Circuit Board Repair and Rework Guide > 2.0 Basic Procedures

2.0 Basic Procedures

This section covers handling, cleaning, coatings, legend, and use of epoxies.


		2.1 Handling Electronic Assemblies Procedure covers the proper methods for handling circuit boards.


		2.2.1 Cleaning, Local Procedure outlines bench top hand cleaning.


		2.2.2 Cleaning, Aqueous Batch Process Procedure outlines water based batch cleaning.


		2.3.1 Coating Removal, Identification of Coating Procedure covers techniques for identifying various coatings and recommended coating removal methods.


		2.3.2 Coating Removal, Solvent Method Procedure uses solvent for spot removal of solder mask and surface coatings.


		2.3.3 Coating Removal, Peeling Method Procedure normally used to remove RTV silicone or other thick rubbery-like coatings.


		2.3.4 Coating Removal, Thermal Method Procedure uses a controlled, low temperature heating method to remove thick coatings.


		2.3.5 Coating Removal, Grinding / Scraping Method Procedure uses various grinding and scraping tools to remove coatings.


		2.3.6 Coating Removal, Micro Blasting Method Procedure uses a micro abrasive blasting system with fine abrasive powder to remove coatings.


		2.4.1 Coating Replacement, Solder Mask This method is used to replace solder mask or coatings on circuit boards.


		2.4.2 Coating Replacement, Conformal Coating, Encapsulant This method is used to replace conformal coatings and encapsulants on circuit boards.


		2.4.3 Coating Replacement, Solder Mask, BGA Locations This method is used to replace solder mask or coatings on circuit boards at BGA locations.


		2.5 Baking and Preheating Procedure covers baking and preheating of circuit boards to prepare them for the subsequent operations.


		2.6.1 Legend Marking, Stamping Method This method can be used to add, change or replace legend and markings on printed boards or printed board assemblies.


		2.6.2 Legend Marking, Hand Lettering Method This method uses epoxy ink and a pen to hand letter the legends on the printed board surface.


		2.6.3 Legend Marking, Stencil Method This method uses epoxy ink and a brush or roller technique. A stencil is used to outline the characters.


		2.7 Epoxy Mixing and Handling Procedure covers epoxy mixing and handling for various repair and rework requirements.

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