Intro to SMT Assembly: Training Manufacturing Personnel
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The effectiveness of production manufacturing personnel is key to our success. Until now, there has not been a publication written for use in training the production personnel that we hire to assemble SMT products. It is the first book to break down technical terms so they can be understood by non-technical personnel. This publication, written by two of the industry's leading experts, does an excellent job informing them about what is required to do SMT and proves to be a valuable reference book. It has proven to improve efficiency and contribution. Building SMT products is significantly different from leaded technology products. Included is information in straight forward terms on SMT components, process changes, steps in handling and building SMT and mixed assemblies. The standards that we use are explained, plus information on inspection, techniques, soldering and fixing the assemblies. Training personnel? This is the publication for you! Table of Contents. |
Who will benefit
This book will be of immense value to those new to production assembly, process engineering, equipment maintenance, and troubleshooting SMT processes.
Table of Contents
Foreword |
Chapter 1 Intro to Assembly of Electronic Products
1.0 Introduction
1.1 State what an assembly is.
1.2 State the goals of a company building electronic assemblies.
1.3 State the documentation used for the assembly processes.
1.4 Describe through-hole parts.
1.5 Describe SMT parts.
1.6 State the basics of how assemblies are built.
1.7 Describe the two different types of assembly methods.
1.8 List the steps in the production process.
1.9 Describe printing.
1.10 Describe pick and place.
1.11 Describe reflow.
1.12 Describe cleaning.
1.13 Describe what manual insertion means.
1.14 Describe wave soldering.
1.15 State when hand soldering is used.
1.16 Describe test.
1.17 Describe flying probe test.
1.18 Describe in-circuit test.
1.19 Describe functional test.
1.20 Describe inspection and how it is performed.
1.21 Describe repair rework.
1.22 Describe what final assembly means.
1.23 State how to determine if an assembly should be a reject.
1.24 List some key things to know when handling assemblies.
Chapter 2 Solder Paste Basics
2.1 Introduction
2.2 Why is solder paste used
2.3 How is solder paste changed into solder
2.4 What is solder paste
2.5 What are solder particles
2.6 What size are the particles
2.7 What does mesh mean
2.8 What are the most common particle sizes
2.9 Why not use smaller particle sizes
2.10 What is the metal content of solder
2.11 What are solder particles made of
2.12 Why are alloys used
2.13 What does the term stencil life mean for paste
2.14 What is tack time
2.15 What is flux
2.16 What types of flux are used in solder paste
2.17 What are activators
2.18 What is the ANSI/IPC-SF-818 spec
2.19 What does RMA, SA mean
2.20 Why use water-soluble flux
2.21 Why use no-clean flux
2.22 What does the solvent in solder paste do
2.23 What is slump
2.24 In what containers do you buy solder paste
2.25 Should solder paste be stored in a refrigerator
2.26 What should be done when solder paste is removed from a refrigerator
2.27 How much moisture in solder paste can be tolerated
2.28 What happens if jars are left open
2.29 Should old paste be put into jars
2.30 What is preheating
2.31 What is dwell or soak time
2.32 What is the peak temperature
2.33 What does a supplier's reflow profile look like
2.34 What is lead free solder
Chapter 3 Stencil Basics
3.0 Introduction
3.1 What are stencils
3.2 What are land patterns
3.3 What kind of components are stencils used for
3.4 What are the workmanship standards
3.5 Are there standards about the alignment of paste
3.6 Does the workmanship standards state how much solder paste must be
printed
3.7 What is a stencil aperture
3.8 How thick are stencils
3.9 What is the stencil aperture ratio
3.10 How is the volume of an aperture calculated
3.11 How much solder paste is enough
3.12 What is the minimum size aperture for the chip component
3.13 How does the stencil fabricator know which stencil apertures to reduce
3.14 What is stencil misalignment
3.15 When are apertures increased in size
3.16 What are the different types of stencils
3.17 What are laser cut stencils
3.18 What are additive stencils
3.19 Describe the print area on a stencil
3.20 Describe what a stencil frame is
3.21 Describe what the mesh is for a stencil
3.22 Describe micro stencils
3.23 Describe universal frames
3.24 Describe what fiducials are
3.25 What do need to know to order stencils
3.26 State when stencils should be replaced
3.27 How should stencils be stored
3.28 Cleaning stencils
3.29 What are the most common problems with stencils
Chapter 4 Printing
4.0 Introduction
4.1 What is printing
4.2 What is the difference between batch and inline systems
4.3 Who are four of the major print system manufacturers
4.4 What are some common problems before printing
4.5 What are the steps before printing can begin
4.6 How are boards run through print systems
4.7 What are pallets
4.8 What is universal tooling
4.9 What is the clearance requirement for boards on a rail
4.10 What is the range for rail width
4.11 How are boards held in position on rails
4.12 How do edge or foil-less clamps work
4.13 How are boards supported during printing
4.14 What is a dedicated fixture
4.15 How is vacuum used to hold boards
4.16 How do you attach a stencil
4.17 What size boards can be printed
4.18 What size are frames
4.19 What is planarity
4.20 How do you test for planarity
4.21 How do you set up a stencil X-Y axis and theta rotation
