This is the ideal, calibrated system for bonding adhesive film backed
circuit frames. Repair technicians appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads. The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. The Rework Stand has a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. A digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle. Click
here for larger image. See available
bonding tips.
