|This coating removal method can be used only under special
circumstances. Normally the peeling method is used to remove
RTV silicone or other thick rubbery-like coating materials.
The coating material is removed using a dull knife or
otherwise dull blade to slit the coating material and to
peel it off the printed circuit
board or printed circuit board assembly.
the appropriate coating removal procedure the coating must
first be identified. Refer to procedure number 2.3.1.
Coating Removal, Identification
This method is
limited to coatings that are rubbery in nature to allow
the coating material to be slit into small sections and
peeled off the printed board assembly.
At Outlined Area