Circuit Board Repair Guide > Component Removal > 8.2.2 Hot Tweezer Method for Chip Component Removal

Hot Tweezer Method for Chip Component Removal

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This procedure covers the hot tweezer method for chip component removal.

Note
The goal when removing any component is to remove the component as quickly as possible.

Caution - Glued Components
A small dot of epoxy is often used to hold chip components in position during wave soldering processing. Typically these components will be located on the bottom side of a circuit board that has through hole components located on the other side. Whenever you see a board like this, you can generally assume that the chip components will be glued onto the board. You'll need to leave the tip on the component for one or two additional seconds in order to transfer enough heat to overcure or soften the adhesive. If required take a wooden stick or curved tweezers and push the component sideways until the glue joint finally gives way.

 
Surface mount chip component soldered on circuit board
Surface Mount Chip Component
IPC Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies
 
Related Procedure References
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
CTC 7.1.1 Quality Soldering Basics
CTC 7.1.2 Preparing Circuit Boards and Soldering Tools for
Soldering and Component Removal
IPC7711 3.3.2 Tweezer Method

Tools and Materials
Caliper
Cleaner
Flux, Liquid
Hot Tweezer Tool with Tips      
Microscope
Solder
Wipes


Printed Board Type: R/F/C  |  Skill Level: Intermediate  |  Conformance Level: High  |  Rev.: D  |  Rev. Date: Jul 7, 2000

Note
Determine the direction the part is to be swept off the circuit board surface. Densely packed circuit board assemblies often leave only one direction for the rework tool to follow when sweeping the part off the surface.

When solder melts lift component off circuit board

Figure 1: Place the tweezer tips in position. When the solder melts, lift
the component off the circuit board.



Chip Capacitors generally have solid color bodies

Chip capacitors generally have solid color bodies.



Striped or beveled end is positive (+) or anode end

A - Stripe
B - Beveled Surface
The striped or beveled end is
the "positive" (+) or "anode end".


1.  Tin the hot tweezer tip.
   
2.  Apply a small amount of liquid flux to both ends of the component.
   
3. 
Place the tweezer tips in contact with both ends of the component. When the solder melts, lift the component off the circuit board. (See Figure 1).
 
4.  Clean the area.



Links to Related Products


Prototyping Boards for Through Hole and SMT Components  
Prototyping Boards for Through Hole and SMT Components
These Schmartboard prototyping boards support through hole and surface mount components. This is the fastest and easiest electronic circuit prototyping system ever conceived.

The SchmartBoard|ez products are for people who may not have advanced soldering skills, first-timers, or just anyone who wants to have a fast, easy, and hassle-free experience.



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