| Circuit Board Repair and Rework Guide > 8.0 Rework Procedures > 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method |
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Caution - Glued Components
A small dot of epoxy is often used to hold chip components in position during wave soldering processing. Typically these components will be located on the bottom side of a circuit board that has through hole components located on the other side. Whenever you see a board like this, you can generally assume that the chip components will be glued onto the board. You'll need to leave the tip on the component for one or two additional seconds in order to transfer enough heat to overcure or soften the adhesive. If required take a wooden stick or curved tweezers and push the component sideways until the glue joint finally gives way.
Tools and Materials Caliper Cleaner Flux, Liquid Hot Tweezer Tool with Tips Microscope Solder Wipes
Note
Determine the direction the part is to be swept off the circuit board surface. Densely packed circuit board assemblies often leave only one direction for the rework tool to follow when sweeping the part off the surface.
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8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method |