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Circuit Frames

Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded circuit boards -- all in about 30 seconds. Our replacement Circuit Frames with dry-film adhesive backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the circuit board surface with a bonding iron or bonding press.

Sample replacement surface mount pads.

Replacing circuits and pads is done in 4 steps: For customer service call us at (519) 260-0596

Step 1

Remove the damaged pads and prepare the area.

Evaluate the damaged circuits. If the base material is severely damaged it may have to first be repaired using epoxy. See Base Board Repair Kit. Remove the defective pad or conductor and scrape off any soldermask from the connecting circuit. Apply liquid flux to the connecting circuit on the board surface and tin with solder.

Step 2

Select a replacement pad and trim it out from the Circuit Frame.

Select a replacement pad that matches the missing pad. Scrape off the adhesive bonding film from the solder joint area on the back of new pad. Trim out the new pad from the Circuit Frame. Cut from the plated side.

Step 3

Place the pad in position using tape and bond in place.

Temporarily place the new pad in position using Kapton tape. Then permanently bond the new pad using the Bonding System or Bonding Iron. Bonding time is only 30 seconds.

Step 4

Complete the connection to the existing circuit.

If the new conductor has a connecting circuit, apply liquid flux to the lap solder joint connection area and solder the circuit of the new pad to the circuit on the printed circuit board surface. If desired, apply epoxy to the lap solder joint connection.

Material Specifications

Frame Size:	2.25" x 1.50" (57 x 38 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Bonding Load:	See Calibration Settings below
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.

Plating Specifications

Tin/Lead:	Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum.
Nickel/Gold:	Gold .000050" (.00127 mm) minimum over Nickel .000100" (.00254 mm) minimum.
Tin:	Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Dry Film Adhesive Backing - Part No. 115-2706 The dry film adhesive backing is available separately.

Circuit Frame Table For customer service call us at (519) 260-0596

Freight, duties and value added taxes may increase prices for products outside the U.S. Import duties and value added tax are
the customer's responsibility and will be collected at time of delivery for all international shipments.

