Circuit Board Repair Guide > Basic Circuit Board Repair Procedures

Chapter 2 - Basic Circuit Board Repair Procedures

The basic circuit board repair procedures chapter covers handling, cleaning, coatings, legend, and use of epoxies.


		CTC 2.1 Handling Electronic Assemblies This section covers the proper methods for handling printed circuit boards and printed circuit board assemblies.


		CTC 2.2.1 Cleaning, Local This section covers the cleaning methods for printed circuit boards and printed circuit board assemblies.


		CTC 2.2.2 Cleaning, Aqueous Batch Process This section outlines a batch cleaning process for removal of small volumes of fluxes and other contaminants that may contact printed circuit boards during circuit board repair and rework operations.


		CTC 2.3.1 Coating Removal, Identification of Coating This section covers the techniques for identifying various circuit board coatings so the appropriate coating removal procedure can be used.


		CTC 2.3.2 Coating Removal, Solvent Method This coating removal method which uses a solvent to remove surface coatings can be used for spot or overall coating removal of conformal coatings or solder resists.


		CTC 2.3.3 Coating Removal, Peeling Method This coating removal method can be used only under special circumstances. Normally the peeling method is used to remove RTV silicone or other thick rubbery-like coating materials.


		CTC 2.3.4 Coating Removal, Thermal Method This procedure for coating removal uses a controlled, low temperature, localized heating method for removing thick coatings by an overcuring or softening means.


		CTC 2.3.5 Coating Removal, Grinding/Scraping Method This coating removal procedure covers the use of various grinding and scraping tools to remove coatings.


		CTC 2.3.6 Coating Removal, Micro Blasting Method This method of coating removal uses a micro abrasive blasting system and a very fine soft abrasive powder.


		CTC 2.4.1 Coating Replacement, Solder Mask This procedure is used to replace solder mask or coatings on printed circuit boards.


		CTC 2.4.2 Coating Replacement, Conformal Coating, Encapsulant This coating replacement procedure is used to replace conformal coatings and encapsulants on printed circuit boards.


		CTC 2.4.3 Coating Replacement, Solder Mask, BGA Locations This coating replacement procedure is used to replace solder mask or coatings on printed circuit boards at BGA locations.


		CTC 2.5 Baking and Preheating This section covers baking and preheating of printed circuit boards and printed circuit board assemblies to prepare the product for subsequent operations.


		CTC 2.6.1 Legend Marking, Stamping Method The stamping method can be used to add, change or replace legend and markings on printed circuit boards or printed circuit board assemblies. This procedure uses epoxy ink and an ink stamp to place the legends on the printed circuit board surface in much the same manner as taking a "finger print".


		CTC 2.6.2 Legend Marking, Hand Lettering Method The hand lettering method can be used to add, change or replace legend and markings on printed circuit boards or printed circuit board assemblies. This procedure uses epoxy ink and a pen to hand letter the legends on the printed circuit board surface.


		CTC 2.6.3 Legend Marking, Stencil Method The stencil method can be used to add, change or replace legend and markings on printed circuit boards or printed circuit board assemblies. This procedure uses epoxy ink and a brush or roller technique. A stencil is used to outline the characters.


		CTC 2.7 Epoxy Mixing and Handling This section covers epoxy mixing and handling. The epoxy used in this procedure has multiple uses including solder mask repair, base board repair, circuitry over-coating and delamination repair.