The Circuit Bonding System is the best, calibrated system for bonding adhesive film backed circuits
and is ideally suited for bonding small patterns including surface mount and BGA pads. This bonding press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. Includes a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. The digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle. See available bonding tips
required for use with this Circuit Bonding System.