Part Number	Surface Mount Pad Frames - Price US $39.00 each	Plating	Bonding Tip	Load
CS004085AT	Surface Mount Pads .004" x .085" (0.10 mm x .20 mm)	Tin/Lead	115-2304	A
CS004085AS	Surface Mount Pads .004" x .085" (0.10 mm x .20 mm), Lead Free	Bright Tin	115-2304	A
CS012060AT	Surface Mount Pads .012" x .060" (0.30 mm x 1.52 mm)	Tin/Lead	115-2302	A
CS012060AS	Surface Mount Pads .012" x .060" (0.30 mm x 1.52 mm), Lead Free	Bright Tin	115-2302	A
CS012100AT	Surface Mount Pads .012" x .100" (0.30 mm x 2.54 mm)	Tin/Lead	115-2308 *	A
CS012100AS	Surface Mount Pads .012" x .100" (0.30 mm x 2.54 mm), Lead Free	Bright Tin	115-2308 *	A
CS020028AT	Surface Mount Pads .020" x .028" (0.508 mm x 0.711 mm)	Tin/Lead	115-2310	A
CS020028AS	Surface Mount Pads .020" x .028" (0.508 mm x 0.711 mm), Lead Free	Bright Tin	115-2310	A
CS025080AT	Surface Mount Pads .025" x .080" (0.63 mm x 2.03 mm)	Tin/Lead	115-2304	B
CS025080AS	Surface Mount Pads .025" x .080" (0.63 mm x 2.03 mm), Lead Free	Bright Tin	115-2304	B
CS025080BT	Surface Mount Pads .025" x .080" (0.63 mm x 2.03 mm)	Tin/Lead	115-2304	B
CS025080BS	Surface Mount Pads .025" x .080" (0.63 mm x 2.03 mm), Lead Free	Bright Tin	115-2304	B
CS028185AT	Surface Mount Pads .028" x .185" (0.71 mm x 4.70 mm)	Tin/Lead	115-2314	C
CS028185AS	Surface Mount Pads .028" x .185" (0.71 mm x 4.70 mm), Lead Free	Bright Tin	115-2314	C
CS030055AT	Surface Mount Pads .030" x .055" (0.76 mm x 1.40 mm)	Tin/Lead	115-2312 *	B
CS030055AS	Surface Mount Pads .030" x .055" (0.76 mm x 1.40 mm), Lead Free	Bright Tin	115-2312 *	B
CS034030AT	Surface Mount Pads .034" x .030" (0.86 mm x 0.76 mm)	Tin/Lead	115-2310	A
CS034030AS	Surface Mount Pads .034" x .030" (0.86 mm x 0.76 mm), Lead Free	Bright Tin	115-2310	A
CS038090AT	Surface Mount Pads .038" x .090" (.97 mm x 2.28 mm)	Tin/Lead	115-2308	B
CS038090AS	Surface Mount Pads .038" x .090" (.97 mm x 2.28 mm), Lead Free	Bright Tin	115-2308	B
CS040070AT	Surface Mount Pads .040" x .070" (1.01 mm x 1.77 mm)	Tin/Lead	115-2312	B
CS040070AS	Surface Mount Pads .040" x .070" (1.01 mm x 1.77 mm), Lead Free	Bright Tin	115-2312	B
CS040110AT	Surface Mount Pads .040" x .110" (1.01 mm x 2.80 mm)	Tin/Lead	115-2308	B
CS040110AS	Surface Mount Pads .040" x .110" (1.01 mm x 2.80 mm), Lead Free	Bright Tin	115-2308	B
CS045110AT	Surface Mount Pads .045" x .110"(1.14 mm x 2.80 mm)	Tin/Lead	115-2308	B
CS045110AS	Surface Mount Pads .045" x .110"(1.14 mm x 2.80 mm), Lead Free	Bright Tin	115-2308	B
CS048068AT	Surface Mount Pads .048" x .068" (1.22 mm x 1.73 mm)	Tin/Lead	115-2312	B
CS048068AS	Surface Mount Pads .048" x .068" (1.22 mm x 1.73 mm), Lead Free	Bright Tin	115-2312	B
CS050050AT	Surface Mount Pads .050" x .050" (1.27 mm x 1.27 mm)	Tin/Lead	115-2310	B
CS050050AS	Surface Mount Pads .050" x .050" (1.27 mm x 1.27 mm), Lead Free	Bright Tin	115-2310	B
CS051087AT	Surface Mount Pads .051" x .087" (1.30 mm x 2.21 mm)	Tin/Lead	115-2314	B
CS051087AS	Surface Mount Pads .051" x .087" (1.30 mm x 2.21 mm), Lead Free	Bright Tin	115-2314	B
CS060080AT	Surface Mount Pads .060" x .080" (1.52 mm x 2.03 mm)	Tin/Lead	115-2312	B
CS060080AS	Surface Mount Pads .060" x .080" (1.52 mm x 2.03 mm), Lead Free	Bright Tin	115-2312	B
CS065055AT	Surface Mount Pads .065" x .055" (1.65 mm x 1.40 mm)	Tin/Lead	115-2312	B
CS065055AS	Surface Mount Pads .065" x .055" (1.65 mm x 1.40 mm), Lead Free	Bright Tin	115-2312	B
CS065095AT	Surface Mount Pads .065" x .095" (1.65 mm x 2.41 mm)	Tin/Lead	115-2316	C
CS065095AS	Surface Mount Pads .065" x .095" (1.65 mm x 2.41 mm), Lead Free	Bright Tin	115-2316	C
CS067173AT	Surface Mount Pads .067" x .173" (1.70 mm x 4.39 mm)	Tin/Lead	115-2318 *	D
CS067173AS	Surface Mount Pads .067" x .173" (1.70 mm x 4.39 mm), Lead Free	Bright Tin	115-2318 *	D
CS071106AT	Surface Mount Pads .071" x .106" (1.80 mm x 2.69 mm)	Tin/Lead	115-2316	C
CS071106AS	Surface Mount Pads .071" x .106" (1.80 mm x 2.69 mm), Lead Free	Bright Tin	115-2316	C
CS095095AT	Surface Mount Pads .095" x .095" (2.41 mm x 2.41 mm)	Tin/Lead	115-2320	C
CS095095AS	Surface Mount Pads .095" x .095" (2.41 mm x 2.41 mm), Lead Free	Bright Tin	115-2320	C
CS130177AT	Surface Mount Pads .130" x .177" (3.30 mm x 4.42 mm)	Tin/Lead	Custom	E
CS130177AS	Surface Mount Pads .130" x .177" (3.30 mm x 4.42 mm), Lead Free	Bright Tin	Custom	E

