Circuit Board Repair Guide > BGA Component Rework Procedures > 9.1.2 Inspection Methods for BGA Components

Inspection Methods for BGA Components

Repair Circuit Boards | Repair SMT Pads | Repair BGA Pads | Repair Lands | Repair Edge Contacts
Repair a Conductor | Plated Hole Repair | Base Board Repair | Replace Solder Mask or Coatings

Covers general inspection methods for BGA components.

Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
 
Man working at BGA rework station
Ball Grid Array Rework Station

Printed Board Type: R/F/C  |  Skill Level: Advanced  |  Conformance Level: High  |  Revision: Pending  |  Revision Date: N/A

Introduction
This document has been prepared by Circuit Technology Center, Inc.. The purpose is to ensure repeatable, high quality rework of BGA components, and to assure conformity to the highest industry standards and specifications.

Note
This document covers procedure and guidelines specific to BGA component rework conducted by the staff at Circuit Technology Center, Inc. Organizations using this information may need to make modifications, or other changes, to accommodate their own particular needs.

Note
This document is under development. Refer to available industry sources including recommendations from IPC while this document is being developed.




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