115-3118 Circuit Bonding System
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This is the ideal, calibrated system for bonding adhesive film backed circuit frames. Repair technicians appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads. The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. The Rework Stand has a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. A digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle.
See available bonding tips.
Features and Benefits
- Precision design - permits bonding of minute patterns.
- Heavy duty construction - ensures platform stability.
- Built-in calibration slide maintains regulated bonding force.
- Temperature controller maintains uniform bonding temperature for better results.
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| Larger image of Circuit Bonding System |
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Applications
Specifications
| Frame Construction |
11 gauge steel |
| Throat Depth |
12" (30.0 cm) |
| Throat Height |
7" (17 cm) |
| Vertical Travel |
7" (17 cm) |
| Weight |
10 lb. (4.5 kg.) |
| Power Input |
85 to 265 VDC/VAC
50 to 400 Hz 5 VA max. |
Temperature Controller |
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| Range |
Ambient to 990F |
| Resolution |
1F |
| Cycle Time |
2 to 80 sec. |
| Power Consumption |
5 VA max. |
| Heat Output |
20 Watts |
| Heat Up Time |
10 minutes |
115-3118 and 115-3218 come with a temperature controller and have a temperature range of ambient to 990F.
115-3119 and 115-3219 have a fixed temperature of 500F ±25F.
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