Part Number	Ball Grid Array Pad Frames - Price US $39.00 each	Plating	Bonding Tip	Load
CS015020AT	BGA Pads .015"/.020" (0.38 mm x 0.50 mm) Diameter	Tin/Lead	115-2201	A
CS015020AS	BGA Pads .015"/.020" (0.38 mm x 0.50 mm) Diameter, Lead Free	Bright Tin	115-2201	A
CS025035AT	BGA Pads .025"/.035" (0.63 mm/.89 mm) Diameter	Tin/Lead	115-2205	A
CS025035AS	BGA Pads .025"/.035" (0.63 mm/.89 mm) Diameter, Lead Free	Bright Tin	115-2205	A
CS051063AT	BGA Pads .051'/.063" (1.29 mm/1.60 mm) Diameter	Tin/Lead	115-2204	B
CS051063AS	BGA Pads .051'/.063" (1.29 mm/1.60 mm) Diameter, Lead Free	Bright Tin	115-2204	B

Part Number	Conductor Frames - Price US $39.00 each	Plating	Bonding Tip	Load
CT006015AT	Conductor Tracks .006"/.015" (0.15 mm/0.38 mm)	Tin/Lead	115-2314 *	**
CT006015AS	Conductor Tracks .006"/.015" (0.15 mm/0.38 mm), Lead Free	Bright Tin	115-2314 *	**
CT006025AT	Conductor Tracks .006"/.025" (0.15 mm/0.63 mm)	Tin/Lead	115-2314	**
CT006025AS	Conductor Tracks .006"/.025" (0.15 mm/0.63 mm), Lead Free	Bright Tin	115-2314	**

Part Number	Gold Edge Contact Frames - Price US $79.00 each	Plating	Bonding Tip	Load
CC035080AG	Gold Edge Contacts .035" x .080" (0.89 mm x 2.03 mm)	Gold	115-2312 *	B
CC038255AG	Gold Edge Contacts .038" x .250" (0.97mm x 6.35 mm)	Gold	115-2314 *	C
CC050060AG	Gold Edge Contacts .050"/.060" (1.27 mm/1.52 mm)	Gold	115-2314	F
CC050300AG	Gold Edge Contacts .050" x .300" (1.27 mm x 7.62 mm)	Gold	115-2314 *	E
CC070080AG	Gold Edge Contacts .070"/.080" (1.78 mm/2.03 mm)	Gold	115-2318	F
CC070210AG	Gold Edge Contacts .070" x .210" (1.78 mm x 5.33 mm)	Gold	115-2318	F
CC076190AG	Gold Edge Contacts .076" x .190" (1.93 mm x 4.83 mm)	Gold	115-2318 *	D
CC085360AG	Gold Edge Contacts .085" x .360" (2.16 mm x 9.14 mm)	Gold	115-2322	F
CC090300AG	Gold Edge Contacts .090" x .300" (2.28 mm x 7.62 mm)	Gold	115-2322	F

Part Number	Land Frames - Price US $39.00 each	Plating	Bonding Tip	Load
CP050060AT	Lands .050"/.060" (1.27 mm/1.52 mm)	Tin/Lead	115-2202	C
CP050060AS	Lands .050"/.060" (1.27 mm/1.52 mm), Lead Free	Bright Tin	115-2202	C
CP070080AT	Lands .070"/.080" (1.78 mm/2.03 mm)	Tin/Lead	115-2204	C
CP070080AS	Lands .070"/.080" (1.78 mm/2.03 mm), Lead Free	Bright Tin	115-2204	C
CP090100AT	Lands .090"/.100" (2.28 mm/2.54 mm)	Tin/Lead	115-2206	D
CP090100AS	Lands .090"/.100" (2.28 mm/2.54 mm), Lead Free	Bright Tin	115-2206	D
CP090100BT	Lands .090" x .100" (2.28 mm x 2.54 mm)	Tin/Lead	115-2206	C
CP090100BS	Lands .090" x .100" (2.28 mm x 2.54 mm), Lead Free	Bright Tin	115-2206	C
CP140210AT	Lands .142" ID x .210" OD (3.60 mm ID x 5.33 mm OD)	Tin/Lead	Custom	F
CP140210AS	Lands .142" ID x .210" OD (3.60 mm ID x 5.33 mm OD), Lead Free	Bright Tin	Custom	F
CP156097AT	Lands .156 OD x .097 ID (3.96 mm OD x 2.46 mm ID)	Tin/Lead	Custom	F
CP156097AS	Lands .156 OD x .097 ID (3.96 mm OD x 2.46 mm ID), Lead Free	Bright Tin	Custom	F
CP250125AT	Lands .250" OD x .125" ID (6.35 mm OD x 3.18 mm ID)	Tin/Lead	Custom	F
CP250125AS	Lands .250" OD x .125" ID (6.35 mm OD x 3.18 mm ID), Lead Free	Bright Tin	Custom	F

