Circuit Bonding Evaluation Kit 201-1130

The tools and materials in this kit let you evaluate the IPC recommended process for replacing damaged surface mount and BGA pads, lands, and edge contacts. It’s the ideal, low-cost way to “test drive” and evaluate this money saving repair process.

Application - This kit provides materials to evaluate the following.
Features and Benefits
  • Economical - lets you evaluate IPC recommended repair process.
  • Complete instructions included. glasses
  
pad repair before and after
Before                  After 
Includes materials to evaluate surface mount pad repair using replacement dry film adhesive backed pads.




View other circuit board repair products
Usually ships within 2 to 3 days. Freight, duties and value added taxes may increase prices for products
outside the U.S. Import duties and value added tax are the customer's responsibility and will be collected
at time of delivery for all international shipments.


Circuit Bonding Evaluation Kit, 120 VAC    201-1130  US $149     View cart
Circuit Bonding Evaluation Kit, 230 VAC *  201-1132  US $149     View cart


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Circuit Bonding Evaluation Kit Includes

Qty Description Part Number Replacement Price              View cart
1 Bonding Iron, 120 VAC 115-3102
$69.00  
1 Bonding Tip, Tapered 115-2104
$39.00  
1 Bonding Tip, .040" x .060" 115-2306
$39.00  
1 Bonding Tip, .080" x .500" 115-2318
$39.00  
1 Circuit Frame, Variety CFV003AS
$39.00  
1 Epoxy 115-3302
$9.50 each  
1 Foam Swab 235-2102
$29.50 pkg/100  
1 Knife 355-2102
$4.95  
1 Mixing Stick 115-3314
$7.50 pkg/100  
1 Plastic Cup 115-3312
$7.50 pkg/100  
1 Plastic Probe 115-3360
$3.95  
1 Tape, Kapton 950-4508
$5.95  
1 Tweezer 335-5183
$9.50  
1 * Bonding Iron, 230 VAC (201-1132 Kit) 115-3103
$69.00  
  Circuit board repair products are shipped direct from the manufacturer. Minimum order requirement is $50 plus shipping.


Related Items
HEI-MP4-FR Stereo Zoom Microscope Package | Circuit Board Repair and Rework | Circuit Bonding Evaluation Kit 201-1130 | Circuit Frames | Circuit Bonding System | Bonding Tips | 4.7.2 Surface Mount Pad Repair, Film Adhesive Method | 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method | 4.5.2 Land Repair, Film Adhesive Method | 4.6.2 Edge Contact Repair, Film Adhesive Method

Circuit Bonding Evaluation Kit 201-1130