Circuit Board Repair and Rework Guide > 9.0 BGA Component Rework Procedures

9.0 BGA Component Rework Procedures

This section includes procedures for removing and replacing BGA components.


		9.1.1 BGA Component Rework Process Flow Covers general process flow for BGA component rework.


		9.1.2 BGA Component Rework Inspection Covers general inspection methods for BGA components.


		9.2.1 BGA Component Rework Profile Development, Standard Method Development of rework profile using standard method.


		9.2.2 BGA Component Rework Profile Development, Smart Track Method Development of rework profile using Smart Track Method.


		9.3.1 BGA Component Rework, Eutectic Solder Ball Hot gas method for eutectic solder ball BGA rework.


		9.4.1 BGA Component Reballing, Fixture Method Method for reballing BGA components using replacement balls and special fixture.

Related Items
Circuit Board Repair and Rework Products