Part Number	Variety Frames - Price US $39.00 each	Plating	Bonding Tip	Load
CFV002T	Variety	Tin/Lead	Variety	**
CFV002S	Variety, Lead Free	Bright Tin	Variety	**
CVAR0001AT	Variety .010" Track (0.254 mm)	Tin/Lead	Variety	**
CVAR0001AS	Variety .010" Track (0.254 mm), Lead Free	Bright Tin	Variety	**
CBLANKAT	Circuit Frame, Blank	Tin/Lead	Variety	**
CBLANKAS	Circuit Frame, Blank, Lead Free	Bright Tin	Variety	**

Bonding Tip

Bonding Tip listing in the above table is the recommended Bonding Tip to use with the particular Circuit Frame.

* Indicates that the closest size Bonding Tip has been listed, a custom size Bonding Tip may be required.

** Indicates that Bonding Loads will vary depending on the particular circuit selected from the Circuit Frame.

Manual Bonding Load Table

Circuit Surface Area	Load	Setting	Hand Bonding Setting
Up to .002 in² Up to 1.29 mm²	4 oz. ( 113 grams)	A	A - Very Light Load Approximately equal to the weight of the Bonding Iron.
.002 in² to .005 in² 1.30 mm² to 3.22 mm²	8 oz. ( 227 grams)	B	B - Light Load Slightly less than twice the weight of the Bonding Iron.
.005 in² to .010 in² 3.22 mm² to 6.45 mm²	12 oz ( 340 grams)	C	C - Light Load Slightly greater than twice the weight of the Bonding Iron.
.010 in² to .015 in² 6.45 mm² to 9.67 mm²	24 oz. ( 680 grams)	D	D - Medium Load Approximately half the resting weight of your arm.
.015 in² to .025 in² 9.67 mm² to 16.13 mm²	32 oz. ( 907 grams)	E	E - Firm Load Slightly less than the resting weight of your arm.
.025 in² and greater 16.13 mm² and greater	48 oz. (1361 grams)	F	F - Firm Load Approximately equal to the resting weight of your arm.

Bonding Loads

To obtain the maximum bond of the Circuit Frame to the circuit board surface, the proper Bonding Tip temperature, Bonding Tip time, and Bonding Tip load are required. The Bonding Load is based upon the approximate surface area of the replacement circuit. Bonding Irons are included in several repair kits or available separately.

Settings A through F are listed on the Calibration Slide of the Circuit Technology Center Bonding System.

Circuit Frame shown twice actual size.
Circuit Frame: CS004085AT

CS004085AT - Circuit Frame US $39.00 ^{View cart}
CS004085AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2304 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.004" x 0.085" (0.101 mm x 2.159 mm)
Recommended Bonding Tip:	No. 115-2304 0.025" x 0.080" (0.635 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum.Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS004085AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS004085AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS012060AT

CS012060AT - Circuit Frame US $39.00 ^{View cart}
CS012060AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2302 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.012" x 0.060" (0.304 mm x 1.524 mm)
Recommended Bonding Tip:	No. 115-2302 0.012" x 0.060" (0.30 mm x 1.52mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS012060AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS012060AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS012100AT

CS012100AT - Circuit Frame US $39.00 ^{View cart}
CS012100AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2308 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.012" x 0.100" (0.304 mm x 2.540 mm)
Recommended Bonding Tip:	No. 115-2308 .045" x .110" (1.143 mm x 2.794 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS012100AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS012100AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS020028AT

CS020028AT - Circuit Frame US $39.00 ^{View cart}
CS020028AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2310 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.020" x 0.028" (0.508 mm x 0.711 mm)
Recommended Bonding Tip:	No. 115-2310 0.050" x 0.050" (1.27 mm x 1.27 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS020028AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS020028AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS025080AT

