On Site Surface Mount Technology Training Courses > BGA Rework Repair

BGA Rework Repair

Working on SMT assemblies can involve prototyping, test, production and the repair of assemblies in the field. This course presents to you for the first time an objective view and understanding about how to work on your SMT assemblies. With the proper understanding, the damage to components and to the boards are greatly minimized providing for an immediate payback to your company by reducing the repair/rework time and scrap rates.

This onsite SMT training course can be held at your facility. Minimum class size is 5 to 10 students. Please email us or call 519-260-0596 to request a quotation.

Who Would Benefit

All those involved in doing BGA removal and replacement will be interested in this class including engineers, technicians and assemblers. Students who benefit from this course do not have to have had previous soldering experience. Some of our best students have never soldered before.

Course Materials * Please note you are not required to enroll in the onsite course to purchase this book.

Course Outline

BGA Packages

Presentation will discuss the different package options, including plastic, tape and ceramic packages. For these parts, the lead styles, eutectic solder, no-eutectic solder and columns are discussed and the reasons for the packages, their uses and their sensitivities in doing rework are discussed.

PC Boards

Boards have a big impact on the profiles and time necessary for removal. Therefore different board constructions will be discussed and the impact on BGA rework.

Flux

The impact flux has on the reflow profile will be discussed and what are the trends and reasons for using certain types in our industry.

Reflow Profile Steps

In any reflow profile certain steps are always used in the removal or replacement of BGA parts. Discussions will focus on the factors that determine the profile and how we would go about setting it up.

Reflow Profile Setup

Once the profile has been determined it is vital to know how to measure to see if the system is doing what you have identified as needing. To understand this, some case studies will be reviewed to gain insight into how to do this.

Removal and Replacement

Using a BGA rework system, each student is monitored during the lab to point out the what they can do to improve their techniques and get better results. Parts used in the lab include a host of chip resistors and capacitors, tantalum caps, transistors and diodes, assorted PLCC's, and assorted QFP's including QFP-208 0.5mm pitch. If the company request it there can be evaluations made of each person during the soldering lab.

Instructor: James C. Blankenhorn

Onsite Training Costs

The cost for performing an onsite course is separated into three items, all prices are approximate and in US funds:

Instruction Fee is $1500 to $3000 per day depending upon the topic and your location.

Student materials are quoted:
Book materials range from $75 to $300 depending upon the course.
CD-ROM materials range from $485 to $995 depending on the course.

Onsite Quotes Provided

Contact us and receive a quotation and details for any course you would like to have. There is no obligation.

You may also contact us by phone 519-260-0596 or fax 519-260-0597.