Circuit Board Repair Guide

The information in the dozens of separate procedures in this Circuit Board Repair Guide should be helpful to anyone who works with bare circuit boards and circuit board assemblies.

The Circuit Board Repair Guide is packed with detailed illustrations and follows popular IPC standards. The guide will help you through the maze of challenges you face when working on modern, high density circuit boards.

The guide includes basic procedures covering handling, cleaning, and coatings. Base board procedures covering burns, warp, and surface defects. Conductor procedures covering repair and rework of circuits, lands, gold contacts, surface mount pads, BGA pads, and plated holes. Jumper wires and component modification procedures and soldering and rework procedures for a variety of component types including BGA components, chip components, J lead components, and gull wing components.


		Chapter 1 - Foreword This chapter provides substantial background information about this circuit board repair guide and how it can be used at your company.


		Chapter 2 - Basic Circuit Board Repair Procedures The basic circuit board repair procedures chapter covers handling, cleaning, coatings, legend, and use of epoxies.


		Chapter 3 - Base Board Repair Procedures The base board repair chapter covers repair of delamination, warp, key slots, non plated holes, surface defects, and various defects to base board material.


		Chapter 4 - Conductor Repair Procedures The conductor repair chapter covers repair and rework of conductors including circuits, lands, gold contacts, surface mount pads, and BGA pads.


		Chapter 5 - Plated Hole Repair Procedures This chapter covers various methods for plated hole repair.


		Chapter 6 - Jumper Wires and Component Modification Procedures This chapter of the circuit board repair guide includes excellent procedures for adding jumper wires and performing various component modifications.


		Chapter 7 - Soldering Procedures This chapter of the guidebook includes procedures for soldering a variety of component types including chip components, J lead components and gull wing components.


		Chapter 8 - Rework Procedures This chapter of the circuit board repair guide includes procedures for removing a variety of component types including chip components, J lead components, and gull wing components.


		Chapter 9 - BGA Component Rework Procedures This chapter includes procedures for removing and replacing BGA components.