CS025080AT - Circuit Frame US $39.00 ^{View cart}
CS025080AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2304 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.025" x 0.080" (0.635 mm x 2.032 mm)
Recommended Bonding Tip:	No. 115-2304 0.025" x 0.080" (0.635 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS025080AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS025080AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS025080BT

CS025080BT - Circuit Frame US $39.00 ^{View cart}
CS025080BS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2304 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.025" x 0.080" (0.635 mm x 2.032 mm)
Recommended Bonding Tip:	No. 115-2304 0.025" x 0.080" (0.635 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS025080BT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS025080BS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS028185AT

CS028185AT - Circuit Frame US $39.00 ^{View cart}
CS028185AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2314 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.028" x 0.185" (0.711 mm x 4.699 mm)
Recommended Bonding Tip:	No. 115-2314 .060" x .500" (1.52 mm x 12.70 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS028185AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS028185AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS030055AT

CS030055AT - Circuit Frame US $39.00 ^{View cart}
CS030055AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2312 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.030" x 0.055" (0.762 mm x 1.397 mm)
Recommended Bonding Tip:	No. 115-2312 .060" x .080" (1.524 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS030055AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS030055AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS034030AT

CS034030AT - Circuit Frame US $39.00 ^{View cart}
CS034030AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2310 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.034" x 0.030" (0.863 mm x 0.762 mm)
Recommended Bonding Tip:	No. 115-2310 0.050" x 0.050" (1.270 mm x 1.270 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS034030AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS034030AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS038090AT

CS038090AT - Circuit Frame US $39.00 ^{View cart}
CS038090AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2308 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.038" x 0.090" (0.965 mm x 2.286 mm)
Recommended Bonding Tip:	No. 115-2308 .045" x .110" (1.143 mm x 2.794 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS038090AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS038090AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS040070AT

CS040070AT - Circuit Frame US $39.00 ^{View cart}
CS040070AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2312 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.040" x 0.070" (1.016 mm x 1.778 mm)
Recommended Bonding Tip:	No. 115-2312 .060" x .080" (1.524 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS040070AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS040070AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS040110AT

CS040110AT - Circuit Frame US $39.00 ^{View cart}
CS040110AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2308 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.040" x 0.110" (1.016 mm x 2.794 mm)
Recommended Bonding Tip:	No. 115-2308 .045" x .110" (1.143 mm x 2.794 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS040110AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS040110AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS045110AT

CS045110AT - Circuit Frame US $39.00 ^{View cart}
CS045110AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2308 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.045" x 0.110" (1.143 mm x 2.794 mm)
Recommended Bonding Tip:	No. 115-2308 .045" x .110" (1.143 mm x 2.794 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS045110AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS045110AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS048068AT

CS048068AT - Circuit Frame US $39.00 ^{View cart}
CS048068AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2312 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.048" x 0.068" (1.219 mm x 1.727 mm)
Recommended Bonding Tip:	No. 115-2312 .060" x .080" (1.524 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS048068AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS048068AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS050050AT

CS050050AT - Circuit Frame US $39.00 ^{View cart}
CS050050AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2310 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.050" x 0.050" (1.270 mm x 1.270 mm)
Recommended Bonding Tip:	No. 115-2310 .050" x .050" (1.270 mm x 1.270 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS050050AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS050050AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS051087AT

CS051087AT - Circuit Frame US $39.00 ^{View cart}
CS051087AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2314 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.051" x 0.087" (1.295 mm x 2.209 mm)
Recommended Bonding Tip:	No. 115-2314 .060" x .500" (1.524 mm x 12.7 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS051087AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS051087AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS060080AT

CS060080AT - Circuit Frame US $39.00 ^{View cart}
CS060080AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2312 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	.060" x .080" (1.52 mm x 2.03 mm)
Recommended Bonding Tip:	No. 115-2312 .060" x .080" (1.524 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS060080AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS060080AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS065055AT

CS065055AT - Circuit Frame US $39.00 ^{View cart}
CS065055AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2312 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.065" x 0.055" (1.651 mm x 1.397 mm)
Recommended Bonding Tip:	No. 115-2312 .060" x .080" (1.524 mm x 2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS065055AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS065055AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS065095AT

