CS051063AS Circuit Frame, BGA Pads .051"/.063" dia., Tin PlatedCS051063AS Circuit Frame allows you to replace damaged BGA pads without the mess of liquid epoxy on bare or loaded circuit boards, with a bonding process that takes a mere 30 seconds. Circuit Frames come in a wide variety of shapes and sizes, all with a dry film adhesive backing, activated and cured with heat and pressure. Trim out the circuit you need and bond it to the circuit board surface using a bonding iron with the appropriate bonding tip. See the full list of Circuit Frames. See Professional Repair Kit which has everything you need to repair multiple types of board damage.
Shown Approximately 2X Actual Size
 |
| CS051063AS Circuit Frame, BGA Pads .051"/.063" dia. |
Special Order. Usually ships within 3 business days. How to purchase. For customer service call 1-519-651-3060.
|
| Part Number: |
CS051063AS |
| Description: |
Circuit Frame,
BGA Pads .051"/.063" dia., Lead Free |
| Application: |
Replacing damaged BGA pads.
How to Repair Damaged BGA Pads Using New Pads and Film Adhesive |
| Plating: |
Bright Tin (Lead Free): .0005" Tin minimum |
| Recommended Bonding
Tip: |
115-2204 |
| Overall Circuit Frame Size: |
2.25" x 1.50" |
| Base Material: |
Rolled annealed copper foil .0014" thick. |
| Adhesive Backing Material: |
Nitrile Phenolic film adhesive .002" thick. |
| Bonding Temperature: |
475F +/- 25F |
| Bonding Time: |
30 seconds |
| Peel Strength: |
8 lbs/inch |
| Shelf Life: |
6 months minimum, each
Circuit Frame is stamped with the expiration date.
Shelf-Life items may not be returned for credit. |
Import duties and Value Added Tax will be collected at time of delivery for all shipments outside the USA.
2CheckOut.com Inc. is a payment facilitator for goods provided by ELAB (Engineering Lab).
Payment methods accepted: American Express, Visa, MasterCard, Discover, Diners Club, JCB and Paypal. |
|
