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Flextac BGA Rework Stencils

BGA rework stencil applying solder paste   
BGA rework solder paste stencils with adhesive backing are unique stencils for BGA rework.

If you've been using metal stencils for BGA rework, we have some great news for you. Flextac BGA Rework Stencils ... a creative new product that is a major improvement over what you may be using now. See our most popular BGA Stencils.

These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing. Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Flextac BGA Stencils are easy to use and leave no residue on the board surface.

Larger image of Flextac BGA Rework Stencil

Typical BGA rework stencils are made from metal and require fixturing or taping to position them and hold them in place. Metal stencils warp easily, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat metal stencils contaminating the circuit board surface. Metal stencils require tedious stencil cleaning. To use metal stencils effectively, a high level of operator skill is required.

How Flextac BGA Stencils Work

You first fold the pre-scored side tabs and then peel off the protective cover film from the bottom side of the stencil. Hold the side tabs while placing the Flextac BGA Stencil in position on the circuit board surface. If the stencil is not correctly positioned, you can simply reposition it. The side tabs also serve as solder dams preventing solder paste overspill. No external taping or fixturing is used.

You next apply a small dab of solder paste and use a standard squeegee to spread the paste. Since the residue-free adhesive seals around each BGA pad, you can make as many passes with the squeegee as needed to assure proper aperture filling. The Flextac BGA Stencil is then peeled up leaving a perfect deposit of solder on each pad. Although Flextac BGA Stencils are disposable, they can be used several times.

Applications

Applying solder paste for BGA rework.

Features and Benefits

Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed.
Laser cut ensures precise aperture size.
Disposable - eliminates tedious stencil cleaning.
Flexible - conforms to board surface.
Fold-up sides for easy placement and solder paste containment.
Low cost.

US Patent number: 6,253,675

Special Order. BGA Rework Stencils usually ship within 3 business days. Ships From: Haverhill, MA, USA.

How to purchase. For customer service call 1-519-651-3060.

Import duties and Value Added Tax will be collected at time of delivery for all shipments outside the USA.

2CheckOut (2CO) is a payment facilitator for goods provided by ELAB (Engineering Lab).


Most Popular Flextac BGA Rework Stencils

BGA Stencil Part No.
                 View cart

Thickness

Aperture
Ball
Count
Ball
Pattern

Pitch
Component
Body
B4-064-1013-100

Pkg. of 10   US $59.50 
.004"
(0.102mm)
.020"
(0.508mm)
64 8 x 8
Full Array
.039"
(1.00mm)
10mm
x
13mm
B4-104-1515-127

Pkg. of 10   US $59.50 
.004"
(0.102mm)
.024"
(0.610mm)
104 See Image .050"
(1.27mm)
15mm
x
15mm
B6-119-1422-127

Pkg. of 10   US $59.50 
.006"
(0.152mm)
.025"
(0.635mm)
119 7 x 17
Full Array
.050"
(1.27mm)
14mm
x
22mm
B4-196-1515-100

Pkg. of 10   US $59.50 
.004"
(0.102mm)
.020"
(0.508mm)
196 14 x 14
Full Array
.039"
(1.00mm)
15mm
x
15mm
B6-225-2727-150

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.025"
(0.635mm)
225 15 x 15
Full Array
.059"
(1.50mm)
27mm
x
27mm
B4-256-1717-100

Pkg. of 10   US $69.50 
.004"
(0.102mm)
.020"
(0.508mm)
256 16 x 16
Full Array
.039"
(1.00mm)
17mm
x
17mm
B8-256-2121-127

Pkg. of 10   US $69.50 
.008"
(0.203mm)
.032"
(0.813mm)
256 16 x 16
Full Array
.050"
(1.27mm)
21mm
x
21mm
B6-256-2727-127

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.025"
(0.635mm)
256 20 x 20
P4-Row
.050"
(1.27mm)
27mm
x
27mm
B6-256-1717-100

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.021"
(0.533mm)
256 16 x 16
Array
.039"
(1.00mm)
17mm
x
17mm

BGA Stencil Part No.
                 View cart

Thickness

Aperture
Ball
Count
Ball
Pattern

Pitch
Component
Body
B6-272-2727-127

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.025"
(0.635mm)
272 20 x 20
P4-Row
+4 x 4 center
.050"
(1.27mm)
27mm
x
27mm
B6-292-2727-127

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.025"
(0.635mm)
292 20 x 20
P4-Row
+6 x 6 center
.050"
(1.27mm)
27mm
x
27mm
B8-304-2125-127

Pkg. of 10   US $69.50 
.008"
(0.203mm)
.032"
(0.813mm)
304 16 x 19
Full Array
.050"
(1.27mm)
21mm
x
25mm
B4-324-2323-100

