CS015020AS Circuit Frame, BGA Pads .015" x .020", Tin Plated

CS015020AS Circuit Frame allows you to replace damaged BGA pads without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes. Circuit Frames come in a wide variety of shapes and sizes, all with a dry film adhesive backing, activated and cured with heat and pressure. Trim out the circuit you need and bond it to the circuit board surface using a Bonding Iron or Circuit Bonding System with the appropriate Bonding Tip. Bonding Iron and Bonding Tips must be purchased separately.

See the all-in-one Professional Repair Kit if you need to repair damaged circuit boards.

                      Shown Approximately 2X Actual Size
CS015020AS Circuit Frame, BGA Pads .015" x .020"
CS015020AS Circuit Frame, BGA Pads .015" x .020"


CS015020AS   Circuit Frame, BGA Pads .015"/.020" Diameter   US $44.00   View cart

Special Order. Usually ships within 3 business days. Ships From: Haverhill, MA, USA.

How to purchase. For customer service call 1-519-651-3060.

Import duties and Value Added Tax will be collected at time of delivery for all shipments outside the USA.

2CheckOut (2CO) is a payment facilitator for goods provided by ELAB (Engineering Lab).


Part Number: CS015020AS
Description: Circuit Frame, BGA Pads .015"/.020" (.381 mm/.508 mm) Diameter
Plating - Bright Tin: .0001" (.0025 mm) Bright Tin (Lead Free)
RoHS Compliant: Compliant
Recommended Bonding Tip: 115-2201 (Bonding Iron and Bonding Tips must be purchased separately.)
Application: Replacing damaged BGA pads. BGA Pad Repair
Overall Circuit Frame Size: 2.25" x 1.50" (57mm x 38 mm)
Base Material: Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing: B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Bonding Temperature: 475°F +/- 25°F (246°C +/- 14°C)
Bonding Time: 30 seconds
Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life: 1 year minimum. Each Circuit Frame package is stamped with the expiration date.
Shelf-Life items may not be returned for credit.
See Also: Circuit Board Repair Kits


 
Bonding Iron and Bonding Tips

Bonding Tips fit into the hand held Bonding Iron (part no. 115-3102 for 120 VAC and part no. 115-3103 for 230 VAC) and the Circuit Bonding System (part no. 115-3118 which includes voltage converter for 120 VAC and 220 VAC). The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond the adhesive backed replacement pads, edge contacts, and lands to the circuit board surface. All our Bonding Tips are machined from high grade aluminum.

Image Description                                                            View cart Part Number
Bonding Iron 115-3102 Bonding Iron, 120 VAC, 115-3102

The Bonding Iron is set at the optimal temperature for curing the bonding film used to repair damaged surface mount pads, lands, edge contacts and other circuit board patterns. Bonding Tip is not included with purchase of Bonding Iron so remember to also select and purchase a Bonding Tip to match the shape of the new pad or circuit. Enlarge

115-3102

US $109.00

 

115-2201 Circular Tip .025"
Bonding Tip 115-2201

.025" (.635mm) Diameter

Circular

115-2201

US $45.00

 
Bonding Iron 115-3103 Bonding Iron, 230 VAC, 115-3103

The Bonding Iron is set at the optimal temperature for curing the bonding film used to repair damaged surface mount pads, lands, edge contacts and other circuit board patterns. Bonding Tip is not included with purchase of Bonding Iron so remember to also select and purchase a Bonding Tip to match the shape of the new pad or circuit. Enlarge

115-3103

US $179.00

 

Products above ship direct from manufacturer and are special order/non-returnable. Will ship within 3 business days.





ELAB (Engineering Lab)    Phone: 1-519-651-3060    Ships From: Haverhill, MA 01835 USA

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