2.3.3 Coating Removal, Peeling Method

This peeling removal method for coating can be used only under special circumstances. Normally this method is used to remove RTV silicone or other thick rubbery-like coating materials.

The coating material is removed using a dull knife or otherwise dull blade to slit the coating material and to peel it off the printed board or printed board assembly.

To determine the appropriate coating removal procedure the coating must first be identified. Refer to procedure number 2.3.1.
  Coating Removal Required At Outlined Area
Coating Removal Required
At Outlined Area
Note
This method is limited to coatings that are rubbery in nature to allow the coating material to be slit into small sections and peeled off the printed board assembly.

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Laminate Conditions
 
Procedure References
CTC 1.0 Foreword
CTC 2.1 Handling Electronic Assemblies
CTC 2.2 Cleaning
CTC 2.3.1 Coating Removal, Identification of Coatings
CTC 2.4.1 Coating Replacement, Solder Mask
CTC 2.4.2 Coating Replacement, Conformal Coatings/Encapsulants
IPC 7721 2.3.3 Coating Removal, Peeling Method see procedure below

Tools and Materials
Heated Blade or Thermal Parting Tool
Knife
Wood Sticks  

Procedure 2.3.3 Coating Removal, Peeling Method

Slit and peel off coating using a knife or heated blade.

Figure 1: Slit and peel off coating
using a knife or heated blade.


1.
Slit and peel off the coating material with a dull knife or heated dull blade. (See Figure 1).
 
2.
Repeat as needed until the required material is removed.
 
 
   
Removal complete.

Figure 2: Removal complete.
Evaluation
   
1.
Visual examination or UV light may be used to verify complete removal of coating



Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | 2.1 Handling Electronic Assemblies | 2.2.1 Cleaning, Local | 2.2.2 Cleaning, Aqueous Batch Process | 2.3.1 Coating Removal, Identification of Coating | 2.3.2 Coating Removal, Solvent Method | 2.3.3 Coating Removal, Peeling Method | 2.3.4 Coating Removal, Thermal Method | 2.3.5 Coating Removal, Grinding / Scraping Method | 2.3.6 Coating Removal, Micro Blasting Method | 2.4.1 Coating Replacement, Solder Mask | 2.4.2 Coating Replacement, Conformal Coating, Encapsulant | 2.4.3 Coating Replacement, Solder Mask, BGA Locations | 2.5 Baking and Preheating | 2.6.1 Legend/Marking, Stamping Method | 2.6.2 Legend Marking, Hand Lettering Method | 2.6.3 Legend Marking, Stencil Method | 2.7 Epoxy Mixing and Handling


2.3.3 Coating Removal, Peeling Method