BGA Design

BGA technology is a new area that is having an impact upon us. The strive to achieve high speed, manage parts with more heat, and do all this in less area has lead to a lot of interest in BGA technology. But to be successful with this technology we must fully understand it and know where it is the best solution for our application. This new course is an excellent source of information for learning about BGA technology and how to successfully implement it. The information contained within this course will be helpful in understanding the packages, their advantages and disadvantages, designing using BGA, and process for assembly using BGA parts, BGA technology reliability data, testing techniques, and how to do repair of both the assemblies and the BGA packages.

To master the BGA technology begins with the packages themselves. BGA components can be in a variety of package options that are covered in this publication including CBGA/CCBGA, TBGA and PGA. The lead spacing covered are .060, .050, .040, and .025 and for the micro, mini or super BGA packages.

For designers information about pad geometrics, routing, layer requirements, power planes, solder mask requirements, CTE differentials and more are reviewed. For the design and manufacturing engineer the impact upon processing is included for stencils, solder paste, printing, placement, reflow in air with nitrogen and inspection are included.

This onsite SMT training course can be held at your facility. Minimum class size is 5 to 10 students. Please email us or call 519-260-0596 to request a quotation.

Who Would Benefit

This course is a must for R and D, engineering, and technicians that may be considering or are using BGA components.

Course Materials  * Please note you are not required to enroll in the onsite course to purchase this book.

Designing Using BGA and Flip Chip Technology  in stock  US $179.95     ^{View cart}

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Course Outline

New High Density Technologies

• Flip Chip and DCA
• BGA
• Chip Scale Packaging
• PCMCIA
• and More

Design Requirements

• Design Decisions
• Packaging Decisions
• High Density Assembly

Preparing for CAD

• Land Patterns for BGA
• High Density QFP Packages
• Flip Chip
• COB and CSP

Design for Manufacturabililty

• High Density Assembly
• PCB Boards
• Inspection and Repair
• Cleaning
• In-Circuit Test

CAD Design Considerations

• Real Estate
• Component Clearances
• Placement Considerations
• Reliability

Routing High Density

• Via
• Trace Width
• Trace Spacing
• Routing
• Layer Structures

Documentation for Assembly and Fabrication

• Assembly Documentation
• PC Fabrication
• Fabrication Notes

Instructor: James C. Blankenhorn

Onsite Training Costs

The cost for performing an onsite course is separated into three items, all prices are approximate and in US funds:

• Instruction Fee is $1500 to $3000 per day depending upon the topic and your location.
  
  Student materials are quoted:
  
  
• Book materials range from $75 to $300 depending upon the course.
• CD-ROM materials range from $485 to $995 depending on the course.

Onsite Quotes Provided

Contact us and receive a quotation and details for any course you would like to have. There is no obligation.

You may also contact us by phone 519-260-0596 or fax 519-260-0597.