Pkg. of 10   US $69.50 
.004"
(0.102mm)
.020"
(0.508mm)
324 22 x 22
P4-Row
+6 x 6 center
.039"
(1.00mm)
23mm
x
23mm
B6-352-3535-127

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.025"
(0.635mm)
352 26 x 26
P4-Row
.050"
(1.27mm)
35mm
x
35mm
B6-357-2525-127

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.025"
(0.635mm)
357 19 x 19
Full Array
.050"
(1.27mm)
25mm
x
25mm
B8-361-2525-127

Pkg. of 10   US $69.50 
.008"
(0.203mm)
.032"
(0.813mm)
361 19 x 19
Full Array
.050"
(1.27mm)
25mm
x
25mm
B6-388-3535-127

Pkg. of 10   US $69.50 
.006"
(0.152mm)
.025"
(0.635mm)
388 26 x 26
P4-Row
+6 x 6 center
.050"
(1.27mm)
35mm
x
35mm
B6-432-4040-127

Pkg. of 10   US $79.50 
.006"
(0.152mm)
.025"
(0.635mm)
432 31 x 31
P4-Row
.050"
(1.27mm)
40mm
x
40mm

BGA Stencil Part No.
                 View cart

Thickness

Aperture
Ball
Count
Ball
Pattern

Pitch
Component
Body
B4-456-2323-100

Pkg. of 10   US $79.50 
.004"
(0.102mm)
.020"
(0.508mm)
456 22 x 22
P7-Row
+6 x 6 center
.039"
(1.00mm)
23mm
x
23mm
B4-484-2323-100

Pkg. of 10   US $79.50 
.004"
(0.102mm)
.020"
(0.508mm)
484 22 x 22
Full Array
.039"
(1.00mm)
23mm
x
23mm
B6-560-4242-127

Pkg. of 10   US $79.50 
.006"
(0.152mm)
.025"
(0.635mm)
560 33 x 33
P5-Row
.050"
(1.27mm)
42.5mm
x
42.5mm
B8-625-3232-127

Pkg. of 10   US $89.50 
.008"
(0.203mm)
.032"
(0.813mm)
625 25 x 25
Full Array
.050"
(1.27mm)
32.5mm
x
32.5mm
B4-672-2727-100

Pkg. of 10   US $89.50 
.004"
(0.102mm)
.020"
(0.508mm)
672 26 x 26
Full Array
.039"
(1.00mm)
27mm
x
27mm
B4-676-2727-100

Pkg. of 10   US $89.50 
.006"
(0.152mm)
.024"
(0.610mm)
676 26 x 26
Full Array
.039"
(1.00mm)
27mm
x
27mm
B6-676-2727-100

Pkg. of 10   US $89.50 
.006"
(0.152mm)
.024"
(0.610mm)
676 26 x 26
Array
.039"
(1.00mm)
27mm
x
27mm
B4-780-2929-100

Pkg. of 10   US $89.50 
.004"
(0.102mm)
.020"
(0.508mm)
780 28 x 28
Array
.039"
(1.00mm)
29mm
x
29mm
B4-783-2929-100

Pkg. of 10   US $89.50 
.004"
(0.102mm)
.020"
(0.508mm)
783 28 x 28
Array
.039"
(1.00mm)
29mm
x
29mm
B4-1152-3535-100

Pkg. of 10 US $179.50 
.004"
(0.102mm)
.020"
(0.508mm)
1152 34 x 34
Array
.039"
(1.00mm)
35mm
x
35mm

 
How Flextac BGA Rework Stencils Work View cart

Select BGA stencil
1. Select BGA stencil

   Step 1

Select the proper BGA stencil size and fold up the side tabs. The side tabs prevent overspill of solder paste onto the circuit board surface.
Peel cover film from BGA stencil
2. Peel cover film from BGA stencil

   Step 2

Peel off the cover film from the BGA stencil exposing the adhesive backing. This tape-like adhesive holds the stencil in place and seals around each BGA pad to prevent solder paste bleed.
Place BGA stencil
3. Place BGA stencil

   Step 3

Place BGA stencil in position using the handy side tabs. Once in place the adhesive back will prevent movement.
Apply paste to BGA stencil
4. Apply paste to BGA stencil

   Step 4

Apply paste to BGA stencil using a standard metal squeegee. You can make several passes with the squeegee to ensure paste is fully deposited in each opening.
Remove BGA stencil
5. Remove BGA stencil

   Step 5

Remove the BGA stencil and save for another reuse or dispose. You're now ready to place a new BGA component.





ELAB (Engineering Lab)    Phone: 1-519-651-3060    Ships From: Haverhill, MA 01835 USA

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