4.22 What are fiducials
4.23 How does a print system read fiducials
4.24 What are the problems reading fiducials
4.25 How can solder paste be printed
4.26 What is a print head
4.27 What are the two types of blades
4.28 Are there different types of stainless steel blades
4.29 How can stainless steel blades be damaged
4.30 What are some of the problems with using polymer blades
4.31 What is scavenging
4.32 What is important to know in setting up blades
4.33 How do you determine the correct blade width
4.34 What is the correct pressure for a blade
4.35 What is the correct angle for the blade
4.36 What is a solder roll
4.37 What is a single and double print
4.38 What determines the print speed
4.39 What is print misalignment
4.40 When is cleaning and reprinting required
4.41 What is smearing
4.42 How do you clean a smeared stencil
4.43 What is AOI
4.44 What do you need to check for on first samples
4.45 How can you perform a print test on the first samples
4.46 How do you select locations to measure solder paste
4.47 How do you measure the solder paste thickness
4.48 How do you measure slump
4.49 How often should boards be measured
4.50 What is important about the printer environment
4.51 What does stencil life mean
4.52 What is tack time
4.53 When and how do you add new paste
4.54 Is nitrogen required
4.55 What do you do with used stencils
4.56 What is operator awareness
Chapter 5 Reflow Profiles
5.0 Introduction
5.1 What is reflow
5.2 What are the different ways that heat can be generated
5.3 What is infrared
5.4 What is infrared reflow
5.5 What is the equation for transferring infrared heat
5.6 What is new for infrared reflow
5.7 What are the disadvantages of infrared reflow
5.8 What is convection reflow
5.9 What are zones in a oven
5.10 What is the equation for heat transfer for convection reflow
5.11 What are the advantages and disadvantages for convection reflow
5.12 What is vapor phase
5.13 What are the advantages and disadvantages to vapor phase
5.14 What is conductive heating
5.15 What are the advantages and disadvantages for conductive reflow
5.16 How are boards transported through a reflow system
5.17 What is bottom side heating
5.18 What is topside heating
5.19 What are the stages of a reflow profile
5.20 What happens in preheat stage
5.21 What is the purpose of the soak stage
5.22 What happens in reflow (spike) stage
5.23 What is the correct peak temperature during reflow
5.24 What happens in cooling stage
5.25 What is a RTR Profile
5.26 What are the advantages of the RTR Profile
5.27 What affect does conveyor speed have on the thermal profile
5.28 What is a thermal profile
5.29 When is thermal profiling performed
5.30 Where does the reflow profile come from
5.31 What are the profile control limits for components
5.32 What are the profile control limits
5.33 What effects does spacing between boards have
5.34 What defects are caused by profiles
5.35 State what solder balling is and how to fix it
5.36 State what wetting is and how to fix it
5.37 State what deficient solder is and how to fix it
5.38 State what tombstoning is and how to fix it
5.39 State what voids are and how to fix them
5.40 State what dull and grainy solder connections are and how to fix
them
5.41 What causes cracked capacitors
5.42 State what prevents solder from wetting to leads
5.43 State what charred residue is and how to fix it
5.44 How does board density affect a profile
5.45 How do package types affect profiles
5.46 What are the ways for running profiles
5.47 What are the steps for manual profiling
5.48 What are thermocouples
5.49 Where do thermocouples go
5.50 How does the thermocouple attach
5.51 How does a manual profiler work
5.52 What are internal profile systems
5.53 What effect does nitrogen have on reflow
5.54 How should the profile be documented
Author: James C. Blankenhorn
Date Printed: July, 2001
ISBN: 1-882812-38-7
Pages: full color 127 pages 8.5" x 11" |
Author: James C. Blankenhorn
James C. Blankenhorn is President and founder (1985) of SMT Plus Inc., located in Scotts Valley, California. His experience in SMT began as Vice President of Design and Prototyping for AWI, the first SMT subcontract design and assembly firm for SMT from 1983-1985. His work established many of the design guidelines and processes used in the SMT industry today. Mr. Blankenhorn sold the design and assembly operations to and was General Manager and Vice President of Design for Jabil Circuit from 1988-1991, setting up multiple design centers and managing prototype assembly. Mr. Blankenhorn returned to SMT Plus to direct its activities. Having identified the growing needs of industry for education, SMT Plus has emerged since 1996 as a leader in the production of advanced multimedia technical training products and development tools for the SMT and telecommunications industries. Prior to his involvement with SMT, Mr. Blankenhorn was a MOS designer for Motorola and TI and product line manager for memory and microprocessors for Honeywell for 8 years. For 3 years thereafter he was involved in startups in IC packaging, test and burn-in as General Manager for Test International and Vice President of Sales for IC Link.
Mr. Blankenhorn is an active member of the SMTA, a co-founder of the SMTA in 1984, recipient of the 1996 Founders Award for Distinguished Service, and served twice as technical chairman for the Silicon Valley SMTA chapter. He is a speaker at conferences worldwide and has authored over twenty books on SMT design, packaging, and processing. He holds a BSEE degree from Arizona State University and is listed in Who's Who in America.
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