3.2 Bow and Twist Repair
| Printed Board Type: R/W | Skill Level: Intermediate | Conformance Level: Medium | Rev.: D | Rev. Date: Jul 7, 2000 |
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Outline
Procedure is used to eliminate, or reduce the bow and twist, or warping of circuit boards.
Caution
This repair method is most suitable for FR-4, GE or
GF substrate base materials having glass transition
temperatures below 125° C (257° F).
Caution
This process uses high temperatures. Some components
may be sensitive to high temperature.
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Bow and Twist |
Note
Bow and twist should not be repaired unless sighted
as a defect.
Tools and Materials
Base Plate
Caliper or Pin Gauges
Oven
Restraint Bars
Restraint Clamps
Procedure

Figure 1: Check edge deflection for maximum warp.
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| 1. |
Check the deflection to determine if rework
is needed. See Figure 1.
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Note
Bow and twist after soldering
shall not exceed 1.5% for through-hole circuit
boards and .75% for surface mount circuit boards.
The bow and twist shall not be sufficient to
cause difficulties during placement, soldering
and testing operations. Before dispositioning
circuit boards with bow and twist as scrap,
keep in mind how the circuit board is mounted
in its final destination. Keep in mind "form,
fit and function" without jeopardizing reliability.
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Figure 2: Clamp restraint bars to
edge needing rework.
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| 2. |
Place the restraint bars along
the edges that require rework. (See Figure 2).
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Note
Components or parts that will
interfere with the restraint bars should be
removed.
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| 3. |
If the circuit board is warped
along more than one edge or more than one plane,
clamp the entire circuit board to the base plate. |
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| 4. |
Place the circuit board, restraint bars and
base plate into the oven. Bake for 1 hour at
125° C (257° F). |
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| 5. |
Remove from the oven and allow
to cool to room temperature. |
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| 6. |
Remove restraint bars. |
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| 7. |
Check the edges deflection using
a caliper or pin gauges. |
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Evaluation |
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| 1. |
Check for marks or damage along
edges. |
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| 2. |
Electrical tests as applicable. | | |