|Circuit Board Repair Guide > Jumper Wires and Component Modification Procedures|
Chapter 6 - Jumper Wires and Component Modification ProceduresThis chapter of the circuit board repair guide includes excellent procedures for adding jumper wires and performing various component modifications.
CTC 6.1 Using Jumper Wires|
This procedure covers the repair/modification of printed boards and electronic assemblies by the use of jumper wires to complete electrical continuity between two points. Included are dozens of detailed illustrations and photographs.
CTC 6.2.1 Using Jumper Wires, BGA Components, Circuit Track Method|
This procedure is used to change a circuit path at a BGA site for engineering changes or modifications.
CTC 6.2.2 Using Jumper Wires, BGA Components, Through Board Method|
This procedure is used to add a jumper at a BGA site by running the jumper through a hole in the circuit board. This procedure is normally used for engineering changes or modifications.
CTC 6.3 Guidelines for Component Modifications and Additions|
This method covers the general guidelines for modifications that involve adding components.
CTC 6.4 Guidelines for Component Lead Cutting and Lifting|
This method covers the general guidelines for modifications that involve cutting and lifting component leads. Leads may be permanently cut or lifted due to engineering changes, or reconnected if done for testing purposes.
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Jumper Wires and Component Modification Procedures