3.0 Base Board Procedures

This section covers repair of delamination, warp, key slots, non plated holes, surface defects, and various defects to base board material.


		3.1 Delamination / Blister Repair, Injection Method Procedure covers repair of mechanical or thermal blisters in circuit board base materials.


		3.2 Bow and Twist Repair Procedure is used to eliminate, or reduce the bow and twist, or warping of circuit boards.


		3.3.1 Hole Repair, Epoxy Method Procedure to repair minor damage to non-plated holes.


		3.3.2 Hole Repair, Transplant Method Procedure to repair major damage to non-plated holes.


		3.4.1 Key and Slot Repair, Epoxy Method Procedure to repair minor damage to key and slot openings.


		3.4.2 Key and Slot Repair, Transplant Method Procedure to repair major damage to key and slot openings.


		3.5.1 Base Material Repair, Epoxy Method Procedure to repair minor damage to base board surface.


		3.5.2 Base Material Repair, Area Transplant Method Procedure to repair major damage to base board areas.


		3.5.3 Base Material Repair, Edge Transplant Method Procedure used to repair broken corners and edge damage using tongue and groove technique.

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