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 | | 4.1.1 Lifted Conductor Repair, Epoxy Seal Method
Rebond a lifted conductor with liquid epoxy.
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| | 4.1.2 Lifted Conductor Repair, Film Adhesive Method
Rebond a lifted conductor with film adhesive.
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| | 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
Uses foil jumper bonded with liquid epoxy.
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| | 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
Uses foil jumper bonded with film adhesive.
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| | 4.2.3 Conductor Repair, Welding Method
Replace damaged conductor by welding.
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| | 4.2.4 Conductor Repair, Surface Wire Method
Replace damaged conductor with jumper wire.
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| | 4.2.5 Conductor Repair, Through Board Wire Method
Replace damaged conductor with jumper wire.
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| | 4.2.6 Conductor Repair, Inner Layer Method
Advanced inner layer conductor repair.
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| | 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
Used to repair damaged surface planes.
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| | 4.3.1 Circuit Cut, Surface Circuits
Cut a surface circuit or conductor.
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| | 4.3.2 Circuit Cut, Inner Layer Circuits
Cut an inner layer circuit or conductor.
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| | 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method
Sever internal connection by drilling out hole.
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| | 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
Sever internal connection by cutting internal spokes.
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| | 4.4.1 Lifted Land Repair, Epoxy Seal Method
Rebond a lifted land with liquid epoxy.
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| | 4.4.2 Lifted Land Repair, Film Adhesive Method
Rebond a lifted land with film adhesive.
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| | 4.5.1 Land Repair, Epoxy Method
Replace damaged land with liquid epoxy.
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| | 4.5.2 Land Repair, Film Adhesive Method
Replace damaged land with film adhesive.
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| | 4.6.1 Edge Contact Repair, Epoxy Method
Replace damaged edge contacts with liquid epoxy.
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| | 4.6.2 Edge Contact Repair, Film Adhesive Method
Replace damaged edge contacts with film adhesive.
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| | 4.6.3 Edge Contact Repair / Rework, Plating Method
Replate damaged or solder contaminated edge contacts.
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| | 4.7.1 Surface Mount Pad Repair, Epoxy Method
Replace damaged SM pads with liquid epoxy.
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| | 4.7.2 Surface Mount Pad Repair, Film Adhesive Method
Replace damaged SM pads with film adhesive.
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| | 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
Replace damaged surface mount BGA pads with new dry film adhesive backed pads.
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| | 4.7.4 Surface Mount, BGA Pad with Integral Via Repair
Replace damaged BGA pads with integral via.
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| | 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
Replace damaged BGA pads with integral via.
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