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CS015020AS Circuit Frame, BGA Pads .015" x .020", Tin Plated

CS015020AS Circuit Frame allows you to replace damaged BGA pads without the mess of liquid epoxy on bare or loaded circuit boards, with a bonding process that takes a mere 30 seconds. Circuit Frames come in a wide variety of shapes and sizes, all with a dry film adhesive backing, activated and cured with heat and pressure. Trim out the circuit you need and bond it to the circuit board surface using a bonding iron with the appropriate bonding tip. See the full list of Circuit Frames.

If your company complies with ISO-9000, you can refer to this Circuit Board Repair Guide as your on-line reference.

See Professional Repair Kit which has everything you need to repair multiple types of board damage.

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CS015020AS Circuit Frame, BGA Pads .015" x .020"
CS015020AS Circuit Frame, BGA Pads .015" x .020"


CS015020AS   Circuit Frame, Lead Free   US $39.00   View cart

Special Order. Usually ships within 3 business days. How to purchase. For customer service call 1-519-651-3060.


Part Number: CS015020AS
Description: Circuit Frame, BGA Pads 0.015"/0.020" dia., Lead Free
Application: Replacing damaged BGA pads.
How to Repair Damaged BGA Pads Using New Pads and Film Adhesive
Plating: Bright Tin (Lead Free): .0005" Tin minimum
Recommended Bonding Tip: 115-2201
Overall Circuit Frame Size: 2.25" x 1.50"
Base Material: Rolled annealed copper foil .0014" thick.
Adhesive Backing Material: Nitrile Phenolic film adhesive .002" thick.
Bonding Temperature: 475F +/- 25F
Bonding Time: 30 seconds
Peel Strength: 8 lbs/inch
Shelf Life: 6 months minimum, each Circuit Frame is stamped with the expiration date.
Shelf-Life items may not be returned for credit.

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CS015020AS Circuit Frame, BGA Pads .015" x .020", Tin Plated