2.3.5 Coating Removal, Grinding / Scraping Method

This coating removal method uses various grinding and scraping tools, depending on the composition of the coating material. A knife or dental style scraper is normally used when a scraping method is desired. A hand held drill is normally used when a grinding technique is desired. A wide variety of rotary abrasive materials including ball mills may be required. To determine the appropriate coating removal procedure the coating must first be identified. Refer to procedure number 2.3.1.

Caution
Abrasion operations can generate electrostatic charges.
  Coating Removal Required At Outlined Area
Coating Removal Required
At Outlined Area


Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Laminate Conditions
 
Procedure References
CTC 1.0 Foreword
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 Cleaning, Local
CTC 2.2.2 Cleaning, Aqueous Batch Process
CTC 2.3.1 Coating Removal, Identification of Coatings
CTC 2.4.1 Coating Replacement, Solder Mask
CTC 2.4.2 Coating Replacement, Conformal Coatings/Encapsulants
IPC 7721 2.3.5 Coating Removal, Grinding/Scraping Method see procedure below

Tools and Materials
Ball Mills
Brushes
Cleaner
Micro-Drill System
Microscope
Knife
Rubberized Abrasives
Scraper
Wipes
Wood Sticks  

Procedure 2.3.5 Coating Removal, Grinding/Scraping Method

Scrape away damaged or unwanted coating with a knife or scraper.

Figure 1: Scrape away damaged or unwanted coating with a knife or scraper.


Rubberized abrasives are best used to remove thin, hard coatings.

Figure 2: Rubberized abrasives are
best used to remove thin, hard
coatings.


Procedure - Scraping
   
1.
Clean the area.
 
2. Remove the damaged or unwanted coating or solder mask using a knife or scraper. Hold the blade perpendicular to the coating and scrape from side to side until the desired material is removed. (See Figure 1).
 
3.
Remove all loose material and clean the area.
 




Procedure - Grinding
   
1. Clean the area.
 
2. Insert an abrasive tip into the hand held drill. Abrade away the damaged or unwanted coating. Move the tool from side to side to prevent damage to the circuit board surface. (See Figure 2).
   
3. Remove all loose material and clean the area
 
Note
Rubberized abrasives of the proper grade and grit are ideally suited for removing thin hard coatings from flat surfaces but not for soft coatings since these would cause the abrasive to "load up" with coating material and become ineffective.

Rotary brushes are best used to remove soft coatings.

Figure 3: Rotary brushes are best
used to remove soft coatings.


Rotary brushes are better suited than rubberized abrasives on contoured or irregular surfaces, such as soldered connections, etc., since the bristles will conform to surface irregularities while removing hard or soft coatings. (See Figure 3).
 
Note
The procedure for removing thick coatings is primarily to reduce their thickness to a thin coating and then to remove the remaining thin coating by the scraping method.

Removal complete.

Figure 4: Removal complete.


Evaluation
   
1. Visual examination or UV light may be used to verify complete removal of  coating.
   


Figure 5: Micro-Drill System.
 



Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | 2.1 Handling Electronic Assemblies | 2.2.1 Cleaning, Local | 2.2.2 Cleaning, Aqueous Batch Process | 2.3.1 Coating Removal, Identification of Coating | 2.3.2 Coating Removal, Solvent Method | 2.3.3 Coating Removal, Peeling Method | 2.3.4 Coating Removal, Thermal Method | 2.3.5 Coating Removal, Grinding / Scraping Method | 2.3.6 Coating Removal, Micro Blasting Method | 2.4.1 Coating Replacement, Solder Mask | 2.4.2 Coating Replacement, Conformal Coating, Encapsulant | 2.4.3 Coating Replacement, Solder Mask, BGA Locations | 2.5 Baking and Preheating | 2.6.1 Legend/Marking, Stamping Method | 2.6.2 Legend Marking, Hand Lettering Method | 2.6.3 Legend Marking, Stencil Method | 2.7 Epoxy Mixing and Handling


2.3.5 Coating Removal, Grinding / Scraping Method