Circuit Board Repair Guide > Jumper Wires and Component Modification Procedures > 6.4 Guidelines for Component Lead Cutting and Lifting

Guidelines for Component Lead Cutting and Lifting

Repair Circuit Boards | Repair SMT Pads | Repair BGA Pads | Repair Lands | Repair Edge Contacts
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This method covers the general guidelines for modifications that involve cutting and lifting component leads. Leads may be permanently cut or lifted due to engineering changes, or reconnected if done for testing purposes.

Related Procedure References
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 6.1 How to Use Jumper Wires

Tools and Materials
Cleaner
Cleaning Wipes
Cutters
Flux
Microscope
Pick
Soldering Station
Solder
Wood Stick

Note:
Specially designed cutters are required when cutting component leads.
 
Cutting and lifting component leads
Figure 1: Component Lead Cutting

Cutters used to cut component leads
Fig. 2: Specially designed cutters
used to cut component leads.

Printed Board Type: R/F/W/C  |  Skill Level: Advanced  |  Conformance Level: Medium

Place cutter at midpoint and cut lead

Figure 3: Place the cutter at the mid
point in the lead and snip through to
cut the lead.


Ensure lead has been severed

Figure 4: To ensure that the lead
has been severed, the upper
portion of the lead may be slightly
lifted using a pick.


PROCEDURE - Lead Cutting, Plated Through Hole Components
   
1. 
Select the component lead that needs to be cut and place the cutter in position. (See Figure 3). Place the cutter at the mid point in the lead and snip through to cut the lead.
 
2. 
To ensure that the lead has been severed, the upper portion of the lead may be slightly lifted using a pick. Visually inspect, or electrically test, to ensure that the lead has been severed.
   
3. 
If the lead needs to be reconnected, gently push the upper portion of the severed lead down until it touches the lower portion of the severed lead.
Solder severed leads together

Figure 5: If needed, solder both
halves of the severed lead together.


4.  Solder both halves of the severed lead together. (See Figure 5).
 
 
Note
The lower portion of the lead may move during soldering since it is not anchored in position.
 
5. 
If required, clean the flux residue and inspect.
Snip through to cut lead with cutter

Figure 6: Place the cutter at the mid
point in the lead and snip through to
cut the lead.


PROCEDURE - Lead Cutting, J Lead Components
   
1. 
Select the component lead that needs to be cut and place the cutter in position. (See Figure 6). Place the cutter at the mid point in the lead and snip through to cut the lead.
Ensure lead has been severed

Figure 7: To ensure that the lead has
been severed, the upper portion of
the lead may be slightly lifted using
a pick.


2. 
To ensure that the lead has been severed, the upper portion of the lead may be slightly lifted using a pick. (See Figure 7). Visually inspect, or electrically test, to ensure that the lead has been severed.
   
3. 
If the lead needs to be reconnected, gently push the upper portion of the severed lead down until it touches the lower portion of the severed lead.
Solder severed leads together

Figure 8: If needed, solder both
halves of the severed lead together.


4. 
Solder both halves of the severed lead together. (See Figure 8).
   
  Note
The lower portion of the lead may move during soldering since it is not anchored in position.
   
5.  If required, clean the flux residue and inspect.
Place pick behind component lead to be lifted

Figure 9: Gently place a pick behind
the component lead to be lifted. Apply
a soldering iron tip to the foot of the component lead. Apply slight force
with the pick to lift the lead as the soldering iron reflows the joint.


PROCEDURE - Lead Lifting, Standard Gull Wing Components
   
1. 
Select the component lead that needs to be lifted. Apply a soldering iron and solder braid to remove the excess solder from the joint.
 
2. 
Gently place a pick behind the component lead to be lifted. Apply a soldering iron tip to the foot of the component lead. Apply slight force with the pick to lift the lead as the soldering iron reflows the joint. (See Figure 9).
Ensure lead has been lifted

Figure 10: Visually inspect, or
electrically test, to ensure that the
lead has been lifted.


3. 
Visually inspect, or electrically test, to ensure that the lead has been lifted. (See Figure 10).
 
4. 
If the lead needs to be reconnected, gently push the lead down until it touches the pad and solder.
   
5. 
If required, clean the flux residue and inspect.
Place pick behind component to be lifted

Figure 11: Gently place a pick behind
the component lead to be lifted.
Apply a soldering iron tip to the foot
of the component lead. Apply slight
force with the pick to lift the lead as
the soldering iron reflows the joint.


PROCEDURE - Lead Lifting, Fine Pitch Gull Wing Components
   
1. 
Select the component lead that needs to be lifted. Apply a soldering iron and solder braid to remove the excess solder from the joint.
 
2. 
Gently place a pick behind the component lead to be lifted. Apply a soldering iron tip to the foot of the component lead. Apply slight force with the pick to lift the lead as the soldering iron reflows the joint. (See Figure 11).
Ensure lead has been lifted

Figure 12: Visually inspect, or
electrically test, to ensure that the
lead has been lifted.
3. 
Visually inspect, or electrically test, to ensure that the lead has been lifted. (See Figure 12).
 
4. 
If the lead needs to be reconnected, gently push the lead down until it touches the pad and solder.
   
5. 
If required, clean the flux residue and inspect.




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