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Proper Methods for Handling Electronic Assemblies
This section covers the proper methods for handling electronic assemblies.
Electrostatic Discharge (ESD)
Certain components used in electronic assemblies are sensitive to static electricity and can be damaged by its discharge. Static charges are created when non-conductive materials are separated, such as when plastic bags are picked up or opened, when friction occurs between articles of synthetic clothing, when plastic tapes are dispensed and many other causes.
Destructive static charges are induced on nearby conductors, such as human skin, and delivered in the form of sparks passing between conductors, such as when the surface of printed board assembly is touched by a person having a static charge potential. If touched at the right solder joint or conductive pattern, the circuit board assembly can be damaged as the discharge passes through the conductive pattern to a static sensitive component. It is important to note that usually the static damage level for components cannot be felt by humans. (Less than 3,000 volts.)
Electrical Overstress (EOS)
Electrical overstress damage can be caused by generation of unwanted energy; such as spikes, occurring within soldering irons, solder extractors, testing instruments and other electrically operated equipment. This equipment must be designed as to prevent unwanted electrical discharges.
ESD/EOS Safe Work Areas
The purpose of an ESD/EOS safe work area is to prevent damage to sensitive components from spikes and static discharges. These areas must be designed and maintained to prevent ESD/EOS damage.
Handling and Storage Methods
Printed Board Type: R/F/W/C | Skill Level: Intermediate | Conformance Level: High | Rev.: E | Rev. Date: Mar 27, 2001
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2.1 Handling Electronic Assemblies