CS065095AT - Circuit Frame US $39.00 ^{View cart}
CS065095AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2316 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.065" x 0.095" (1.651 mm x 2.413 mm)
Recommended Bonding Tip:	No. 115-2316 .080" x .120" (2.032 mm x 3.048 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS065095AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS065095AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS067173AT

CS067173AT - Circuit Frame US $39.00 ^{View cart}
CS067173AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2318 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.067" x 0.173" (1.701 mm x 4.394 mm)
Recommended Bonding Tip:	No. 115-2318 .080" x .500" (2.03 mm x 12.7 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS067173AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS067173AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS071106AT

CS071106AT - Circuit Frame US $39.00 ^{View cart}
CS071106AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2316 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.071" x 0.106" (1.803 mm x 2.692 mm)
Recommended Bonding Tip:	No. 115-2316 .080" x .120" (2.032 mm x 3.048 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS071106AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS071106AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS095095AT

CS095095AT - Circuit Frame US $39.00 ^{View cart}
CS095095AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2320 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.095" x 0.095" (2.413 mm x 2.413 mm)
Recommended Bonding Tip:	No. 115-2320 .095" x .095" (2.413 mm x 2.413 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS095095AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS095095AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS130177AT

CS130177AT - Circuit Frame US $39.00 ^{View cart}
CS130177AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.130" x 0.177" (3.302 mm x 4.496 mm)
Recommended Bonding Tip:	Custom
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS130177AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS130177AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS015020AT

CS015020AT - Circuit Frame US $39.00 ^{View cart}
CS015020AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2201 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.015"/0.020" dia. (0.381 mm x 0.508 mm)
Recommended Bonding Tip:	No. 115-2201 0.025" dia. (0.64 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS015020AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS015020AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS025035AT

CS025035AT - Circuit Frame US $39.00 ^{View cart}
CS025035AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2205 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.025"/0.035" dia. (0.635 mm/0.889 mm)
Recommended Bonding Tip:	No. 115-2205 0.035" dia. (0.889 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS025035AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS025035AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CS051063AT

CS051063AT - Circuit Frame US $39.00 ^{View cart}
CS051063AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2204 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	.051"/.063" dia. (1.295 mm x 1.600 mm)
Recommended Bonding Tip:	No. 115-2204 0.080" dia. (2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CS051063AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CS051063AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CT006015AT

CT006015AT - Circuit Frame US $39.00 ^{View cart}
CT006015AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2314 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.006" x 0.015" (0.152 mm x 0.381 mm)
Recommended Bonding Tip:	No. 115-2314 .060" x .500" (1.524 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CT006015AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CT006015AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CT006025AT

CT006025AT - Circuit Frame US $39.00 ^{View cart}
CT006025AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2314 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.006" x 0.025" (0.152 mm x 0.635 mm)
Recommended Bonding Tip:	No. 115-2314 .060" x .500" (1.524 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CT006025AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CT006025AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CC035080AG

CC035080AG - Circuit Frame US $79.00 ^{View cart}
115-2312 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.035" x 0.080" (0.889 mm x 2.032 mm)
Recommended Bonding Tip:	No. 115-2312 .060" x .080" (1.52 mm x 2.03 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC038255AG

CC038255AG - Circuit Frame US $79.00 ^{View cart}
115-2314 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.038" x 0.255" (0.965 mm x 6.477 mm)
Recommended Bonding Tip:	No. 115-2314 .060" x .500" (1.524 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC050060AG

CC050060AG - Circuit Frame US $79.00 ^{View cart}
115-2314 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	.050"/ .060" x .750" (1.270 mm/1.524 mm x 19.050 mm)
Recommended Bonding Tip:	No. 115-2314 .060" x .500" (1.524 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC050300AG

CC050300AG - Circuit Frame US $79.00 ^{View cart}
115-2314 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.050" x 0.300" (1.270 mm x 7.620 mm)
Recommended Bonding Tip:	No. 115-2314 0.060" x 0.500" (1.524 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC070080AG

CC070080AG - Circuit Frame US $79.00 ^{View cart}
115-2318 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.070"/0.080" x 0.750" (1.778 mm/2.032 mm x 19.050 mm)
Recommended Bonding Tip:	No. 115-2318 .080" x .500" (2.032 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC070210AG

