Rework Kits > Flextac BGA Rework Stencil Kit 201-3120

Flextac BGA Rework Stencil Kit 201-3120


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If you've been using metal stencils for BGA rework, we have some great news for you. Flextac BGA Rework Stencils ... a creative new product that is a major improvement over what you may be using now. See our index of the most popular Flextac BGA Rework Stencils.

These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing. Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Flextac BGA Stencils are easy to use and leave no residue on the board surface.

Typical BGA rework stencils are made from metal and require fixturing or taping to position them and hold them in place. Metal stencils warp easily, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat metal stencils contaminating the circuit board surface. Metal stencils require tedious stencil cleaning. To use metal stencils effectively, a high level of operator skill is required.

How Flextac BGA Stencils Work

You first fold the pre-scored side tabs and then peel off the protective cover film from the bottom side of the stencil. Hold the side tabs while placing the Flextac BGA Stencil in position on the circuit board surface. If the stencil is not correctly positioned, you can simply reposition it. The side tabs also serve as solder dams preventing solder paste overspill. No external taping or fixturing is used.

You next apply a small dab of solder paste and use a standard squeegee to spread the paste. Since the residue-free adhesive seals around each BGA pad, you can make as many passes with the squeegee as needed to assure proper aperture filling. The Flextac BGA Stencil is then peeled up leaving a perfect deposit of solder on each pad. Although Flextac BGA Stencils are disposable, they can be used several times.

Applications

■ Applying solder paste for BGA rework.

Features and Benefits

■ Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed.
■ Laser cut ensures precise aperture size.
■ Disposable - eliminates tedious stencil cleaning.
■ Flexible - conforms to board surface.
■ Fold-up sides for easy placement and solder paste containment.
■ Low cost.
■ Packaged in a handy ESD safe carrying case.

US Patent number: 6,253,675

Flextac BGA Rework Stencil Kit 201-3120 Case

Flextac BGA Rework Stencil Kit is packaged in a rugged ESD safe case.

Special Order. Usually ships within 3 business days. For customer service call us at 1-519-651-3060.

Import duties and Value Added Tax will be collected at time of delivery for all shipments outside the USA.

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Flextac BGA Rework Stencil Kit 201-3120 US $279 ^{View cart}

201-3120 Flextac BGA Rework Stencil Kit Includes
Part No.	Qty	Description	Thickness	Aperture	Ball Count	Ball Pattern	Pitch	Component Body
B6-119-1422-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	119	7 x 17 Full Array	.050" (1.27 mm)	14mm x 22mm
B4-196-1515-100	2	Flextac BGA Rework Stencil	.004" (0.102 mm)	.020" (0.508 mm)	196	14 x 14 Full Array	.039" (1.00 mm)	15mm x 15mm
B6-225-2727-150	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	225	15 x 15 Full Array	.059" (1.50 mm)	27mm x 27mm
B4-256-1717-100	2	Flextac BGA Rework Stencil	.004" (0.102 mm)	.020" (0.508 mm)	256	16 x 16 Full Array	.039" (1.00 mm)	17mm x 17mm
B8-256-2121-127	2	Flextac BGA Rework Stencil	.008" (0.203 mm)	.032" (0.813 mm)	256	16 x 16 Full Array	.050" (1.27 mm)	21mm x 21mm
B6-256-2727-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	256	20 x 20 P4-Row	.050" (1.27 mm)	27mm x 27mm
B6-272-2727-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	272	20 x 20 P4-Row +4 x 4 center	.050" (1.27 mm)	27mm x 27mm
B6-292-2727-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	292	20 x 20 P4-Row +6 x 6 center	.050" (1.27 mm)	27mm x 27mm
B8-304-2125-127	2	Flextac BGA Rework Stencil	.008" (0.203 mm)	.032" (0.813 mm)	304	16 x 19 Full Array	.050" (1.27 mm)	21mm x 25mm
B4-324-2323-100	2	Flextac BGA Rework Stencil	.004" (0.102 mm)	.020" (0.508 mm)	324	22 x 22 P4-Row +6 x 6 center	.039" (1.00 mm)	23mm x 23mm
B6-352-3535-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	352	26 x 26 P4-Row	.050" (1.27 mm)	35mm x 35mm
B6-357-2525-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	357	19 x 19 Full Array	.050" (1.27 mm)	25mm x 25mm
B8-361-2525-127	2	Flextac BGA Rework Stencil	.008" (0.203 mm)	.032" (0.813 mm)	361	19 x 19 Full Array	.050" (1.27 mm)	25mm x 25mm
B6-388-3535-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	388	26 x 26 P4-Row +6 x 6 center	.050" (1.27 mm)	35mm x 35mm
B6-432-4040-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	432	31 x 31 P4-Row	.050" (1.27 mm)	40mm x 40mm
B4-484-2323-100	2	Flextac BGA Rework Stencil	.004" (0.102 mm)	.020" (0.508 mm)	484	22 x 22 Full Array	.039" (1.00 mm)	23mm x 23mm
B6-560-4242-127	2	Flextac BGA Rework Stencil	.006" (0.152 mm)	.025" (0.635 mm)	560	33 x 33 P5-Row	.050" (1.27 mm)	42.5mm x 42.5mm
B8-625-3232-127	2	Flextac BGA Rework Stencil	.008" (0.203 mm)	.032" (0.813 mm)	625	25 x 25 Full Array	.050" (1.27 mm)	32.5mm x 32.5mm
B4-672-2727-100	2	Flextac BGA Rework Stencil	.004" (0.102 mm)	.020" (0.508 mm)	672	26 x 26 Full Array	.039" (1.00 mm)	27mm x 27mm
B4-676-2727-100	2	Flextac BGA Rework Stencil	.004" (0.102 mm)	.020" (0.508 mm)	676	26 x 26 Full Array	.039" (1.00 mm)	27mm x 27mm
115-3514	1	Spatula (Replacement price US $12.95) ^{View cart}
115-3502	1	Squeegee Blade Handle (Replacement price US $6.50) ^{View cart}
115-3504	1	Squeegee Blade, 12mm (Replacement price US $10.95/3) ^{View cart}
115-3506	1	Squeegee Blade, 27mm (Replacement price US $10.95/3) ^{View cart}
115-3508	1	Squeegee Blade, 35mm (Replacement price US $10.95/3) ^{View cart}

How Flextac BGA Rework Stencils Work

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1. Select BGA stencil

Step 1

Select the proper BGA stencil size and fold up the side tabs. The side tabs prevent overspill of solder paste onto the circuit board surface.

2. Peel cover film from BGA stencil

Step 2

Peel off the cover film from the BGA stencil exposing the adhesive backing. This tape-like adhesive holds the stencil in place and seals around each BGA pad to prevent solder paste bleed.

3. Place BGA stencil

Step 3

Place BGA stencil in position using the handy side tabs. Once in place the adhesive back will prevent movement.

4. Apply paste to BGA stencil

Step 4

Apply paste to BGA stencil using a standard metal squeegee. You can make several passes with the squeegee to ensure paste is fully deposited in each opening.

5. Remove BGA stencil

Step 5

Remove the BGA stencil and save for another reuse or dispose. You're now ready to place a new BGA component.