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Circuit Board Repair and Rework Guide
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| 1.0 Foreword This section provides substantial background information about this guide and how it can be used at your company. | ||
| 2.0 Basic Procedures This section covers handling, cleaning, coatings, legend, and use of epoxies. | ||
| 3.0 Base Board Procedures This section covers repair of delamination, warp, key slots, non plated holes, surface defects, and various defects to base board material. | ||
| 4.0 Conductor Procedures This section covers repair and rework of conductors including circuits, lands, gold contacts, surface mount pads, and BGA pads. | ||
| 5.0 Plated Hole Procedures This section covers various methods for plated hole repair. | ||
| 6.0 Jumper Wires and Component Modification Procedures This section includes excellent procedures for adding jumper wires and performing various component modifications. | ||
| 7.0 Soldering Procedures This section includes procedures for soldering a variety of component types including chip components, J lead components and gull wing components. | ||
| 8.0 Rework Procedures This section includes procedures for removing a variety of component types including chip components, J lead components, and gull wing components. | ||
| 9.0 BGA Component Rework Procedures This section includes procedures for removing and replacing BGA components. | ||
| Related Items Circuit Board Repair and Rework Products |
Circuit Board Repair and Rework Guide |