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201-1130 Circuit Bonding Evaluation Kit

The tools and materials in this kit let you evaluate the IPC recommended process for replacing damaged surface mount and BGA pads, lands, and edge contacts. It's the ideal, low-cost way to "test drive" and evaluate this money saving repair process.

Application - This kit provides materials to evaluate the following.
Features and Benefits
  • Economical - lets you evaluate IPC recommended repair process.
  • Complete instructions included.
 
pad repair before and after
Before                  After 

Includes materials to evaluate surface mount pad repair using replacement dry film adhesive backed pads.
Special Order. Usually ships within 2 to 3 business days. Freight, duties and value added taxes may increase prices for products outside the U.S. Import duties and value added tax are the customer's responsibility and will be collected at time of delivery for all international shipments. 2CO is an authorized retailer for goods and services provided by E.L. Inc. [ Engineering Lab ].


Circuit Bonding Evaluation Kit, 120 VAC       201-1130     US $179     View cart
Circuit Bonding Evaluation Kit, 230 VAC *     201-1132     US $179     View cart


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Circuit Bonding Evaluation Kit Includes
Qty Description Part Number Replacement Price              View cart
1 Bonding Iron, 120 VAC in 201-1130 Kit 115-3102
$79.00  
1 Bonding Tip, Tapered 115-2104
$45.00  
1 Bonding Tip, .040" x .060" 115-2306
$45.00  
1 Bonding Tip, .080" x .500" 115-2318
$45.00  
1 Circuit Frame, Variety CFV003AS
$39.00  
1 Epoxy 115-3302
$9.90 each  
1 Foam Swab 235-2102
$39.50 pkg/100  
1 Knife 355-2102
$4.95  
1 Mixing Stick 115-3314
$9.50 pkg/100  
1 Plastic Cup 115-3312
$9.50 pkg/100  
1 Plastic Probe 115-3360
$3.95  
1 Tape, Kapton 950-4508
$5.95  
1 Tweezer 335-5183
$9.95  
1 * Bonding Iron, 230 VAC in 201-1132 Kit 115-3103
$125.00  
  Circuit board repair products are shipped direct from the manufacturer.

Minimum order requirement is $50 plus shipping.



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Circuit Board Repair and Rework Guide


201-1130 Circuit Bonding Evaluation Kit