| Circuit Board Repair Guide > Basic Circuit Board Repair Procedures > CTC 2.2.2 Cleaning, Aqueous Batch Process |
CTC 2.2.2 Cleaning, Aqueous Batch ProcessThis section outlines a batch cleaning process for removal of small volumes of fluxes and other contaminants that may contact printed circuit boards during circuit board repair and rework operations. This batch cleaning method is not necessarily appropriate for the removal of contaminants used during full assembly operations.
Caution Aqueous batch cleaning may not always be suitable for removing rosin based fluxes or other contaminants that are not readily soluble in water. Caution Aqueous cleaning will expose all areas of a circuit board assembly to penetrating water spray. Circuit boards must be assessed regarding damage to coatings and devices that may be sensitive to deionized water.
Printed Board Type: R/F/W/C | Skill Level: Intermediate | Conformance Level: High | Rev.: A | Rev. Date: May 9, 2001 Daily System Setup
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CTC 2.2.2 Cleaning, Aqueous Batch Process |