JF-33CB-5X Xytronic HV-2E Fume Extractor (Floor Mount) Xytronic IR610 Infra Red PC Board Pre-Heater (Digital PID Operation) Xytronic New Style LF-8800 and LF-8800TP Lead Free Digital Soldering and Desoldering Station Xytronic Spare Parts Your Transition to Lead Free Course (RoHS, WEEE) Zener Diode Reference Chart: SOT-23 Mini/MELF Case