|Circuit Board Repair Guide > Basic Circuit Board Repair Procedures > 2.7 Epoxy Mixing and Handling|
Epoxy Mixing and Handling
This section covers epoxy mixing and handling. The epoxy used in this procedure has multiple uses including solder mask repair, base board repair, circuitry over-coating and delamination repair.
For high strength or high temperature applications two part epoxies will generally have the best properties.
Epoxy (Circuit Bond) Specifications - No. 115-3302
The Epoxy referenced in this procedure has the following properties.
PC Board Preparation
The area where the epoxy is to be applied should be prepared prior to mixing the epoxy. This preparation may include preheating the affected area to improve absorption of the applied epoxy. The entire circuit board may also be heated in an oven or with a heat lamp.
Some components may be sensitive to high temperatures.
Procedure - Prepackaged Two Part Circuit Board Epoxy
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2.7 Epoxy Mixing and Handling