CC070210AG - Circuit Frame US $79.00 ^{View cart}
115-2318 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	.070" x .210" (1.78 mm x 5.33 mm)
Recommended Bonding Tip:	No. 115-2318 .080" x .500" (2.03 mm x 12.7 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC076190AG

CC076190AG - Circuit Frame US $79.00 ^{View cart}
115-2318 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	.076" x 0.190" (1.930 mm x 4.826 mm)
Recommended Bonding Tip:	No. 115-2318 .080" x .500" (2.032 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC085360AG

CC085360AG - Circuit Frame US $79.00 ^{View cart}
115-2322 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.085" x 0.360" (2.159 mm x 9.144 mm)
Recommended Bonding Tip:	No. 115-2322 .120" x .500" (3.048 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CC090300AG

CC090300AG - Circuit Frame US $79.00 ^{View cart}
115-2322 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.090" x 0.300" (2.28 mm x 7.62 mm)
Recommended Bonding Tip:	No. 115-2322 0.120" x 0.500" (3.048 mm x 12.700 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	.000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.

Circuit Frame shown twice actual size.
Circuit Frame: CP050060AT

CP050060AT - Circuit Frame US $39.00 ^{View cart}
CP050060AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2202 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.050"/0.060" dia. (1.270 mm x 1.524 mm)
Recommended Bonding Tip:	No. 115-2202 0.060" dia. (1.524 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CP050060AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CP050060AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CP070080AT

CP070080AT - Circuit Frame US $39.00 ^{View cart}
CP070080AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2204 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	.070"/080" dia. (1.778 mm x 2.023 mm)
Recommended Bonding Tip:	No. 115-2204 0.080" dia. (2.032 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CP070080AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CP070080AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CP090100AT

CP090100AT - Circuit Frame US $39.00 ^{View cart}
CP090100AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2206 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	.090"/.100" dia. (2.286 mm/2.540 mm)
Recommended Bonding Tip:	No. 115-2206 .120" dia. (3.048 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CP090100AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CP090100AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CP090100BT

CP090100BT - Circuit Frame US $39.00 ^{View cart}
CP090100BS - Circuit Frame, Lead Free US $39.00 ^{View cart}
115-2206 - Recommended Bonding Tip US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.090" x 0.100" (2.286 mm x 2.540 mm)
Recommended Bonding Tip:	No. 115-2206 .120" dia. (3.048 mm)
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CP090100BT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CP090100BS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CP140210AT

CP140210AT - Circuit Frame US $39.00 ^{View cart}
CP140210AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.210" dia. (5.334 mm)
Recommended Bonding Tip:	Custom
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CP140210AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CP140210AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CP156097AT

CP156097AT - Circuit Frame US $39.00 ^{View cart}
CP156097AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.156" dia. (3.962 mm)
Recommended Bonding Tip:	Custom
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CP156097AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CP156097AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CP250125AT

CP250125AT - Circuit Frame US $39.00 ^{View cart}
CP250125AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	0.250" dia. (6.350 mm)
Recommended Bonding Tip:	Custom
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CP250125AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CP250125AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CFV002AT

CFV002T - Circuit Frame US $39.00 ^{View cart}
CFV002S - Circuit Frame, Lead Free US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	Various
Recommended Bonding Tip:	Various
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CFV002T - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CFV002S - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CVAR0001AT

CVAR0001AT - Circuit Frame US $39.00 ^{View cart}
CVAR0001AS - Circuit Frame, Lead Free US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	Variety
Recommended Bonding Tip:	---
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CVAR0001AT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CVAR0001AS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.

Circuit Frame shown twice actual size.
Circuit Frame: CBLANKAT

CBLANKAT - Circuit Frame US $39.00 ^{View cart}
CBLANKAS - Circuit Frame, Lead Free US $39.00 ^{View cart}
Specifications
Overall Frame Size:	2.25" x 1.50" (57 x 38 mm)
Pattern Size:	Variety
Recommended Bonding Tip:	---
Base Material:	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing:	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature:	475°F ± 25°F (246°C ± 14°C)
Bonding Time:	30 seconds
Peel Strength:	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life:	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specification:	CBLANKAT - Circuit Frame: Tin/Lead .0005" (.0127 mm) 60/40 tin/lead minimum. CBLANKAS - Circuit Frame: Bright Tin .0005" (.0127 mm) minimum. Lead Free.